Heatsink maxiGRIP 23 x 23 x 19.5 mm for TE0803

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BGA Heat Sink - High Performance, maxiFLOW/maxiGRIP-Low Profile Heat Sink Type: maxiFLOW Heat... more
Product information "Heatsink maxiGRIP 23 x 23 x 19.5 mm for TE0803"

BGA Heat Sink - High Performance, maxiFLOW/maxiGRIP-Low Profile

Heat Sink Type: maxiFLOW
Heat Sink Attachment: maxiGRIP

The heat sink maxiGRIP has been specially modified for the TE0803 module.

Features

  • maxiFLOW™ design features a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling
  • maxiGRIP™ attachment applies steady, even pressure to the component and does not require holes in the PCB
  • Meets Telcordia GR-63-Core Office Vibration; ETSI 300 019 Transportation Vibration; and MIL-STD-810 Shock and Unpackaged Drop

Testing standards

  • Comes preassembled with high performance, phase changing, thermal interface material
  • Designed for low profile components from 1.5 to 2.99 mm

Thermal Performance

Product Detail

Dimension A: 23.00 mm

Dimension B: 23.00 mm

Dimension C: 19.50 mm

Dimension D: 41.5 mm

TIM: T766

Finish: Black-Anodized

  • Dimension A and B refer to component size.
  • Dimension C is the heat sink height from the bottom of the base to the top of the fin field.
  • Thermal performance data are provided for reference only. Actual performance may vary by
    application.
  • ATS certifies that this heat sink assembly is RoHS-6 and REACH compliant.

Manufacturer: ATS Advanced Thermal Solutions, Inc.

Manufacturer's article number: ATS Part#: ATS-51230R-C1-R0 

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