UltraSOM+ MPSoC-Modul with Zynq UltraScale+ ZU9EG-I and mounted Heat Spreader

€1,699.00 (2,021.81 € gross) *

Prices plus VAT plus shipping costs

Possible to order, delivery time on request.

  • TE0818-01-9GI21-AK
  • 0
  • Full production
Quantity Unit price
To 9 €1,699.00 (2,021.81 € gross) *
From 10 €1,529.10 (1,819.63 € gross) *
From 25 €1,529.10 (1,819.63 € gross) *
From 50 €1,359.20 (1,617.45 € gross) *
From 100 €1,274.25 (1,516.36 € gross) *
From 250 €1,274.25 (1,516.36 € gross) *
From 500 €1,138.33 (1,354.61 € gross) *
From 1000 €1,138.33 (1,354.61 € gross) *
Description Downloads Resources
This module is a TE0818-01-9GI21-A with mounted heat spreader. The TE0818 is largely... more
Product information "UltraSOM+ MPSoC-Modul with Zynq UltraScale+ ZU9EG-I and mounted Heat Spreader"

This module is a TE0818-01-9GI21-A with mounted heat spreader.

The TE0818 is largely identical in construction to the TE0808. The essential difference are new Samtec BGA connectors, which guarantees a reliable contact. The dimensions are identical.

The Trenz Electronic TE0818-01-9GI21-A is a MPSoC module integrating a Xilinx Zynq UltraScale+ ZU9EG, 4 GByte DDR4 SDRAM, 128 MByte Flash memory for configuration and operation, 20 x serial high speed transceivers, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections. 

All this on a tiny footprint of 5.2 x 7.6 cm at the most competitive price. These high-density integrated modules are smaller than a credit card and available in several variants.

All parts are at least industrial temperature range of -40°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

Key Features

  • Xilinx Zynq UltraScale+ XCZU9EG-2FFVC900I
    • ZU9EG 900 Pin Packages
    • Graphic Processing Unit (GPU)
  • 3 mm mounting holes for skyline heat spreader
  • Size: 52 x 76 mm
  • Plug-on module with 4 x 240 pin B2B connectors
  • Rugged for shock and high vibration
  • 4 GByte (64-Bit) DDR4 SDRAM
  • 128 MByte SPI Boot Flash (dual parallel)
  • User I/Os
    • 65 x PS MIOs
    • 48 x PL HD GPIOs
    • 156 x PL HP GIPIOs (3 banks)
    • Serial transceivers: 4 x PS-GTR, 16 x PL-GTH
    • Transceiver clocks inputs and outputs
    • PLL clock generator inputs and outputs
  • Si5345 - 10 output PLL
  • All power supplies on board, single 3.3 V Power required
    • 14 on-board DC/DC regulators and 13 LDOs
    • LP, FP, PL separately controlled power domains
  • Support for all boot modes (except NAND) and scenarios
  • Support for any combination of PS connected peripherals
  • Evenly spread supply pins for good signal integrity

Other assembly options for cost or performance optimization plus high volume prices available on request.

Development Support

A carrier board and a test board are in development for this module.

Latest documentation, design support files and reference designs with source files are available for download free of charge.

Scope of Delivery

  • 1 x TE0818-01-9GI21-A Trenz Electronic MPSoC module with Xilinx Zynq UltraScale+ ZU9EG (industrial temperature range)
  • 1 x mounted heat spreader for TE0818-01

Additional Information

All modules produced by Trenz Electronic are developed and manufactured in Germany.

Related links to "UltraSOM+ MPSoC-Modul with Zynq UltraScale+ ZU9EG-I and mounted Heat Spreader"
Trenz_Electronic - Documents and Design files for Trenz Electronic Products