MPSoC Module with Xilinx Zynq UltraScale+ ZU11EG-1I, COM HPC Standard, 12 x 12cm

Article preview - Coming soon.
Price on Application

Currently not available for order.

  • TE0830-01-ABI26FAP
  • 0
  • Preview
Description Downloads Resources
The Trenz Electronic TE0830 is a COM-HPC compatible Zynq UltraScale+ module (12 x 12 cm).... more
Product information "MPSoC Module with Xilinx Zynq UltraScale+ ZU11EG-1I, COM HPC Standard, 12 x 12cm"

The Trenz Electronic TE0830 is a COM-HPC compatible Zynq UltraScale+ module (12 x 12 cm). COM-HPC is the new PICMG-standard (https://www.picmg.org/openstandards/com-hpc/).

The TE0830 features high memory connectivity (PS up to 8 GByte and PL DDR up to 16 GByte) as well as fast Gigabit transceivers (up to 32.75 Gb/s) allowing PCIe Gen4 to be implemented as root complex or endpoint. Storage memory can be expanded as desired (SATA or M.2 PCIe storage card on carrier). In addition to these interfaces, USB, Gigabit Ethernet and several other common interfaces are available. The JTAG connection for programming the ZynqMP can be done via GPIO pins or conveniently via Ethernet (with current firmware), so that the use in the server area is also possible. TE0830 is currently under development, but an initial prototype has been fielded and functionality is currently being verified on the TEBT0830 test carrier. Expected release in Q3/Q4 2021 (with reservations).

This is the prototype configuration of TE0830, but there are still many configuration options available that you can customize to meet your specific needs.

More information will be posted to our Wiki COM-HPC SoM documentation over time.

All parts are at least industrial temperature range of -40°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

Key Features (preliminary)

  • SoC/FPGA (Zynq UltraScale+)
    • Package: FFVC1760
    • Device: ZU11 (assembly option ZU17, ZU19 possible*)
    • Engine: EG
    • Speed: -1 (assembly option, -2,-3*, ** possible)
    • Temperature: I (assembly option E, (Q, M) possible*,**)
  • RAM/Storage
    • DDR4 (PS connected)
      • Data width: 72-bit with ECC
      • Size: 4 GByte (assembly option up to 8 GByte possible*)
      • Speed:***
    • DDR4 SODIMM (PL connected)
      • 72-bit DDR4 with ECC
      • Size: max 16 GByte*
      • Speed: NA*
    • e.MMC
      • Data width: 8-bit
      • Size: 64 GByte (max)
    • QSPI boot Flash in dual parallel mode
      • Data width: 8-bit
      • Size: 128 MByte (assembly up to 512 MByte possible*)
    • QDDRII
      • Size: 18 Mbit (assembly option possible*, default not assembled)
    • MAC address serial EEPROM with EUI-48™ node identity
  • On Board
    • SC CPLD ans SoC
      • Intel MAX 10: 10M08
      • Xilinx Zynq-7000: XC7Z010 with 128 MByte QSPI and 512 MByte DDR3 (16-bit)
    • PLL SI5345
    • Gigabit ETH PHY
    • USB2 HUB
    • USB2 PHY
  • Interface (2 x 400pin COM-HPC connectors)
    • 1 x PCIe SMB (ZynqMP PS GTR)
    • PCIe up to 48 lane (16 x GTY (32.75 Gb/s) and 32 x GTH (16.3 Gb/s))**
    • 1 x Gbit Ethernet
    • 4 x USB2
    • 1 x USB3 (ZynqMP PS GTR)
    • 1 x DDI (DP) (ZynqMP PS GTR)
    • 1 x SATA (ZynqMP PS GTR)
    • 1 x SPI
    • 1 x I2C SMB
    • 3 x I2C
    • 2 x UART (1x ZynqMP, 1x SC Zynq)
    • 12 x GPIO (JTAG over GPIO)
    • PL HP IOs  x32 (15 diff) over COM-HPC CSI interface
  • Power
    • 12V main
    • 5V standby
    • 2.0-3.3V RTC
  • Dimension
    • COM-HPC client module size B (120 x 120 mm)

Notes
* depends on assembly version
** not all combinations are possible
*** depends on used Zynq UltraScale+ and DDR4 combination
**** uses is limited by Zynq UltraScale+ specification

Other assembly options for cost or performance optimization plus high volume prices available on request.

Development Support

Latest documentation, design support files and reference designs with source files are available for download free of charge.

Scope of Delivery

  • 1 x TE0830-01-ABI26FAP MPSoC module with Xilinx Zynq UltraScale+ ZU11

Additional Information

All modules produced by Trenz Electronic are developed and manufactured in Germany.

Related links to "MPSoC Module with Xilinx Zynq UltraScale+ ZU11EG-1I, COM HPC Standard, 12 x 12cm"
Downloads
Digilent
OHO-Elektronik
SunDance
Trenz_Electronic - Documents and Design files for Trenz Electronic Products