UltraSOM+ MPSoC Module with Zynq UltraScale+ XCZU9EG-1FFVC900E, 4 GB DDR4, LP

€1,074.00 (1,278.06 € gross) *

Prices plus VAT plus shipping costs

Possible to order, delivery time on request.

  • TE0808-05-9BE21-L
  • 0
  • Full production
Quantity Unit price
To 9 €1,074.00 (1,278.06 € gross) *
From 10 €966.60 (1,150.25 € gross) *
From 25 €966.60 (1,150.25 € gross) *
From 50 €859.20 (1,022.45 € gross) *
From 100 €805.50 (958.55 € gross) *
From 250 €805.50 (958.55 € gross) *
From 500 €719.58 (856.30 € gross) *
From 1000 €719.58 (856.30 € gross) *
Description Downloads Resources
This product is not always in stock, but will be produced on customer order (on demand).... more
Product information "UltraSOM+ MPSoC Module with Zynq UltraScale+ XCZU9EG-1FFVC900E, 4 GB DDR4, LP"

This product is not always in stock, but will be produced on customer order (on demand).
Please ask for any minimum quantities.


The predecessor of this article is TE0808-04-9BE21-L. All changes are in the Product Change Notification (PCN).

This module is identical to variant TE0808-05-9BE21-A except the lower 1 mm Samtec connectors.

Note: Due to the new revision the height profile of the module has changed.
Using TE0808-05 board as a replacement or in system(s) designed for TE0808-04, a review and adaption of mechanics e.g. cooling solutions must be implemented.

The Trenz Electronic TE0808-05-9BE21-L is a MPSoC module integrating a Xilinx Zynq UltraScale+ ZU9EG, 4 GByte DDR4 SDRAM and 128 MByte Flash memory for configuration and operation, 20 x serial high speed transceivers, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections. 

All this on a tiny footprint of 5.2 x 7.6 cm at the most competitive price. These high-density integrated modules are smaller than a credit card and available in several variants.

All parts are at least extended temperature range of 0°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

Key Features

  • Xilinx Zynq UltraScale+ XCZU9EG-1FFVC900E
  • ZU9EG 900 Pin Packages
  • 3 mm mounting holes for skyline heat spreader
  • Size: 52 x 76 mm
  • B2B Connectors: 4 x 160 pin
  • Rugged for shock and high vibration
  • 4 GByte DDR4 SDRAM, 64-Bit width
  • 128 MByte SPI Boot Flash (dual parallel)
  • User I/Os
    • 65 x PS MIOs, 48 x PL HD GPIOs, 156 x PL HP GIPIOs (3 banks)
    • Serial transceivers: 4 x GTR + 16 x GTH, 20 total
    • Transceiver clocks inputs and outputs
    • PLL clock generator inputs and outputs
  • Si5345 - 10 output PLL
  • All power supplies on board, single 3.3V Power required
    • 14 on-board DC/DC regulators and 13 LDOs
    • LP, FP, PL separately controlled power domains
  • Support for all boot modes (except NAND) and scenarios
  • Support for any combination of PS connected peripherals
  • Evenly spread supply pins for good signal integrity

Other assembly options for cost or performance optimization plus high volume prices available on request.

Development Support

There is a base board available for this module.

Latest documentation, design support files and reference designs with source files are available for download free of charge.

Scope of Delivery

  • 1 x TE0808-05-9BE21-L Trenz Electronic MPSoC module with Xilinx Zynq UltraScale+ ZU9EG, low profile

Additional Information

All modules produced by Trenz Electronic are developed and manufactured in Germany.

Related links to "UltraSOM+ MPSoC Module with Zynq UltraScale+ XCZU9EG-1FFVC900E, 4 GB DDR4, LP"
Trenz_Electronic - Documents and Design files for Trenz Electronic Products