RFSoC Module with AMD Zynq™ UltraScale+™ ZU25DR-1E, 4 GByte DDR4, 6.5 x 9 cm

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  • TE0835-02-MXE21-A
  • 0
  • Full production
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The predecessor of this article is TE0835-01-MXE21-A . All changes are in the Product... more
Product information "RFSoC Module with AMD Zynq™ UltraScale+™ ZU25DR-1E, 4 GByte DDR4, 6.5 x 9 cm"

The predecessor of this article is TE0835-01-MXE21-A. All changes are in the Product Change Notification (PCN).

The Trenz Electronic TE0835 is an extended-grade module based on AMD/Xilinx Zynq™ UltraScale+™ RFSoC. The module is equipped with 4 x 1 GByte DDR4 SDRAM memory, 2 x 64 MByte SPI Flash memory, USB2.0, Ethernet transceiver and 2 x Samtec Razor Beam Board to Board (B2B) connectors. The system controller CPLD is provided by Lattice MachXO2.

The Zynq UltraScale+ RFSoC family integrates key subsystems for multiband, multi-mode cellular radios and cable infrastructure (DOCSIS) into an SoC platform that contains a feature-rich 64-bitquad-core Arm Cortex-A53 and dual-core Arm Cortex-R5 based processing system.

All parts are at least extended temperature range of 0°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

Key Features

  • AMD/Xilinx Zynq™ UltraScale+™ XCZU25DR-1FFVE1156E
  • FPGA Package: E1156 (35 x 35 mm)
  • Other assembly options of this series are available with devices
    • ZU25, ZU27, ZU28 (Gen1)
    • ZU43, ZU47, ZU48 (GEN3)
  • Speed grade: -1 (slowest)
  • Engine: Quad-core Arm Cortex-A53 MPCore up to 1.3GHz
  • 8 RFADCs 12-bit with 4.096 GSPS
  • 8 RFDACs 14-bit with 6.554 GSPS
  • 1 x PCIe Gen3 x 16
  • RAM/Storage: 4 x 1 GByte (8 Gbit) DDR4 SDRAM
  • 2 x 64 MByte (512 Mbit) SPI Flash
  • 2k I2C MAC EEPROM
  • Total I/O: 40 IOs, 20 LVDS, 32 MIO
  • On Board: Lattice MachXO2 CPLD
  • Programmable ultra-high-performance DSPLL
  • USB2.0 OTG transceiver
  • Gigabit Ethernet transceiver
  • 8 x GTY
  • 4 x GTR
  • 3 x oscillators
  • 4 x user LEDs
  • Interface: 2 x Samtec Razor Beam ST5 (2 x 80 pol) Board to Board connectors
  • Power: 5 V +/- 10 % Input Supply Voltage
  • Dimension: 65 x 90 mm

Other assembly options for cost or performance optimization plus high volume prices available on request.

Development Support

Latest documentation, design support files and reference designs with source files are available for download free of charge.

Scope of Delivery

  • 1 x TE0835-02-MXE21-A Trenz Electronic RFSoC module with AMD/Xilinx Zynq™ UltraScale+™ RFSoC ZU25DR

Additional Information

All modules produced by Trenz Electronic are developed and manufactured in Germany.

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Downloads
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Trenz_Electronic - Documents and Design files for Trenz Electronic Products
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