Heat Sink for MPSoC Module TE0808 Revision 4

Heat Sink for MPSoC Module TE0808 Revision 4
€24.00 (27.84 € gross) *

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Powerful precision heat sinks with modified clamp mounting for BGA chipsets. Excellent... more
Product information "Heat Sink for MPSoC Module TE0808 Revision 4"

Powerful precision heat sinks with modified clamp mounting for BGA chipsets.

Excellent performance with natural convection and low to medium air consumption with low pressure drop.

Features

  • AL6063, 201 W/m K thermal conductivity
  • Attached with plastic bracket
  • Length: 31 mm
  • Width: 31 mm
  • Height: 15 mm
  • Manufacturer: Malico
  • Manufacturer's part number MBH31001-15W/2.6

Package Content

  • 1 x heat sink as described, with modified clip for exact fit on the TE0808 (Revision 04)
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