CoolJag BUF-A4 Fansink for Trenz Electronic Evalboard TE0950
Analog Discovery Pro ADP2230: Mixed Signal USB Oscilloscope
FPGA module with GateMate A1 from Cologne Chip, 16 MByte QSPI Flash, 4 x 5 cm
AMD Versal™ AI Edge Evalboard with VE2302 device, 8 GB DDR4 SDRAM, 15 x12 cm
UltraSOM+ MPSoC-Module with AMD Zynq™ UltraScale+™ ZU9EG-2I incl. Heat Spreader
UltraSOM+ MPSoC Module with AMD Zynq™ UltraScale+™ ZU15EG-1E incl. Heat Spreader
Heat spreader with fan for Trenz Electronic RFSoC modules TE0835-02
Heat Spreader for Trenz Electronic MPSoC-Module TE0813-02
Heat Spreader for Trenz Electronic Modules TE0745-03
Solderless Breadboard Kit: Small Solderless Breadboard with Two Power Rails
Heat Sink for Trenz Electronic Modules TE0741-05, spring-loaded embedded
Heat Spreader for Trenz Electronic Modules TE0714 from REV04
Heat Sink for Trenz Electronic FPGA Modules TE0741 Revision 04 und 05
Microchip PolarFire® SoC FPGA 95T-1I, 1 GByte LPDDR4 SDRAM, 4 x 5 cm
Microchip PolarFire® SoC FPGA 25T-1I, 1 GByte LPDDR4 SDRAM, 4 x 5 cm
Microchip PolarFire® SoC FPGA 25T-FE, 1 GByte LPDDR4 SDRAM, 4 x 5 cm
Heat Spreader for Trenz Electronic Modules TE0818
MPSoC Module with AMD Zynq™ UltraScale+™ ZU7EV-1I, 4 GByte DDR4, 5.2 x 7.6 cm
MCC USB-DIO24/37: Digital I/O device with 24 channels
USB-DIO24/37 from Measurement Computing provides 24 logic level digital I/O lines for each USB port.
139.25 € (165.71 € gross)
33109
In Stock: 0
MCC USB-1608G: 250 kS/s High-Speed Multifunction USB DAQ Device