Trenz Electronic FPGA and SoC Modules

The micromodules designed by Trenz Electronic feature modern FPGA's. With small size and high-density connectors, they can be used nearly everywhere.

Gigabit Ethernet and integrated USB guarantees high data transfer rates to a host PC.

Other assembly options for cost or performance optimization plus high volume prices available on request.

Trenz Electronic Module and Carrier Board Life Cycles

Carrier boards are no longer produced if all suitable modules go EOL.

Series	Carrier Board	Launch Year	Expected EOL	Expected Life Cycle
TE0140	TE0143	2004	2019	15
TE0300		2005	2020	15
TE0320	TE0323	2005	2020	15
TE0600	TE0603	2010	2027	17
TE0630	TE0303	2011	2027	16
TE07xx	TEBA07xx, TEBB07xx, TEB07xx, TEBT07xx, TE070x	2013	2028	15
TE08xx	TEBA08xx, TEBF08xx, TEBT08xx	2016	2031	15

Modules (sorted by publication date)	Photo	Form factor (cm)
TEI0006 An industrial grade module based on Intel Cyclone 10 GX. Intel Cyclone 10 GX device family delivers higher core, transceiver and I/O performance than the previous generation of low cost FPGAs. Overview available models		6 x 8
TE0890 "S7 Mini" FPGA module integrating a Xilinx Spartan-7, 64 MBit HyperRAM DRAM, 64 MBit Config PROM for dual-boot and/or SW code storage and dual-pinout DIP-40 or 50mil 80 pin connectors for 32 or 64 FPGA 3.3V I/Os. The module is footprint compatible with 7S6, 7S15, 7S50 FTGB-196 devices. Overview available models		2,7 x 5,2
TEC0117 "GOWIN LittleBee" Low cost FPGA module integrating a GOWIN LittleBee 1NR9 FPGA with 8 MByte internal SDRAM and 8 MByte SPI Flash for user applications. It's compatible to the Arduino MKR standard. Overview available models		2,5 x 6,15
TEC0089 DesignWare ARC EM Software Development Plattform The DesignWare® ARC® EM Software Development Platform is a flexible platform for rapid software development on ARC EM processors and subsystems. It is intended to accelerate software development and debug of ARC EM processor-based systems for a wide range of ultra-low power embedded applications such as IoT, sensor fusion, and voice applications. It includes an FPGA-based hardware board with commonly used peripherals and interfaces for extensibility. Downloadable platform packages containing different hardware configurations enable the board to be programmed with different ARC EM processors and subsystems. Overview available models		-
TEC0850 CompactPCI Serial Card CompactPCI Serial card integrating a Xilinx Zynq UltraScale+ MPSoC, one DDR4 SDRAM SODIMM socket with 64bit wide data bus, max. dual 512 MByte Flash memory for configuration and operation, 24 Gigabit transceivers on PL side and 4 on PS side, powerful switch-mode power supplies for all onboard voltages, USB2 and USB3 FIFO bridges and a large number of configurable I/Os available on the CompactPCI Serial backplane connectors. Overview available models		10 x 16
TEF0008 FMC-Karte FPGA to Mezzanine Card (FMC) based on VITA 57.1 FMC HPC Standard, with four SFP+ 10 GBit ports for fiber optical SFP modules. It is inteded for use on a FMC HPC carrier and can not be used stand-alone. Overview available models		6,9 x 8,4
TE0783 A high-performance, industrial-grade SoM (System on Module) based on Xilinx Zynq-7000 SoC with 1 GByte RAM (32bit wide DDR3) connected to PS, 2 GByte RAM (64bit wide DDR3) connected to PL, 4 GByte eMMC, 16 GTX high-performance transceiver lanes, 32 MByte QSPI Flash memory for conﬁguration and operation, and powerful switch-mode power supplies for all on-board voltages. Overview available models		8,5 x 8,5
TEF0007 FMC-Karte DisplayPort 1.2 compatible FMC card with data rates up to 5.4 Gbps and sink and source DP connector. Overview available models		6,9 x 8,4
TEM0001 "SMF2000" FPGA modul with Microsemi SmartFusion2 and 8 MByte Flash. SmartFusion2 combines a 166 MHz Cortex-M3 MCU including 256 KByte Flash and 80 KByte SRAM, as well as 12 kLUT FPGA Core Logic. The TEM0001 is ideal for evaluation and rapid prototying. It's compatible to the Arduino MKR standard. Overview available models		2.5 x 6.15
TEI0003 "CYC1000" FPGA module with an integrated Intel Cyclone 10 LP FPGA, 8 MByte SDRAM, 2 MByte Flash and a LIS3DH 3-axis sensor. It's compatible to the Arduino MKR standard. Overview available models		2.5 x 6.15
TEL0001 "LXO2000" FPGA module integrating a Lattice XO2-4000 and on-board USB/JTAG. It's compatible to the Arduino MKR standard. Overview available models		2.5 x 6.15
TEI0001 "MAX1000" FPGA IoT Maker Board that has been designed for end-to-end application development and optimised for cost. The Arrow MAX1000 board can be installed directly into a custom application or integrated on to a completely separate board. At the heart of the maker board is a compact (11x11mm) Intel MAX10 FPGA with 8000 logic elements. This single chip includes integrated flash memory, a 1Msps 12bit ADC for analogue signals and a 3.3V power supply. Other features include embedded SRAM, DSP blocks, instant-on within milliseconds, and the ability to implement Intel’s NIOS II soft core embedded processor to perform microcontroller tasks. Overview available models		2.5 x 6.15
TE0807 UltraSOM+ MPSoC module with Xilinx Zynq UltraScale+ ZU07EV, 4 GByte DDR4 SDRAM, 128 MByte SPI Boot Flash (dual parallel), plug-on module with 4 x 160-pin connectors, serial transceivers: GTR 4 (all) + GTH 16 (all), Graphic Processing Unit (GPU) + Video codec unit (VCU), extended temperature range, carrier board and individual cooling solution available. Overview available models		5.2 x 7.6
TEF1001 PCIe FMC Carrier integrating a Xilinx Kintex-7 FPGA (K160T, K325T or K410T), 32 MByte SPI Flash, a 4 lane PCIe, a Vita 57.1 FMC HPC Slot and a DDR3 SODIMM Socket. Overview available models		-
TE0713 FPGA module with Xilinx Zynq Artix-7, USB 3.0 to FIFO bridge, 1 GByte of DDR3L SDRAM, 32 MByte Flash memory, Plug-on module with 2 x 100-pin and 1 x 60-pin high-speed hermaphroditic strips, carrier board available. Overview available models		4 x 5
TE0803 MPSoC module with Xilinx Zynq UltraScale+, 4 x 512 MByte (2 GByte) 64-Bit DDR4 SDRAM (up to 8 GByte max), 2 x 256 MBit (2 x 32 MByte) SPI Boot Flash dual parallel (up to 512 MByte max), plug-on module with 4 x 160 pin B2B connectors, carrier board, cooling solution and starter kit available. Overview available models		5.2 x 7.6
TE0820 MPSoC module with Xilinx Zynq UltraScale+, 1 GByte (2 x 512 MByte) DDR4 SDRAM with 32-Bit width, 2 x 32 MByte Flash memory, B2B connectors: 2 x 100 pin and 1 x 60 pin, carrier board available. Overview available models		4 x 5
