TE0703 - Carrier board for Trenz Electronic modules with 4 x 5 cm form factor

€99.00 (117.81 € gross) *

Prices plus VAT plus shipping costs

expected to be available on 25-Oct-2019

  • TE0703-06
  • 0
Quantity Unit price
To 9 €99.00 (117.81 € gross) *
From 10 €89.10 (106.03 € gross) *
From 25 €87.12 (103.67 € gross) *
From 50 €84.15 (100.14 € gross) *
From 100 €81.18 (96.60 € gross) *
From 250 €79.20 (94.25 € gross) *
From 500 €74.25 (88.36 € gross) *
From 1000 €69.30 (82.47 € gross) *
From 5000 €69.30 (82.47 € gross) *
Description Downloads Resources
This article is the replacement for the TE0703-05. All changes caused by the new revision are... more
Product information "TE0703 - Carrier board for Trenz Electronic modules with 4 x 5 cm form factor"

This article is the replacement for the TE0703-05. All changes caused by the new revision are included in the Product Change Notification (PCN).

The Trenz Electronic TE0703 Carrier Board is a base-board for 4 x 5 SoMs, which exposes the MIO- and the PS/PL-pins of the SoM to accessible connectors and provides a whole range of on-board-components to test and evaluate Trenz Electronic 4 x 5 SoMs.

Supported functional range: Wiki Trenz Electronic 4 x 5 cm carrier boards

Notice

Do not access the FT2232H EEPROM using FTDI programming tools, doing so will erase normally invisible user EEPROM content and invalidate stored Xilinx JTAG license. Without this license the on-board JTAG will not be accessible any more with any Xilinx tools. Software tools from FTDI website do not warn or ask for confirmation before erasing user EEPROM content.

Features

  • Two VG96 backplane connectors are not soldered to the board, but they are included in the package as separate components.
  • SDIO port expander with voltage-level translation
  • Micro SD card connector - Zynq SDIO0 bootable SD port
  • 4 x User LEDs
    • D1 and D2 are connected to the carrier controller, their function depends on the firmware
    • D3 and D4 are connected to the 4 x 5 module B2B connector pins, and are directly controlled by the module
  • Mini USB connector (USB JTAG and UART interface)
  • 1 x User push button
    • Connected to "intelligent Carrier Controller (iCC)" and can be used as module reset button. Other usage possible, actual function depend on the code loaded into iCC.
  • RJ45 GbE connector
  • USB host connector
  • Barrel jack for 5V* power supply
  • 4A high efficiency power SoC DC-DC step-down converter with integrated inductor (Enpirion EN6347) for 3.3V power supply
  • Trenz 4 x 5 module socket (3 x Samtec LSHM series connectors)
  • USB JTAG and UART interface (FTDI FT2232H), compatible with Xilinx tools (also with many other tools)
  • 4 User DIP switches
    • Enable/disable update of the "intelligent Carrier Controller"
    • MIO0 (readable signal by iCC and module)
    • 2 "mode" bits

Scope of Delivery

  • 1 x TE0703-06 carrier board for Trenz Electronic modules with a form factor of 4 x 5 cm
  • 2 x VG96 socket connector vertical (DIN 41612), female, series 0903, manufacturer part no. 09032967824

Additional Information

*Changes REV06

#1  Changed micro SD card connector (J3)

Type: BOM change

Reason: Demand for industrial temperature range

Impact: Specified for industrial temperature range

#2 Changed push button (S1)

Type: BOM change

Reason: Demand for industrial temperature range

Impact: Specified for industrial temperature range

#3 Replaced input power protection

Type:  Optimization

Reason: Cost savings

Impact: None

#4 Added jumper (J11) to select SD level shifter voltage on FPGA side

Type: Schematic change

Reason: Modules have 1.8 V or 3.3 V bank power where SD signals are connected

Impact: Select SD level shifter voltage according to module specification

#5 Added power switch for SD level shifter supply voltages

Type: Schematic change

Reason: Ensure power sequenzing of level shifter

Impact: Power sequenzing respected under any circumstances

#6 Replaced R5 by 1 kOhm and VBUS capacitors by 4.7 µF, add 0 Ohm resistors to OTG-ID net

Type: BOM change

Reason: Ensure USB-OTG compability

Impact: Board compatible to new version with microUSB connector and OTG capability

#7 Replaced jumpers by SMD versions, moved VBAT to other position

Type: Layout change

Reason: Optimize production cost

Impact: None

#8 Routing lenght of  differential pairs B34_L17,  B34_L15, B34_L21, B34_L13, B34_L10, B34_L20 changed

Type: Layout change

Reason: Other changes and limited space on PCB

Impact: Applications with exact timing requirements on these IOs have to be checked and if necessary adjusted

 

All modules produced by Trenz Electronic are developed and manufactured in Germany.

Related links to "TE0703 - Carrier board for Trenz Electronic modules with 4 x 5 cm form factor"
Downloads
Digilent
OHO-Elektronik
SunDance
Trenz_Electronic - Documents and Design files for Trenz Electronic Products