PCIe FMC Carrier with AMD Virtex-7 FPGA, 8 Lane PCIe GEN2, SODIMM SDRAM

€2,489.00 (2,961.91 € gross) *

Prices plus VAT plus shipping costs

expected to be available on 22-May-2024

  • TEC0330-05
  • 0
  • Full production
Quantity Unit price
To 9 €2,489.00 (2,961.91 € gross) *
From 10 €2,240.10 (2,665.72 € gross) *
From 25 €2,240.10 (2,665.72 € gross) *
From 50 €1,991.20 (2,369.53 € gross) *
From 100 €1,866.75 (2,221.43 € gross) *
From 250 €1,866.75 (2,221.43 € gross) *
From 500 €1,667.63 (1,984.48 € gross) *
From 1000 €1,667.63 (1,984.48 € gross) *
Description Downloads Resources
This product is not always in stock, but will be produced on customer order (on demand).... more
Product information "PCIe FMC Carrier with AMD Virtex-7 FPGA, 8 Lane PCIe GEN2, SODIMM SDRAM"

This product is not always in stock, but will be produced on customer order (on demand).
Please ask for any minimum quantities.

 

The predecessor of this article is TEC0330-04. All changes are in the Product Change Notification (PCN).

Note: Carrier without pads for conduction cooling!

The Trenz Electronic TEC0330 is a PCI Express form factor card (PCIe 2.0 or higher) integrating the AMD Virtex-7 XC7VX330T FPGA chip. This high-end FPGA card is designed for maximum system performance and intended for use in applications with high demands on system throughput. There is a SO-DIMM socket on the board for standard DDR3 SDRAM extension memory module.

The TEC0330 features HPC (High Pin Count) ANSI/VITA 57.1 compatible FMC interface connector for standard I/O Mezzanine modules. Other interface connectors found on-board include JTAG for accessing FPGA and on-board System Controller CPLD, and also connector with 5 high-speed I/O differential signaling pairs.

The TEC0330 FPGA board is intended to be used as add-on card in a PCIe 2.0 or higher capable host systems, it can not be used as a stand-alone device.

Key Features

  • AMD Virtex-7 FPGA module XC7VX330T-2FFG1157C (commercial temperature range)
  • PCI Express 2.0 x8 card with maximum throughput of 4 GB/s
  • FMC High Pin Count (HPC) connector
  • 8 FPGA MGT lanes available on PCIe interface
  • DDR3 SODIMM SDRAM socket
  • 256-Mbit (32-MByte) Quad SPI Flash memory (for configuration and operation) accessible through:
    • FPGA
    • JTAG port (SPI indirect, bus width x4)
  • External clock input via SMA coaxial connector
  • 28 GTH transceivers, each with up to 13.1 Gbit/s data transmission rate
  • FPGA configuration through:
    • JTAG connector
    • SPI Flash memory
  • Programmable quad clock generator
  • TI LMK04828B ultra low-noise JESD204B compliant clock jitter cleaner
  • On-board high-efficiency DC-DC converters
  • Up to 202 FPGA I/O pins available on FMC connector (up to 101 LVDS pairs possible)
  • System management and power sequencing
  • AES bit-stream encryption
  • eFUSE bit-stream encryption

Other assembly options for cost or performance optimization plus high volume prices available on request.

Development Support

Latest documentation, design support files and reference designs with source files are available for download free of charge.

Scope of Delivery

  • 1 x TEC0330-05 Trenz Electronic PCIe FMC Carrier with AMD Virtex-7 330T FPGA

Additional Information

All modules produced by Trenz Electronic are developed and manufactured in Germany.

Related links to "PCIe FMC Carrier with AMD Virtex-7 FPGA, 8 Lane PCIe GEN2, SODIMM SDRAM"
Downloads
Digilent
OHO-Elektronik
SunDance
Trenz_Electronic - Documents and Design files for Trenz Electronic Products
inrevium
reference