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Spartan-3 FPGA XC3S1000-4FTG256C 1000K Micromodule + SDRAM

€299.00 *

Prices plus VAT plus shipping costs

Ready to ship today,
Delivery time appr. 1-3 workdays

  • TE0146-00
  • 2
Quantity Unit price
To 9 €299.00 *
From 10 €269.10 *
From 25 €254.15 *
From 50 €239.20 *
From 100 €224.25 *
From 250 €209.30 *
From 500 €194.35 *
From 1000 €179.40 *
Powerful Micromodule contains Spartan-3 FPGA and USB 2.0 Transceiver and 64MB SDRAM The FPGA... more
Product information "Spartan-3 FPGA XC3S1000-4FTG256C 1000K Micromodule + SDRAM"

Powerful Micromodule contains Spartan-3 FPGA and USB 2.0 Transceiver and 64MB SDRAM

The FPGA Micromodule integrates a leading-edge Spartan-III 1000k gates FPGA, an USB2.0 transceiver, configuration Flash and power supply on a tiny footprint. A large number of I/Os are provided via a B2B mini-connector.

Thus, the Micromodule is ideally suited for battery-powered and small-sized applications.

Key Features

  • Xilinx Spartan-3 FPGA XC3S1000-4FTG256C
  • Xilinx Platform Flash XCF04 for in-system configuration
  • MT48LC2M32B2P-7 64MB SDRAM
  • Power supply input via USB, or from a carrier board
  • 55 I/Os available on B2B connectors
  • 1 x LED
  • Programming is implemented via JTAG. (The required adaptor is not included)
  • 50,7mm x 43,6mm

 Package Content

  • 1 x TE0146-00 Trenz Electronic Micromodule

Available for download

  • Manual
  • Product Brief
  • Application Notes
  • Demo Project Files
  • Schematics and Placeplan
  • CAD Library Files
  • Data sheets of major components

Accessoires

  • TE-0143 Prototyping Carrier Board
    Note: The header baseboard is suited to power the module, and to gain access to the B2B Signals. The JTAG headers on the baseboard are without function.
  • 24264 - B2B female connector for Carrier Board TE0143 1.4 mm (needed 1x)

 Additional Information

All modules produced by Trenz Electronic are developed and manufactured in Germany.

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