MPSoC module TE0803 ZU03EG with pre-assembled heatsink on a TEBF0808 baseboard in a Core V1 Mini-ITX enclosure + accessories

Samtec Razor Beam low profile (1 mm) slim socket strips, Xilinx Zynq UltraScale+ XCZU4EV-1SFVC784E, 4 GByte DDR4, 128 MByte QSPI Boot Flash, size: 5.2 x 7.6 cm

Xilinx Zynq UltraScale+ XCZU4EV-1SFVC784E, 2 GByte DDR4, 128 MByte QSPI Boot Flash, size: 5.2 x 7.6 cm

Xilinx Zynq UltraScale+ XCZU4EG-1SFVC784E, 2 GByte DDR4, 128 MByte QSPI Boot Flash, size: 5.2 x 7.6 cm

Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 4 GByte e.MMC, size: 4 x 5 cm

Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 4 GByte e.MMC, size: 4 x 5 cm

Xilinx Zynq UltraScale+ XCZU3CG-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 4 GByte e.MMC, size: 4 x 5 cm

Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 4 GByte e.MMC, size: 4 x 5 cm

Xilinx Zynq UltraScale+ XCZU4CG-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 4 GByte e.MMC, size: 4 x 5 cm

MPSoC with integrated Xilinx Zynq UltraScale+ XCZU6EG-1FFVC900E and mounted heat spreader; 4 GByte DDR4 SDRAM; size: 5,2 x 7,6 cm

Xilinx Zynq UltraScale+ XCZU09EG-1FFVC900E, 52 x 76 mm form factor, 4 GByte DDR4 SDRAM, 128 MByte SPI Boot Flash, 20 x high speed serial transceiver

Xilinx Zynq UltraScale+ XCZU15EG-1FFVC900E, 52 x 76 mm form factor, 4 GByte DDR4 SDRAM, 128 MByte SPI Boot Flash, 20 x serial transceiver

Low Profile connectors (2.5 mm), Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 4 GByte e.MMC, size: 4 x 5 cm

CompactPCI Serial card, Xilinx Zynq UltraScale+ MPSoC, DDR4 SDRAM SODIMM socket, dual 512 MByte Flash memory, 24 Gigabit transceivers on PL side and 4 on PS side, USB2 and USB3 FIFO bridges

Xilinx Zynq UltraScale+ XCZU5EV-1SFVC784E, 2 GByte DDR4, 128 MByte QSPI Boot Flash, Size: 5.2 x 7.6 cm

Low Profile Terminal/Socket Strips (2.5 mm), Xilinx Kintex UltraScale XCKU040-1SFVA784I, 2 GByte DDR4, 64 MByte SPI Boot Flash, Serial transceiver: GTH 8 lanes

Xilinx Zynq UltraScale+ XCZU7EV-1FBVB900E; 4 GByte DDR4; 128 MByte QSPI Boot Flash; Dimension: 5,2 x 7,6 cm

Xilinx Kintex UltraScale KU40 FPGA XCKU040-1SFVA784I, 1 GByte DDR4, 64 MByte SPI Boot Flash, serial transceiver: GTH 8 lanes

Xilinx Kintex UltraScale KU35 FPGA XCKU040-1SFVA784C, 2 GByte DDR4 SDRAM, 64 MByte SPI Boot Flash, serial transceiver GTH 8 lanes

The ZCU104 Evaluation Kit enables developers to get started with embedded vision applications such as monitoring, Advanced Driver Assisted Systems (ADAS), Machine Vision, Augmented Reality (AR), drones and medical imaging.

Xilinx Zynq UltraScale+XCZU4EV-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 4 GByte e.MMC, size: 4 x 5 cm

MPSoC with integrated Xilinx Zynq UltraScale+ XCZU6EG-1FFVC900E; 4 GByte DDR4 SDRAM; 128 MByte Flash memory; 52 x 76 mm form factor; 20 high speed serial transceivers

Xilinx Kintex UltraScale KU35 FPGA XCKU035-1SFVA784C, 2 GByte 16-Bit width DDR4, 64 MByte SPI Boot Flash, serial transceiver: GTH 8 lanes

Xilinx Kintex UltraScale KU40 FPGA XCKU040-1SFVA784I, 2 GByte DDR4, 64 MByte SPI Boot Flash, Serial transceiver: GTH 8 lanes

Xilinx Zynq UltraScale+ XCZU15EG-1FFVC900E, 52 x 76 mm form factor, 4 GByte DDR4 SDRAM, 128 MByte SPI Boot Flash, 20 x serial transceiver

Xilinx Kintex UltraScale KU035 FPGA XCKU035-1SFVA784I, 2 GByte DDR4, 64 MByte SPI Boot Flash, serial transceiver: GTH 8 lanes

Xilinx Kintex UltraScale KU035 FPGA XCKU035-2SFVA784I, 2 GByte DDR4, 64 MByte SPI Boot Flash, serial transceiver: GTH 8 lanes

MPSoC module TE0808 ZU9EG with pre-assembled heatsink on a TEBF0808 baseboard in a Core V1 Mini-ITX enclosure plus accesssories.

Xilinx Zynq UltraScale+ XCZU9EG-2FFVC900I, 52 x 76 mm form factor, 4 GByte DDR4 SDRAM, 128 MByte SPI Boot Flash, 20 x serial transceiver

Xilinx Zynq UltraScale+ XCZU9EG-1FFVC900E, 4 GByte DDR4 SDRAM, 128 MByte SPI Boot Flash, 20 x high speed serial transceiver

Low Profile Terminal/Socket Strips (1 mm), Xilinx Zynq UltraScale+ XCZU9EG-1FFVC900E, 4 GByte DDR4 SDRAM, 128 MByte SPI Boot Flash, 20 x high speed serial transceiver

TE0808 MPSoC module with ZU9EG plus heatsink on a TEBF0808 carrier board in a Core Mini-ITX Enclosure. Accessories included.

Xilinx Zynq UltraScale+ XCZU3CG-1SFVC784E, 2 GByte DDR4, 128 MByte QSPI Boot Flash, Dimension: 5.2 x 7.6 cm

The ZCU102 Evaluation Kit enables designers to jumpstart designs for Automotive, Industrial, Video and Communications applications.

The Virtex UltraScale FPGA VCU108 Evaluation Kit is the perfect development environment for evaluating the unprecedented levels of performance, system integration and bandwidth provided by Virtex UltraScale devices.

The Virtex UltraScale FPGA VCU110 Development Kit is the perfect development environment for evaluating the unprecedented levels of performance, system integration and bandwidth provided by Virtex UltraScale devices.

The Xilinx Kintex UltraScale Development Kit provides a complete development platform for designing and verifying applications based on the Xilinx Kintex UltraScale All Programmable FPGA devices.

The Kintex UltraScale FPGA KCU105 Evaluation Kit is the perfect development environment for evaluating the cutting edge Kintex UltraScale All Programmable FPGAs.