TE0714 FPGA module with Xilinx Artix-7 35T or 50T, 16 MByte QSPI Flash, smallest module with tranceivers, industrial temperature range, carrier board available. Overview available models		4 x 3
TE0745 SoC module with Xilinx Zynq-7030 or Zynq-7045, 1 GByte DDR3 SDRAM, 32 MByte SPI Flash, 1 GBit Ethernet, 8 x GTX (7030: 4 GT), RTC, industrial temperature range, carrier board available. Overview available models		5.2 x 7.6
TE0841 FPGA module with Xilinx Kintex UltraScale KU35/KU40, 2 GByte DDR4, 64 MByte SPI Boot Flash, 3.2 mm mounting holes for skyline heat spreader, serial transceiver: GTH 8 Lanes (all), industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0808 UltraSOM+ MPSoC module with Xilinx Zynq UltraScale+, 4 x 512 MByte (2 GByte) 64-Bit DDR4 memory, 2 x 256 MBit (2 x 32 MByte) SPI Boot Flash (dual parallel), B2B connectors: 4 x 160 pin, serial transceiver: GTR 4 (all) + GTH 16 (all), industrial temperature range, carrier board and starter kit available. Overview available models		5.2 x 7.6
TE0725LP FPGA module with Xilinx Artix-7 100T, 32 MByte Flash, optional HyperRAM or HyperFlash, 2 x 50 pin with 2,54 mm pitch, VIN 3,3V or 1,8V, commercial temperature range available (industrial temperature range on request). Overview available models		7.3 x 3.5
TE0725 FPGA module with Xilinx Artix-7 15T, 35T or 100T, 32 MByte Flash, from revision 03 64 MBit HyperRAM, 2 x 50 Pin with 2.54 mm pitch, optional Fiber Optic Module (125/250 or 1000 MBit/s), commercial temperature range available (industrial temperature range on request). Overview available models		7.3 x 3.5
TE0726 "ZynqBerry" SoC module with Xilinx Zynq-7010 with Raspberry Pi form factor, 512 MByte (128 MByte) DDR3L, 16 MByte SPI Flash, Micro SD socket, 4 USB with power switches, 100 MBit Ethernet, DSI and CSI-2 Connector (display and camera), HAT header with 26 I/O's, commercial temperature range. Overview available models		like Raspberry Pi Model 2
TE0729 SoC module with Xilinx Zynq-7020, 512 MByte DDR3, 32 MByte QSPI-Flash, 1 x 10/100/1000 Mbps Ethernet transceiver PHY, 2 x 10/100 Mbps Ethernet transceiver PHYs, RTC, equipped with sulfur resistant resistors, industrial temperature range, carrier board and starter kit available. Overview available models		5.2 x 7.6
TE0723 "ArduZynq" SoC module with Xilinx Zynq-7010 with Arduino Shield form factor, 128 MByte DDR3L; version M: 512 MByte DDR3L, 16 MByte SPI Flash, Hi-Speed USB2.0 ULPI Transceiver, 23 FPGA I/O's on B2B connectors available, commercial temperature range. Overview available models		Arduino shield
TE0782 SoC module with Xilinx Zynq-7035, Zynq-7045 or Zynq-7100, 1 GByte DDR3, 32 MByte QSPI Flash, 4 GByte eMMC (optional up to 64 GByte), 2 x Gigabit Ethernet Tranceiver, RTC, optional 2 x 8 MByte HyperRAM (max. 2 x 32 MByte), 16 GTX high-performance Tranceiver Lanes, industrial temperature range, test fixture available. Overview available models		8.5 x 8.5
TE0722 "DIPFORTy1 Soft Propeller" Propeller compatible DIP40 pinout module with Xilinx Zynq-7010, 16 MByte SPI Flash (primary boot), 33.333 MHz Clock (MEMS Oscillator), Total user accessible PL I/O: 46 (+3 Input only), MicroSD Card socket, commercial temperature range. Overview available models		1.8 x 5.1
TE0728 SoC module with Xilinx automotive Zynq-7020, 512 MByte DDR3, 16 MByte QSPI Flash, 2 x 100 MBit Ethernet Transceiver (PHY), 76 single ended I/O, 24 LVDS pairs (48 I/O) and 42 MIO available on B2B connectors, CAN Transceiver (PHY), automotive temperature range, carrier board available. Overview available models		6 x 6
TE0715 SoC module with Xilinx Zynq-7015 or Zynq-7030, 1 GByte DDR3, 32 MByte QSPI Flash, 1 GBit Ethernet, 4 GTP/GTX Tranceivers, Programmable Clock Generator: Transceiver Clock (default 125 MHz), industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0712 FPGA module with Xilinx Artix-7 100T or 200T, 1 GByte DDDR3, 32 MByte Quad-SPI Flash, 100 MBit Ethernet, 4 Multi Gigabit transceivers, industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0711 FPGA module with Xilinx Artix-7 35T or 100T, 32 MByte QSPI Flash, 100 MHz MEMS oscillator, 178 FPGA I/O's (84 differential pairs), 3 User LED's, industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0710 FPGA module with Xilinx Artix-7 35T or 100T, 512 MByte DDR3, 32 MByte QSPI Flash, 2 x 100 MBit Ethernet, industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0720 SoC module with Xilinx Zynq-7020, 256 MByte/512 MByte DDR3L/1 GByte DDR3 (depending on version), 32 MByte SPI Flash, 4 GByte e-NAND (up to 32 GByte), 152 FPGA I/O's available on B2B connectors, RTC, 3 User LED's, automotive, industrial and commercial temperature range, carrier board and starter kit available. Overview available models		4 x 5
TE0741 FPGA module with Xilinx Kintex-7 70T, 160T, 325T or 410T, 32 MByte Quad-SPI Flash, max. GTX transceiver data rate 10,3125 Gb/s (default 6,6 Gb/s), 8 Multi Gigabit Transceivers, 2 User LED, 1 DONE PFGA pin LED, industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0630 FPGA module with Xilinx Spartan-6 LX45, LX75 oder LX150, 128 MByte DDR3, 8 MByte SPI Flash, up to 40 different and up to 109 single end FPGA I/O pins available on B2B connectors, 1.2 V, 1.5 V, 2.5 V = VCCAUX and 3.3 V power rails, 4 User LED, 1 User Push-Button, 2 User DIP Switches, industrial temperature range, carrier board available. Overview available models		4 x 5
TE0600 GigaBee module with Xilinx Spartan-6 LX45, LX100 or LX150, two independent 128 MByte DDR SDRAM banks (optional 2 x 512 MByte DDR SDRAM), 16 MByte SPI Flash, 10/100/1000 tri-speed GBit Ethernet transceiver (PHY), JTAG Port, industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0320 Module with Xilinx Spartan-3A, 1 GBit DDR RAM up to 1333 MByte/s bandwidth, 32 MBit SPI Flash, 109 I/Os (+ 10 dual-purpose pins) available on B2B connectors, 4 LED, 2 Push Buttons, 8 DIP Switches, industrial and commercial temperature range, carrier board available. Overview available models		6.8 x 4.8
TE0300 FPGA module with Xilinx Spartan-3E, 32 MBit SPI Flash, 512 MBit DDR RAM up to 666 MByte/s bandwidth, 3 on-board DC-DC converters for high efficieny, 104 I/Os + 6 Inputs available on B2B connectors, industrial and commercial temperature range, carrier board available. Overview available models		4.05 x 4.75
TE0140 Module with Xilinx Spartan-3, USB 2.0 transceiver, 16 KBit EEPROM, 120 available I/O's on B2B connectors, one LED, 1 push button, commercial temperature range, carrier board available. Overview available models		5.07 x 4.36

