TEB0911 UltraRack+ MPSoC Board with Xilinx Zynq UltraScale+ ZU9,6 FMC connectors

€3,100.00 (3,689.00 € gross) *

Prices plus VAT plus shipping costs

expected to be available on 14-Dec-2018

  • TEB0911-04-ZU9EG1E
  • 0
Quantity Unit price
To 9 €3,100.00 (3,689.00 € gross) *
From 10 €2,790.00 (3,320.10 € gross) *
From 25 €2,635.00 (3,135.65 € gross) *
From 50 €2,480.00 (2,951.20 € gross) *
From 100 €2,325.00 (2,766.75 € gross) *
From 250 €2,170.00 (2,582.30 € gross) *
From 500 €2,015.00 (2,397.85 € gross) *
From 1000 €1,860.00 (2,213.40 € gross) *
Description Downloads Resources
The Trenz Electronic TEB0911 UltraRack+ board is integrating a Xilinx Zynq UltraScale+ ZU9EG... more
Product information "TEB0911 UltraRack+ MPSoC Board with Xilinx Zynq UltraScale+ ZU9,6 FMC connectors"

The Trenz Electronic TEB0911 UltraRack+ board is integrating a Xilinx Zynq UltraScale+ ZU9EG MPSoC with 4 GByte Flash memory for configuration and operation, DDR4-SDRAM SO-DIMM socket with 64-bit wide data bus, 22 MGT lanes and powerful switch-mode power supplies for all on-board voltages.. The TEB0911 board exposes the pins of the Zynq MPSoC to accessible connectors and provides a whole range of on-board components to test and evaluate the Zynq UltraScale+ MPSoC and for developing purposes. The board is capable to be fitted to a enclosure, whereby on the enclosure's rear and front panel, I/O's, LVDS-pairs and MGT lanes are accessible through 6 on-board FMC connectors and other standard high-speed interfaces, namely USB3, SFP+, SSD, GbE, etc.

All parts are at least extended temperature range of 0°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

Key Features

  • Zynq UltraScale+ MPSoC XCZU9EG-1FFVB1156E
    • 1156 Pin Package
  • 64bit DDR4 SODIMM (PS connected)
  • M2 PCIe SSD (1-Lane)
  • eMMC (bootable)
  • Dual QSPI Flash (bootable)
  • System Controller(LCMXO2-7000HC)
    • Power Sequencing
    • IO Expander
  • Configurable PLLs
  • GTH/GTP Reference CLKs

Front Panel

  • 4 x FMC
    • 4 GTH per FMC
    • 68 ZynqMP PL IO per FMC
  • DisplayPort (2-Lanes)
  • RJ34 ETH + Dual USB3 Combo
  • Dual Stack SFP+
  • SD (bootable)
  • Status LEDs

Back Panel

  • 2 x FMC
    • 4/2 GTH
    • 12 ZynqMP PL IO per FMC
  • 56 SC IO per FMC
  • USB JTAG/UART ZynqMP
  • USB JTAG/GPIO FMC
  • CAN FD (DB9 Connector)
  • SMA (external CLK)
  • 5-pin 24V power connector

Board size

  • 406 mm × 234.30 mm, please download the assembly diagram for exact details.

Other assembly options for cost or performance optimization plus high volume prices available on request.

Scope of Delivery

  • 1 x TEB0911 UltraRack+ MPSoC board with Xilinx Zynq UltraScale+ ZU9EG

Additional Information

All modules produced by Trenz Electronic are developed and manufactured in Germany.

The online pictures of this product are not a legally binding offer, but are symbol pictures for illustration and presentation only.

Related links to "TEB0911 UltraRack+ MPSoC Board with Xilinx Zynq UltraScale+ ZU9,6 FMC connectors"
Downloads
Digilent
OHO-Elektronik
SunDance
Trenz_Electronic - Documents and Design files for Trenz Electronic Products