Micromodule with AMD Kintex™ UltraScale™ KU035-2, 2 GByte DDR4, 4 x 5 cm

€1,544.00 (1,837.36 € gross) *

Prices plus VAT plus shipping costs

Possible to order, delivery time on request.

  • TE0841-02-32I21-A
  • 0
  • Full production
Quantity Unit price
To 9 €1,544.00 (1,837.36 € gross) *
From 10 €1,389.60 (1,653.62 € gross) *
From 25 €1,389.60 (1,653.62 € gross) *
From 50 €1,235.20 (1,469.89 € gross) *
From 100 €1,158.00 (1,378.02 € gross) *
From 250 €1,158.00 (1,378.02 € gross) *
From 500 €1,034.48 (1,231.03 € gross) *
From 1000 €1,034.48 (1,231.03 € gross) *
Description Downloads Resources
The predecessor of this article is TE0841-02-035-2I . All changes are in the Product... more
Product information "Micromodule with AMD Kintex™ UltraScale™ KU035-2, 2 GByte DDR4, 4 x 5 cm"

The predecessor of this article is TE0841-02-035-2I. All changes are in the Product Change Notification (PCN).

The Trenz Electronic TE0841-02-32I21-A is a powerful FPGA module integrating a AMD/Xilinx Kintex™ UltraScale™ KU035, 2 GByte DDR4, 64 MByte QSPI Boot Flash for configuration and operation, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking strips.

All this on a tiny footprint, smaller than a credit card, at the most competitive price. Modules in 4 x 5 cm form factor are fully mechanically and largely electrically compatible among each other.

All parts are at least industrial temperature range of -40°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

Key Features

  • AMD/Xilinx Kintex™ UltraScale™ KU035 XCKU035-2SFVA784I
  • Rugged for industrial application
  • Size: 40 x 50 mm
  • 3 mm mounting holes for skyline heat spreader
  • 2 banks of 1024 MByte DDR4 SDRAM, 32bit wide memory interface (each DDR 16bit separate)
  • 64 MByte (512 MBit) QSPI boot Flash
  • B2B Connectors: 3 x Razor Beam High-Speed Hermaphroditic Terminal/Socket Strips (regular 4 mm), total 260 terminals
    • 60 x HR I/Os
    • 84 x HP I/Os
    • Serial transceiver: GTH 8 lanes (TX/RX)
    • 2 x MGT external clock inputs
  • Clocking
    • Si5338 - 4 output PLL, GT and PL clocks
    • 200 MHz LVDS oscillator
  • Power
    • All power supplies on board, single supply operation supported
    • User defined IO-Bank power
  • Evenly spread supply pins for good signal integrity

Other assembly options for cost or performance optimization plus high volume prices available on request.

Development Support

There are different base boards available for this module.

Latest documentation, design support files and reference designs with source files are available for download free of charge.

Scope of Delivery

  • 1 x TE0841-02-32I21-A Trenz Electronic 4 x 5 cm FPGA module with AMD/Xilinx Kintex™ UltraScale™ XCKU035 (industrial temperature range)
  • 8 x screws
  • 4 x bolts

Additional Information

All modules produced by Trenz Electronic are developed and manufactured in Germany.

Related links to "Micromodule with AMD Kintex™ UltraScale™ KU035-2, 2 GByte DDR4, 4 x 5 cm"
Downloads
Digilent
OHO-Elektronik
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Trenz_Electronic - Documents and Design files for Trenz Electronic Products
inrevium
reference