The micromodules designed by Trenz Electronic feature modern FPGA's. With small size and high-density connectors, they can be used nearly everywhere. Gigabit Ethernet and integrated USB... read more »

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Trenz Electronic FPGA and SoC Modules

The micromodules designed by Trenz Electronic feature modern FPGA's. With small size and high-density connectors, they can be used nearly everywhere.

Gigabit Ethernet and integrated USB guarantees high data transfer rates to a host PC.

Other assembly options for cost or performance optimization plus high volume prices available on request.

Trenz Electronic Module and Carrier Board Life Cycles

Carrier boards are no longer produced if all suitable modules go EOL.

Series	Carrier Board	Launch Year	Expected EOL	Expected Life Cycle
TE0140	TE0143	2004	2019	15
TE0300		2005	2020	15
TE0320	TE0323	2005	2020	15
TE0600	TE0603	2010	2027	17
TE0630	TE0303	2011	2027	16
TE07xx	TEBA07xx, TEBB07xx, TEB07xx, TEBT07xx, TE070x	2013	2028	15
TE08xx	TEBA08xx, TEBF08xx, TEBT08xx	2016	2031	15

Modules (sorted by publication date)	Photo	Form factor (cm)
TEI0006 An industrial grade module based on Intel Cyclone 10 GX. Intel Cyclone 10 GX device family delivers higher core, transceiver and I/O performance than the previous generation of low cost FPGAs. Overview available models		6 x 8
TE0890 "S7 Mini" FPGA module integrating a Xilinx Spartan-7, 64 MBit HyperRAM DRAM, 64 MBit Config PROM for dual-boot and/or SW code storage and dual-pinout DIP-40 or 50mil 80 pin connectors for 32 or 64 FPGA 3.3V I/Os. The module is footprint compatible with 7S6, 7S15, 7S50 FTGB-196 devices. Overview available models		2,7 x 5,2
TEC0117 "GOWIN LittleBee" Low cost FPGA module integrating a GOWIN LittleBee 1NR9 FPGA with 8 MByte internal SDRAM and 8 MByte SPI Flash for user applications. It's compatible to the Arduino MKR standard. Overview available models		2,5 x 6,15
TEC0089 DesignWare ARC EM Software Development Plattform The DesignWare® ARC® EM Software Development Platform is a flexible platform for rapid software development on ARC EM processors and subsystems. It is intended to accelerate software development and debug of ARC EM processor-based systems for a wide range of ultra-low power embedded applications such as IoT, sensor fusion, and voice applications. It includes an FPGA-based hardware board with commonly used peripherals and interfaces for extensibility. Downloadable platform packages containing different hardware configurations enable the board to be programmed with different ARC EM processors and subsystems. Overview available models		-
TEC0850 CompactPCI Serial Card CompactPCI Serial card integrating a Xilinx Zynq UltraScale+ MPSoC, one DDR4 SDRAM SODIMM socket with 64bit wide data bus, max. dual 512 MByte Flash memory for configuration and operation, 24 Gigabit transceivers on PL side and 4 on PS side, powerful switch-mode power supplies for all onboard voltages, USB2 and USB3 FIFO bridges and a large number of configurable I/Os available on the CompactPCI Serial backplane connectors. Overview available models		10 x 16
TEF0008 FMC-Karte FPGA to Mezzanine Card (FMC) based on VITA 57.1 FMC HPC Standard, with four SFP+ 10 GBit ports for fiber optical SFP modules. It is inteded for use on a FMC HPC carrier and can not be used stand-alone. Overview available models		6,9 x 8,4
TE0783 A high-performance, industrial-grade SoM (System on Module) based on Xilinx Zynq-7000 SoC with 1 GByte RAM (32bit wide DDR3) connected to PS, 2 GByte RAM (64bit wide DDR3) connected to PL, 4 GByte eMMC, 16 GTX high-performance transceiver lanes, 32 MByte QSPI Flash memory for conﬁguration and operation, and powerful switch-mode power supplies for all on-board voltages. Overview available models		8,5 x 8,5
TEF0007 FMC-Karte DisplayPort 1.2 compatible FMC card with data rates up to 5.4 Gbps and sink and source DP connector. Overview available models		6,9 x 8,4
TEM0001 "SMF2000" FPGA modul with Microsemi SmartFusion2 and 8 MByte Flash. SmartFusion2 combines a 166 MHz Cortex-M3 MCU including 256 KByte Flash and 80 KByte SRAM, as well as 12 kLUT FPGA Core Logic. The TEM0001 is ideal for evaluation and rapid prototying. It's compatible to the Arduino MKR standard. Overview available models		2.5 x 6.15
TEI0003 "CYC1000" FPGA module with an integrated Intel Cyclone 10 LP FPGA, 8 MByte SDRAM, 2 MByte Flash and a LIS3DH 3-axis sensor. It's compatible to the Arduino MKR standard. Overview available models		2.5 x 6.15
