MPSoC Module with Xilinx Zynq UltraScale+ 3CG-L1I, 1 GByte LPDDR4, 4 x 5 cm, LP

€574.00 (683.06 € gross) *

Prices plus VAT plus shipping costs

Possible to order, delivery time on request.

  • TE0823-01-3PIU1ML
  • 0
  • Full production
Quantity Unit price
To 9 €574.00 (683.06 € gross) *
From 10 €516.60 (614.75 € gross) *
From 25 €516.60 (614.75 € gross) *
From 50 €459.20 (546.45 € gross) *
From 100 €430.50 (512.30 € gross) *
From 250 €430.50 (512.30 € gross) *
From 500 €384.58 (457.65 € gross) *
From 1000 €384.58 (457.65 € gross) *
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This product is not always in stock, but will be produced on customer order (on demand).... more
Product information "MPSoC Module with Xilinx Zynq UltraScale+ 3CG-L1I, 1 GByte LPDDR4, 4 x 5 cm, LP"

This product is not always in stock, but will be produced on customer order (on demand).
Please ask for any minimum quantities.


The predecessor of this article is TE0823-01-3PIU1FL. All changes are in the Product Change Notification (PCN).

This module is identical to variant TE0823-01-3PIU1MA except the lower 2.5 mm Samtec connectors.

The Trenz Electronic TE0823-01-3PIU1ML is an industrial-grade MPSoC module integrating a low power Xilinx Zynq UltraScale+ ZU3CG, 1 GByte LPDDR4 SDRAM, 128 MByte Flash memory for configuration and operation, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections.

All this on a tiny footprint, smaller than a credit card, at the most competitive price. Modules in 4 x 5 cm form factor are fully mechanically and largely electrically compatible among each other.

All parts are at least industrial temperature range of -40°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

Key Features


  • Rugged for shock and high vibration
  • Evenly spread supply pins for good signal integrity
  • Plug-on module with 2 x 100 pin and 1 x 60 pin Razor Beam High-Speed hermaphroditic Terminal/Socket Strips (low profile, 2,5 mm)


  • Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I (Low Power)
    • Application Processor: Dual-core ARM Cortex-A53 MPCore
    • Real-Time Processor: Dual-core ARM Cortex-R5 MPCore
  • Package: SFVC784
  • Device: ZU3
  • Engine: CG
  • Speed: -1LI (also non-low power assembly options possible)
  • Temperature range: industrial


  • Low power DDR4 on PS with 32 bit data width
  • 128 MByte QSPI boot Flash in dual parallel mode
  • 8 GByte e.MMC memory with 8 bit data width
  • MAC address serial EEPROM with EUI-48 node identity

On Board

  • Lattice LCMXO2
  • PLL SI5338
  • Gigabit Ethernet transceiver PHY
  • Hi-speed USB2 ULPI transceiver with full OTG support


  • 132 x HP PL I/Os (3 banks)
  • ETH
  • USB
  • 4 GTR (for USB3, SATA, PCIe, DP)
    Four high-speed serial I/O (HSSIO) interfaces supporting following protocols:
    • PCI Express interface version 2.1 compliant
    • SATA 3.1 specification compliant interface
    • DisplayPort source-only interface with video resolution up to 4k x 2k

    • USB 3.0 specification compliant interface implementing a 5 Gbit/s line rate
    • 1 GB/s serial GMII interface
  • 14 x PS MIOs
    • MIO for UART
    • thereof 6 MIO for SD card interface (default configuration)
    • MIO for PJTAG
  • JTAG
  • Ctrl


  • 3.3V-5V main input
  • 3.3V controller input
  • Variable bank I/O power input
  • All power supplies on board


  • 4 x 5 cm form factor

Other assembly options for cost or performance optimization plus high volume prices available on request.

Development Support

There are different base boards available for this module.

Latest documentation, design support files and reference designs with source files are available for download free of charge.


  • Sensor Processing & Fusion
  • Motor Control
  • Low-cost Ultrasound
  • Traffic Engineering

Scope of Delivery

  • 1 x TE0823-01-3PIU1ML Trenz Electronic MPSoC module with Xilinx Zynq UltraScale+ ZU3CG (low power) and low profile socket strips

Additional Information

All modules produced by Trenz Electronic are developed and manufactured in Germany.

Related links to "MPSoC Module with Xilinx Zynq UltraScale+ 3CG-L1I, 1 GByte LPDDR4, 4 x 5 cm, LP"
Trenz_Electronic - Documents and Design files for Trenz Electronic Products