MPSoC Module TE0803 with Zynq UltraScale+ ZU3CG-E and mounted Heat Spreader

€424.00 (504.56 € gross) *

Prices plus VAT plus shipping costs

Possible to order, delivery time on request.

  • TE0803-04-3AE11-AK
  • 0
  • Full production
Quantity Unit price
To 9 €424.00 (504.56 € gross) *
From 10 €381.60 (454.10 € gross) *
From 25 €381.60 (454.10 € gross) *
From 50 €339.20 (403.65 € gross) *
From 100 €318.00 (378.42 € gross) *
From 250 €318.00 (378.42 € gross) *
From 500 €284.08 (338.06 € gross) *
From 1000 €284.08 (338.06 € gross) *
Description Downloads Resources
This product is not always in stock, but will be produced on customer order (on demand).... more
Product information "MPSoC Module TE0803 with Zynq UltraScale+ ZU3CG-E and mounted Heat Spreader"

This product is not always in stock, but will be produced on customer order (on demand).
Please ask for any minimum quantities.


The predecessor of this article is TE0803-03-3AE11-AK. All changes are in the Product Change Notification (PCN).

The Trenz Electronic TE0803-04-3AE11-AK is an industrial-grade MPSoC module integrating a Xilinx Zynq UltraScale+ with ZU3CG including a pre-assembled heat spreader, 2 GByte DDR4 SDRAM, 128 MByte Flash memory for configuration and operation, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections.

All this on a tiny footprint of 5.2 x 7.6 cm at the most competitive price. These high-density integrated modules are smaller than a credit card and available in several variants.

All parts are at least extended temperature range of 0°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

Key Features

  • Xilinx Zynq UltraScale+ XCZU3CG-1SFVC784E
  • ZU3CG, 784 Pin Packages
  • Dimensions: 5.2 x 7.6 cm
  • Plug-on module with 4 x 160 pin B2B connectors
  • Rugged for shock and high vibration
  • 3 mm mounting holes for skyline heat spreader
  • 2 GByte (64-bit) DDR4 SDRAM
  • 128 MByte QSPI Boot Flash dual parallel
  • 2 Kbit Serial EEPROM for MAC Address
  • 48 High-density (HD) I/O's (2 banks)
  • User I/O
    • 65 x multi-use I/O's (MIO)
    • 156 high-performance (HP) I/O's (3 banks)
    • Serial transceiver: PS GTR 4; PL GTH 4
    • Programmable 4-channel PLL clock generator
  • All power supplies on board, single 3.3V power source required
  • Evenly spread supply pins for good signal integrity

Other assembly options for cost or performance optimization plus high volume prices available on request.

Recommended Software

Vivado Design Suite - HLx Edition Download

Vivado Design Suite HLx Editions include Partial Reconfiguration at no additional cost with the Vivado HL Design Edition and HL System Edition. In-warranty users can regenerate their licenses to gain access to this feature.

Overview of all editions of Vivado Design Suite

Xilinx Licensing FAQ

Development Support

There is a base board available for this module.

Latest documentation, design support files and reference designs with source files are available for download free of charge.

Scope of Delivery

  • 1 x TE0803-04-3AE11-A Trenz Electronic MPSoC module with Xilinx Zynq UltraScale+ ZU3CG
  • 1 x heat spreader, pre-assembled, article no.: KK0803-03A

Additional Information

All modules produced by Trenz Electronic are developed and manufactured in Germany.

The online pictures of this product are not a legally binding offer, but are symbol pictures for illustration and presentation only.

Related links to "MPSoC Module TE0803 with Zynq UltraScale+ ZU3CG-E and mounted Heat Spreader"
Trenz_Electronic - Documents and Design files for Trenz Electronic Products