TEL0001 "LXO2000" FPGA module integrating a Lattice XO2-4000 and on-board USB/JTAG. It's compatible to the Arduino MKR standard. Overview available models		2.5 x 6.15
TEI0001 "MAX1000" FPGA IoT Maker Board that has been designed for end-to-end application development and optimised for cost. The Arrow MAX1000 board can be installed directly into a custom application or integrated on to a completely separate board. At the heart of the maker board is a compact (11x11mm) Intel MAX10 FPGA with 8000 logic elements. This single chip includes integrated flash memory, a 1Msps 12bit ADC for analogue signals and a 3.3V power supply. Other features include embedded SRAM, DSP blocks, instant-on within milliseconds, and the ability to implement Intel’s NIOS II soft core embedded processor to perform microcontroller tasks. Overview available models		2.5 x 6.15
TE0807 UltraSOM+ MPSoC module with Xilinx Zynq UltraScale+ ZU07EV, 4 GByte DDR4 SDRAM, 128 MByte SPI Boot Flash (dual parallel), plug-on module with 4 x 160-pin connectors, serial transceivers: GTR 4 (all) + GTH 16 (all), Graphic Processing Unit (GPU) + Video codec unit (VCU), extended temperature range, carrier board and individual cooling solution available. Overview available models		5.2 x 7.6
TEF1001 PCIe FMC Carrier integrating a Xilinx Kintex-7 FPGA (K160T, K325T or K410T), 32 MByte SPI Flash, a 4 lane PCIe, a Vita 57.1 FMC HPC Slot and a DDR3 SODIMM Socket. Overview available models		-
TE0713 FPGA module with Xilinx Zynq Artix-7, USB 3.0 to FIFO bridge, 1 GByte of DDR3L SDRAM, 32 MByte Flash memory, Plug-on module with 2 x 100-pin and 1 x 60-pin high-speed hermaphroditic strips, carrier board available. Overview available models		4 x 5
TE0803 MPSoC module with Xilinx Zynq UltraScale+, 4 x 512 MByte (2 GByte) 64-Bit DDR4 SDRAM (up to 8 GByte max), 2 x 256 MBit (2 x 32 MByte) SPI Boot Flash dual parallel (up to 512 MByte max), plug-on module with 4 x 160 pin B2B connectors, carrier board, cooling solution and starter kit available. Overview available models		5.2 x 7.6
TE0820 MPSoC module with Xilinx Zynq UltraScale+, 1 GByte (2 x 512 MByte) DDR4 SDRAM with 32-Bit width, 2 x 32 MByte Flash memory, B2B connectors: 2 x 100 pin and 1 x 60 pin, carrier board available. Overview available models		4 x 5
TE0714 FPGA module with Xilinx Artix-7 35T or 50T, 16 MByte QSPI Flash, smallest module with tranceivers, industrial temperature range, carrier board available. Overview available models		4 x 3
TE0745 SoC module with Xilinx Zynq-7030 or Zynq-7045, 1 GByte DDR3 SDRAM, 32 MByte SPI Flash, 1 GBit Ethernet, 8 x GTX (7030: 4 GT), RTC, industrial temperature range, carrier board available. Overview available models		5.2 x 7.6
TE0841 FPGA module with Xilinx Kintex UltraScale KU35/KU40, 2 GByte DDR4, 64 MByte SPI Boot Flash, 3.2 mm mounting holes for skyline heat spreader, serial transceiver: GTH 8 Lanes (all), industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0808 UltraSOM+ MPSoC module with Xilinx Zynq UltraScale+, 4 x 512 MByte (2 GByte) 64-Bit DDR4 memory, 2 x 256 MBit (2 x 32 MByte) SPI Boot Flash (dual parallel), B2B connectors: 4 x 160 pin, serial transceiver: GTR 4 (all) + GTH 16 (all), industrial temperature range, carrier board and starter kit available. Overview available models		5.2 x 7.6
TE0725LP FPGA module with Xilinx Artix-7 100T, 32 MByte Flash, optional HyperRAM or HyperFlash, 2 x 50 pin with 2,54 mm pitch, VIN 3,3V or 1,8V, commercial temperature range available (industrial temperature range on request). Overview available models		7.3 x 3.5
TE0725 FPGA module with Xilinx Artix-7 15T, 35T or 100T, 32 MByte Flash, from revision 03 64 MBit HyperRAM, 2 x 50 Pin with 2.54 mm pitch, optional Fiber Optic Module (125/250 or 1000 MBit/s), commercial temperature range available (industrial temperature range on request). Overview available models		7.3 x 3.5
TE0726 "ZynqBerry" SoC module with Xilinx Zynq-7010 with Raspberry Pi form factor, 512 MByte (128 MByte) DDR3L, 16 MByte SPI Flash, Micro SD socket, 4 USB with power switches, 100 MBit Ethernet, DSI and CSI-2 Connector (display and camera), HAT header with 26 I/O's, commercial temperature range. Overview available models		like Raspberry Pi Model 2
