UltraSOM+ MPSoC-Module with Zynq UltraScale+ ZU9EG-I and mounted Heat Spreader

€1,699.00 (2,021.81 € gross) *

Prices plus VAT plus shipping costs

expected to be available on 07-Oct-2022

  • TE0808-05-9GI21-AK
  • 0
  • Full production
Quantity Unit price
To 9 €1,699.00 (2,021.81 € gross) *
From 10 €1,529.10 (1,819.63 € gross) *
From 25 €1,529.10 (1,819.63 € gross) *
From 50 €1,359.20 (1,617.45 € gross) *
From 100 €1,274.25 (1,516.36 € gross) *
From 250 €1,274.25 (1,516.36 € gross) *
From 500 €1,138.33 (1,354.61 € gross) *
From 1000 €1,138.33 (1,354.61 € gross) *
Description Downloads Resources
This product is not always in stock, but will be produced on customer order (on demand).... more
Product information "UltraSOM+ MPSoC-Module with Zynq UltraScale+ ZU9EG-I and mounted Heat Spreader"

This product is not always in stock, but will be produced on customer order (on demand).
Please ask for any minimum quantities.


The predecessor of this article is TE0808-04-9GI21-AK. All changes are in the Product Change Notification (PCN).

This module is a TE0808-05-9GI21-A with mounted heat spreader.

The Trenz Electronic TE0808-05-9GI21-A is a MPSoC module integrating a Xilinx Zynq UltraScale+ ZU9EG, 4 GByte DDR4 SDRAM, 128 MByte Flash memory for configuration and operation, 20 x serial high speed transceivers, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections. 

All this on a tiny footprint of 5.2 x 7.6 cm at the most competitive price. These high-density integrated modules are smaller than a credit card and available in several variants.

All parts are at least industrial temperature range of -40°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

Key Features

  • Xilinx Zynq UltraScale+ XCZU9EG-2FFVC900I
  • ZU9EG 900 Pin Packages
  • 3 mm mounting holes for skyline heat spreader
  • Size: 52 x 76 mm
  • B2B Connectors: 4 x 160 pin
  • Rugged for shock and high vibration
  • 4 GByte 64-Bit DDR4 SDRAM
  • 128 MByte SPI Boot Flash (dual parallel)
  • User I/Os
    • 65 x PS MIOs, 48 x PL HD GPIOs, 156 x PL HP GIPIOs (3 banks)
    • Serial transceivers: 4 x GTR + 16 x GTH
    • Transceiver clocks inputs and outputs
    • PLL clock generator inputs and outputs
  • Si5345 - 10 output PLL
  • All power supplies on board, single 3.3 V Power required
    • 14 on-board DC/DC regulators and 13 LDOs
    • LP, FP, PL separately controlled power domains
  • Support for all boot modes (except NAND) and scenarios
  • Support for any combination of PS connected peripherals
  • Evenly spread supply pins for good signal integrity

Other assembly options for cost or performance optimization plus high volume prices available on request.

Development Support

There is a base board available for this module.

Latest documentation, design support files and reference designs with source files are available for download free of charge.

Scope of Delivery

  • 1 x TE0808-05-9GI21-A Trenz Electronic MPSoC module with Xilinx Zynq UltraScale+ ZU9EG (industrial temperature range)
  • 1 x mounted heat spreader for TE0808 REV05

Additional Information

All modules produced by Trenz Electronic are developed and manufactured in Germany.

Related links to "UltraSOM+ MPSoC-Module with Zynq UltraScale+ ZU9EG-I and mounted Heat Spreader"
Trenz_Electronic - Documents and Design files for Trenz Electronic Products