FPGA Module with Spartan-6 LX75, 02IBF, 128 MByte DDR3, Mini-USB 2.0

€220.00 (261.80 € gross) *

Prices plus VAT plus shipping costs

Possible to order, delivery time on request.

  • TE0630-02IBF
  • 0
  • 40
  • Full production
Quantity Unit price
To 9 €220.00 (261.80 € gross) *
From 10 €198.00 (235.62 € gross) *
From 25 €187.00 (222.53 € gross) *
From 50 €176.00 (209.44 € gross) *
From 100 €165.00 (196.35 € gross) *
From 250 €154.00 (183.26 € gross) *
From 500 €143.00 (170.17 € gross) *
From 1000 €132.00 (157.08 € gross) *
Description Downloads Resources
This product is not always in stock, but will be produced on customer order (on demand).... more
Product information "FPGA Module with Spartan-6 LX75, 02IBF, 128 MByte DDR3, Mini-USB 2.0"

This product is not always in stock, but will be produced on customer order (on demand).
Please ask for any minimum quantities.

 

The predecessor of this article is TE0630-01IBF. All changes are in the Product Change Notification (PCN).

Trenz Electronic TE0630 series are industrial-grade FPGA micro-modules integrating a leading-edge Xilinx Spartan-6 FPGA, a mini-USB 2.0 device port, 1 GBit (128-MByte) DDR3 SDRAM with 16-Bit width, 8 MByte Flash memory for configuration and operation, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/Os are provided via rugged high-speed stacking connectors. TE0630 is fully mechanically and largely electrically backward compatible with Trenz Electronic TE0300 Xilinx Spartan-3E FPGA micro-modules.

All parts are at least industrial temperature range of -40°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

All this on a tiny footprint, smaller than a credit card, at the most competitive price.

Key Features

  • Xilinx Spartan-6 LX75 FPGA micro-module
  • mini-USB 2.0 high-speed device (for configuration and operation)
  • 16-Bit-wide 1 GBit (128 MByte) DDR3 SDRAM
  • 64 MBit (8 MByte) SPI Flash memory (for configuration and operation) accessible through:
    • FPGA
    • JTAG prot (SPI indirect)
    • USB
  • FPGA configuration through:
    • B2B connector
    • JTAG port
    • SPI Flash memory
  • Plug-on module with 2 × 80-pin stacking connectors
  • Up to 40 differential and up to 109 single-ended FPGA I/O pins available on B2B connectors
  • 1.2 V, 1.5 V, 2.5 V = VCCAUX and 3.3 V power rails
  • 24 MHz and 100 MHz reference clock signals
  • eFUSE bit-stream encryption (LX75 or larger)
  • 4 user LEDs
  • 1 user push-button
  • 2 user DIP switches
  • Evenly-spread supply pins for good signal integrity

Specifications

  • Xilinx Spartan-6 LX FPGA:
    XC6SLX75-3CSG484I = 75 k logic cells, industrial grade
  • Cypress CY7C68013A-56LFXC EZ-USB FX2LP:
    USB microcontroller, high speed USB peripheral controller
  • 16-bit-wide (data-bus) 1 gigabit (128 megabyte) DDR3 SDRAM
  • 64 Megabit (8 Megabyte) serial Flash memory with dual/quad SPI interface
  • 2 x fine-pitch (0.5 mm) 80-pin board-to-board connectors
    Hirose DF17 series
  • Up to 40 differential FPGA input/output pins available on B2B connectors
  • Up to 109 single-ended FPGA input/output pins available on B2B connectors
  • USB and JTAG pins available on B2B connectors
  • 4.0 A high-efficiency DC-DC switching regulator for power rail 1.2 V
  • 3.0 A high-efficiency DC-DC switching regulator for power rail 1.5 V
  • 0.8 A DC-DC linear regulator for power rails 2.5 V and VCCAUX
  • 3.0 A high-efficiency DC-DC switching regulator for power rail 3.3 V
  • Power supervisory circuits with power-fail
  • Power supply voltage range: 4.0 to 5.5 V
  • Power supply source: USB port, board-to-board interconnect (e.g. carrier board)
  • Dimensions: 47.5 × 40.5 mm (19.2 cm2)
  • Minimum height: TBD (without connectors)
  • Minimum height on carrier board: TBD
  • Weight: 14.0 to 14.5 g
  • Temperature grades
    • commercial (C-type FPGA device)
    • industrial (I-type FPGA device)

Other assembly options for cost or performance optimization plus high volume prices available on request.

Recommended Software

for Trenz Electronic modules with Spartan-3A, -3E and Spartan-6 LX45/LX75

ISE Design Suite: WebPACK Edition

ISE WebPACK delivers a complete, front-to-back design flow providing instant access to the ISE features and functionality at no cost.

https://www.xilinx.com/products/design-tools/ise-design-suite/ise-webpack.html

Development Support

There is a base board available for this module.

Latest documentation, design support files and reference designs with source files are available for download free of charge.

Scope of Delivery

  •  1 x TE0630-02IBF Trenz Electronic FPGA module with Xilinx Spartan-6 LX75 FPGA

Additional Information

All modules produced by Trenz Electronic are developed and manufactured in Germany.

Related links to "FPGA Module with Spartan-6 LX75, 02IBF, 128 MByte DDR3, Mini-USB 2.0"
Downloads
Digilent
OHO-Elektronik
SunDance
Trenz_Electronic - Documents and Design files for Trenz Electronic Products