TE0729 SoC module with Xilinx Zynq-7020, 512 MByte DDR3, 32 MByte QSPI-Flash, 1 x 10/100/1000 Mbps Ethernet transceiver PHY, 2 x 10/100 Mbps Ethernet transceiver PHYs, RTC, equipped with sulfur resistant resistors, industrial temperature range, carrier board and starter kit available. Overview available models		5.2 x 7.6
TE0723 "ArduZynq" SoC module with Xilinx Zynq-7010 with Arduino Shield form factor, 128 MByte DDR3L; version M: 512 MByte DDR3L, 16 MByte SPI Flash, Hi-Speed USB2.0 ULPI Transceiver, 23 FPGA I/O's on B2B connectors available, commercial temperature range. Overview available models		Arduino shield
TE0782 SoC module with Xilinx Zynq-7035, Zynq-7045 or Zynq-7100, 1 GByte DDR3, 32 MByte QSPI Flash, 4 GByte eMMC (optional up to 64 GByte), 2 x Gigabit Ethernet Tranceiver, RTC, optional 2 x 8 MByte HyperRAM (max. 2 x 32 MByte), 16 GTX high-performance Tranceiver Lanes, industrial temperature range, test fixture available. Overview available models		8.5 x 8.5
TE0722 "DIPFORTy1 Soft Propeller" Propeller compatible DIP40 pinout module with Xilinx Zynq-7010, 16 MByte SPI Flash (primary boot), 33.333 MHz Clock (MEMS Oscillator), Total user accessible PL I/O: 46 (+3 Input only), MicroSD Card socket, commercial temperature range. Overview available models		1.8 x 5.1
TE0728 SoC module with Xilinx automotive Zynq-7020, 512 MByte DDR3, 16 MByte QSPI Flash, 2 x 100 MBit Ethernet Transceiver (PHY), 76 single ended I/O, 24 LVDS pairs (48 I/O) and 42 MIO available on B2B connectors, CAN Transceiver (PHY), automotive temperature range, carrier board available. Overview available models		6 x 6
TE0715 SoC module with Xilinx Zynq-7015 or Zynq-7030, 1 GByte DDR3, 32 MByte QSPI Flash, 1 GBit Ethernet, 4 GTP/GTX Tranceivers, Programmable Clock Generator: Transceiver Clock (default 125 MHz), industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0712 FPGA module with Xilinx Artix-7 100T or 200T, 1 GByte DDDR3, 32 MByte Quad-SPI Flash, 100 MBit Ethernet, 4 Multi Gigabit transceivers, industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0711 FPGA module with Xilinx Artix-7 35T or 100T, 32 MByte QSPI Flash, 100 MHz MEMS oscillator, 178 FPGA I/O's (84 differential pairs), 3 User LED's, industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0710 FPGA module with Xilinx Artix-7 35T or 100T, 512 MByte DDR3, 32 MByte QSPI Flash, 2 x 100 MBit Ethernet, industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0720 SoC module with Xilinx Zynq-7020, 256 MByte/512 MByte DDR3L/1 GByte DDR3 (depending on version), 32 MByte SPI Flash, 4 GByte e-NAND (up to 32 GByte), 152 FPGA I/O's available on B2B connectors, RTC, 3 User LED's, automotive, industrial and commercial temperature range, carrier board and starter kit available. Overview available models		4 x 5
TE0741 FPGA module with Xilinx Kintex-7 70T, 160T, 325T or 410T, 32 MByte Quad-SPI Flash, max. GTX transceiver data rate 10,3125 Gb/s (default 6,6 Gb/s), 8 Multi Gigabit Transceivers, 2 User LED, 1 DONE PFGA pin LED, industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0630 FPGA module with Xilinx Spartan-6 LX45, LX75 oder LX150, 128 MByte DDR3, 8 MByte SPI Flash, up to 40 different and up to 109 single end FPGA I/O pins available on B2B connectors, 1.2 V, 1.5 V, 2.5 V = VCCAUX and 3.3 V power rails, 4 User LED, 1 User Push-Button, 2 User DIP Switches, industrial temperature range, carrier board available. Overview available models		4 x 5
TE0600 GigaBee module with Xilinx Spartan-6 LX45, LX100 or LX150, two independent 128 MByte DDR SDRAM banks (optional 2 x 512 MByte DDR SDRAM), 16 MByte SPI Flash, 10/100/1000 tri-speed GBit Ethernet transceiver (PHY), JTAG Port, industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0320 Module with Xilinx Spartan-3A, 1 GBit DDR RAM up to 1333 MByte/s bandwidth, 32 MBit SPI Flash, 109 I/Os (+ 10 dual-purpose pins) available on B2B connectors, 4 LED, 2 Push Buttons, 8 DIP Switches, industrial and commercial temperature range, carrier board available. Overview available models		6.8 x 4.8
TE0300 FPGA module with Xilinx Spartan-3E, 32 MBit SPI Flash, 512 MBit DDR RAM up to 666 MByte/s bandwidth, 3 on-board DC-DC converters for high efficieny, 104 I/Os + 6 Inputs available on B2B connectors, industrial and commercial temperature range, carrier board available. Overview available models		4.05 x 4.75
TE0140 Module with Xilinx Spartan-3, USB 2.0 transceiver, 16 KBit EEPROM, 120 available I/O's on B2B connectors, one LED, 1 push button, commercial temperature range, carrier board available. Overview available models		5.07 x 4.36

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FPGA Module with Xilinx Artix-7 XC7A35T-2CSG325I, 3,3 V Configuration, 4 x 3 cm

Xilinx Artix-7 XC7A35T-2CSG325I, 16 MByte QSPI Flash memory, 2 x 100-pin B2B connectors, 4 GTP lanes, size: 4 x 3 cm

From 50.40 € (59.98 € gross) *

TE0714-03-35-2I

In Stock: 0

SoM with Xilinx Zynq XC7Z045-3FFG676E, 1 GByte DDR3 SDRAM, 5.2 x 7.6 cm

Xilinx Zynq SoC XC7Z045-3FFG676E, 1 GByte 32-Bit wide DDR3 SDRAM, 64 MByte QSPI Flash, USB 2.0 OTG, 250 I/O's, size: 5.2 x 7.6 cm

From 899.40 € (1,070.29 € gross) *

TE0745-02-93E11-A

In Stock: 7

SoC Module with Intel Cyclone 10 GX, 2 GByte DDR3L SDRAM, 6 x 8 cm

Intel Cyclone 10 GX 10CX220YF780I5G, 2 GByte DDR3L SDRAM, 256 MByte SPI Flash, 226 I/O's, Gigabit Ethernet, EEPROM, 6 x 8 cm

From 298.80 € (355.57 € gross) *

TEI0006-02-220-5I

In Stock: 0

XMOD FTDI JTAG Adapter - not compatible with Xilinx Tools

Universal USB adapter with two channels based on FTDI FT2232H USB2 HS Interface chip and NOT compatible with Xilinx Tools.

From 19.20 € (22.85 € gross) *

TE0790-03L

In Stock: 105

MPSoC Module with Xilinx Zynq UltraScale+ ZU3CG-1E, 2 GByte DDR4, 5.2 x 7.6 cm

Xilinx Zynq UltraScale+ XCZU3CG-1SFVC784E, 2 GByte DDR4, 128 MByte QSPI Boot Flash, size: 5.2 x 7.6 cm

From 209.40 € (249.19 € gross) *

TE0803-03-3AE11-A

In Stock: 9

FPGA Module with Spartan-6 LX45, 02I, 128 MByte DDR3, Mini-USB 2.0

Xilinx Spartan-6 XC6SLX45-2CSG484I, Mini-USB 2.0 high-speed device, 16-Bit-wide 1 GBit (128 MByte) DDR3 SDRAM, 64 MBit (8 MByte) SPI Flash memory

From 89.40 € (106.39 € gross) *

TE0630-02I

In Stock: 91

MPSoC Module with Xilinx Zynq UltraScale+ ZU4EV-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm

Xilinx Zynq UltraScale+ XCZU4EV-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 8 GByte e.MMC Memory, size: 4 x 5 cm

From 401.40 € (477.67 € gross) *

TE0820-03-4DE21FA

In Stock: 85

Heatsink SuperGrip for TE0803

High Performance maxiFLOW/superGRIP Heatsink, 23 x 23 x 7,5 mm BGA Aluminium, top mounting

21.00 € (24.99 € gross) *

29665

In Stock: 3

Heatsink SuperGrip for TE0807 / TE0808

High Performance maxiFLOW/superGRIP Heatsink, 31 x 31 x 17,5 mm, BGA Aluminium, top mounting

24.00 € (28.56 € gross) *

29664

In Stock: 0

MPSoC Module with Xilinx Zynq UltraScale+ ZU2EG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm

Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 8 GByte e.MMC, size: 4 x 5 cm

From 179.40 € (213.49 € gross) *

TE0820-03-2BE21FA

In Stock: 0

UltraSOM+ MPSoC Module with Zynq UltraScale+ ZU6EG and mounted Heat Spreader

MPSoC with integrated Xilinx Zynq UltraScale+ XCZU6EG-1FFVC900E, 4 GByte DDR4 SDRAM, 128 MByte Flash memory, 20 x serial transceiver, size: 5.2 x 7.6 cm

From 654.50 € (778.86 € gross) *

TE0808-04-6BE21-AK

In Stock: 6

MPSoC Module with Xilinx Zynq UltraScale+ ZU2CG-1I, 2 GByte DDR4 SDRAM, 4 x 5 cm

Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784I, 2 GByte DDR4, 128 MByte QSPI Boot Flash, 8 GByte e.MMC Memory, size: 4 x 5 cm

From 179.40 € (213.49 € gross) *

TE0820-03-2AI21FA

In Stock: 0

SoM with Xilinx Zynq-7030 and Heat Spreader,1 GByte DDR3 SDRAM, 5,2 x 7,6 cm

Xilinx Zynq SoC XC7Z030-1FBG676I, 1 GByte 32-Bit wide DDR3 SDRAM, 64 MByte QSPI Flash, with mounted heat spreader, size: 5.2 x 7.6 cm

From 327.00 € (389.13 € gross) *

TE0745-02-71I11-AK

In Stock: 0

UltraSOM+ MPSoC Module with Zynq UltraScale+ XCZU9EG-2FFVC900I, 4 GB DDR4

MPSoC with Xilinx Zynq UltraScale+ XCZU9EG-2FFVC900I, 4 GByte DDR4 SDRAM, 128 MByte SPI Boot Flash, size: 5.2 x 7.6 cm, 20 x high-speed serial transceiver

From 1,049.30 € (1,248.67 € gross) *

TE0808-04-9GI21-A

In Stock: 0

UltraSOM+ MPSoC Module with Zynq UltraScale+ ZU9EG and mounted Heat Spreader

MPSoC with Xilinx Zynq UltraScale+ XCZU9EG-1FFVC900E, 4 GByte DDR4 SDRAM, 128 MByte SPI Boot Flash, 20 x serial transceiver, size: 5.2 x 7.6 cm

From 724.50 € (862.16 € gross) *

TE0808-04-9BE21-AK

In Stock: 0

SoC Module with Xilinx Zynq XC7Z020-1CLG400I, 1 GByte DDR3L, 6 x 4 cm

Xilinx Zynq XC7Z020-1CLG400I, Dual-core ARM Cortex-A9, 1 GByte DDR3L SDRAM, 32 MByte QSPI Flash memory, 1 GBit Ethernet PHY, size: 6 x 4 cm

From 119.40 € (142.09 € gross) *

TE0724-03-20-1I

In Stock: 34

SmartBerry FPGA Module with Microsemi SmartFusion2 M2S010 SoC, 256 MByte DDR3L

Raspberry Pi-compatible FPGA module with Microsemi M2S010-VFG400, 256 MByte DDR3L Flash memory, 1 x GBit Ethernet, 4 x Pmod ports, 1 x SD card socket, 1 x RGB LED

89.90 € (106.98 € gross) *

TEM0002-02-010CA

In Stock: 0

TE0808-04-9BE21-AS Starter Kit

TE0808 MPSoC module (Xilinx Zynq UltraScale+ XCZU9EG-1FFVC900E, 4 GByte DDR4 SDRAM, 128 MByte SPI Boot Flash, size: 5.2 x 7.6 cm) plus heatsink on a TEBF0808 carrier board in a Core Mini-ITX Enclosure. Accessories included.

From 1,199.40 € (1,427.29 € gross) *

TE0808-04-9BE21-AS

In Stock: 0

MPSoC Module with Xilinx Zynq UltraScale+ ZU3CG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm

Xilinx Zynq UltraScale+ XCZU3CG-1SFVC784E, 2 GByte DDR4 SDRAM, 128 MByte SPI Boot Flash, 8 GByte e.MMC Memory, size: 4 x 5 cm

From 191.40 € (227.77 € gross) *

TE0820-03-3AE21FA

In Stock: 30

MPSoC Module with Xilinx Zynq UltraScale+ ZU4CG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm

Xilinx Zynq UltraScale+ XCZU4CG-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 8 GByte e.MMC Memory, size: 4 x 5 cm

From 329.40 € (391.99 € gross) *

TE0820-03-4AE21FA

In Stock: 0

UltraSOM+ MPSoC Module with Zynq UltraScale+ XCZU6EG-1FFVC900E, 4 GB DDR4

MPSoC with integrated Xilinx Zynq UltraScale+ XCZU6EG-1FFVC900E, 4 GByte DDR4 SDRAM, 128 MByte Flash memory, size: 5.2 x 7.6 cm, 20 high speed serial transceivers

From 629.30 € (748.87 € gross) *

TE0808-04-06EG-1EE

In Stock: 2

MPSoC Module with Xilinx Zynq UltraScale+ ZU4CG-1E, 2 GByte DDR4, 5.2 x 7.6 cm

Xilinx Zynq UltraScale+ XCZU4CG-1SFVC784E, 2 GByte DDR4, 128 MByte QSPI Boot Flash, size: 5.2 x 7.6 cm

From 317.40 € (377.71 € gross) *

TE0803-03-4AE11-A

In Stock: 5

UltraSOM+ MPSoC Module with Zynq UltraScale+ XCZU15EG-1FFVC900E, 4 GB DDR4

MPSoC with Xilinx Zynq UltraScale+ XCZU15EG-1FFVC900E, 4 GByte DDR4 SDRAM, 128 MByte SPI Boot Flash, 20 x serial transceiver, size: 5.2 x 7.6 cm

From 809.40 € (963.19 € gross) *

TE0808-04-BBE21-A

In Stock: 0

MPSoC Module with Xilinx Zynq UltraScale+ ZU7EV, 4 GByte DDR4

Xilinx Zynq UltraScale+ XCZU7EV-1FBVB900E, 4 GByte DDR4, 128 MByte QSPI Boot Flash, size: 5.2 x 7.6 cm

From 840.00 € (999.60 € gross) *

TE0807-02-7DE21-A

In Stock: 0

UltraSOM+ MPSoC Module with Zynq UltraScale+ XCZU6EG-1FFVC900E, 4 GB DDR4, LP

Low Profile Terminal/Socket Strips (1 mm), Xilinx Zynq UltraScale+ XCZU9EG-1FFVC900E, 4 GByte DDR4 SDRAM, 128 MByte SPI Boot Flash, size: 5.2 x 7.6 cm, 20 x high speed serial transceiver

From 629.30 € (748.87 € gross) *

TE0808-04-06EG-1E3

In Stock: 10

Micromodule with Xilinx Kintex UltraScale KU40, 2 GByte DDR4, low profile

Xilinx Kintex UltraScale FPGA XCKU040-1SFVA784I, 2 GByte DDR4, 64 MByte SPI Boot Flash, serial transceiver: GTH 8 lanes, size: 4 x 5 cm, low profile

From 930.00 € (1,106.70 € gross) *

TE0841-02-41I21-L

In Stock: 0

Micromodule with Xilinx Kintex UltraScale KU040, 1C,2 GByte DDR4, 4 x 5 cm

Xilinx Kintex UltraScale KU35 FPGA XCKU040-1SFVA784C, 2 GByte 16-Bit width DDR4 (2 x 512 MByte), 64 MByte SPI Boot Flash, serial transceiver: GTH 8 lanes, size: 4 x 5 cm

From 719.40 € (856.09 € gross) *

TE0841-02-41C21-A

In Stock: 2

Micromodule with Xilinx Kintex UltraScale KU035, 2 GByte DDR4, 4 x 5 cm

Xilinx Kintex UltraScale KU35 FPGA XCKU035-1SFVA784C, 2 GByte 16-Bit width DDR4, 64 MByte SPI Boot Flash, serial transceiver: GTH 8 lanes, size: 4 x 5 cm

From 597.00 € (710.43 € gross) *

TE0841-02-31C21-A

In Stock: 0

UltraSOM+ MPSoC Module with Zynq UltraScale+ ZU15EG and mounted Heat Spreader

MPSoC with Xilinx Zynq UltraScale+ XCZU15EG-1FFVC900E, 4 GByte DDR4 SDRAM, 64 MByte SPI Boot Flash, size: 5.2 x 7.6 cm, 20 x serial transceiver

From 834.00 € (992.46 € gross) *

TE0808-04-BBE21-AK

In Stock: 0

UltraSOM+ MPSoC Module with Zynq UltraScale+ XCZU6EG-1FFVC900E, 4 GB DDR4

MPSoC with integrated Xilinx Zynq UltraScale+ XCZU6EG-1FFVC900E, 4 GByte DDR4 SDRAM, 128 MByte Flash memory, size: 5.2 x 7.6 cm, 20 high speed serial transceivers

From 629.30 € (748.87 € gross) *

TE0808-04-6BE21-A

In Stock: 1

SoM with Xilinx Zynq XC7Z045-1FBG676C, 1 GByte DDR3 SDRAM, 5.2 x 7.6 cm

Xilinx Zynq SoC XC7Z045-1FBG676C,1 GByte 32-Bit wide DDR3 SDRAM, 64 MByte QSPI Flash, USB 2.0 OTG, 250 I/O's, size: 5.2 x 7.6 cm

From 639.20 € (760.65 € gross) *

TE0745-02-91C11-A

In Stock: 27

MPSoC Module with Xilinx Zynq UltraScale+ ZU3EG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm

Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E, 2 GByte DDR4 SDRAM, 128 MByte SPI Boot Flash, 4 GByte e.MMC, size: 4 x 5 cm

295.90 € (352.12 € gross) * €369.00 *

TE0820-03-03EG-1EA

In Stock: 1

FPGA Module with Xilinx Artix-7 XC7A50T-2CSG325I, 3,3V Configuration, 4 x 3 cm

Xilinx XC7A50T-2CSG325I, 16 MByte QSPI Flash memory, 2 x 100-pin B2B connectors, 4 GTP Lanes, size: 4 x 3 cm

From 71.40 € (84.97 € gross) *

TE0714-03-50-2I

In Stock: 22

MPSoC Module with Xilinx Zynq UltraScale+ ZU2EG-1E, 2 GByte DDR4, 5.2 x 7.6 cm

Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E, 2 GByte DDR4, 128 MByte QSPI Boot Flash, size: 5.2 x 7.6 cm

279.90 € (333.08 € gross) * €369.00 *

TE0803-01-02EG-1EA

In Stock: 5

UltraSOM+ MPSoC Module with Zynq UltraScale+ XCZU9EG-1FFVC900E, 4 GByte DDR4

MPSoC with Xilinx Zynq UltraScale+ XCZU9EG-1FFVC900E, 4 GByte DDR4 SDRAM, 128 MByte SPI Boot Flash, size: 5.2 x 7.6 cm, 20 x serial transceiver

From 699.30 € (832.17 € gross) *

TE0808-04-9BE21-A

In Stock: 0

Baseboard for TE0724

Developement carrier board for the TE0724 and compatible modules.

From 58.80 € (69.97 € gross) *

TEB0724-02

In Stock: 0

MPSoC Module with Xilinx Zynq UltraScale+ ZU3EG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm

Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 8 GByte e.MMC Memory, size: 4 x 5 cm

From 221.40 € (263.47 € gross) *

TE0820-03-3BE21FA

In Stock: 45

FPGA Module with Spartan-6 LX150, 02IV, 128 MByte DDR3, Mini-USB 2.0

Xilinx Spartan-6 XC6SLX150-2CSG484I; Mini-USB 2.0 high-speed device; 16-Bit-wide 1 GBit (128 MByte) DDR3 SDRAM; 64 MBit (8 MByte) SPI Flash memory

From 143.40 € (170.65 € gross) *

TE0630-02IV

In Stock: 32

SoC Module with Xilinx Zynq XC7Z010-1CLG400I, 1 GByte DDR3L, 6 x 4 cm

Xilinx Zynq XC7Z010-1CLG400I, Dual-core ARM Cortex-A9, 1 GByte DDR3L SDRAM, 32 MByte QSPI Flash memory, 1 GBit Ethernet PHY, size: 6 x 4 cm

From 97.30 € (115.79 € gross) *

TE0724-03-10-1I

In Stock: 0

FPGA Module with Spartan-6 LX75, 02IBF, 128 MByte DDR3, Mini-USB 2.0

Xilinx Spartan-6 LX75 FPGA micro-module, mini-USB 2.0 high-speed device, 16-Bit-wide 1 GBit (128 MByte) DDR3 SDRAM, 64 MBit (8 MByte) SPI Flash memory

From 113.40 € (134.95 € gross) *

TE0630-02IBF

In Stock: 0

MPSoC Module with Xilinx Zynq UltraScale+ ZU5EV-1E, 2 GByte DDR4, 5.2 x 7.6 cm

Xilinx Zynq UltraScale+ XCZU5EV-1SFVC784E, 2 GByte DDR4, 128 MByte QSPI Boot Flash, size: 5.2 x 7.6 cm

From 599.40 € (713.29 € gross) *

TE0803-03-5DE11-A

In Stock: 19

TE0706 - Carrierboard for Trenz Electronic Modules with 4 x 5 cm Form factor

Simple carrier board for Trenz Electronic 4 x 5 modules. It is mainly for the use with TE0720 and TE0715 modules.

From 89.40 € (106.39 € gross) *

TE0706-02

In Stock: 0

Cyclone 10 LP RefKit 10CL055 Development Board, 32 MByte SDRAM, 16 MByte Flash

C10 LP RefKit mit Intel Cyclone 10LP 10CL055, 64 MBit (optional 256 MBit possible) SDRAM, 64 MBit (optional 128 MBit possible) User Quad-SPI Flash, 64 MBit PseudoSRAM

129.00 € (153.51 € gross) *

TEI0009-02-055-8CA

In Stock: 37

MPSoC Module with Xilinx Zynq UltraScale+ ZU2EG-1E, 2 GByte DDR4, 4 x 5 cm, LP

Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 8 GByte e.MMC Memory, size: 4 x 5 cm, low profile

From 185.40 € (220.63 € gross) *

TE0820-03-2BE21FL

In Stock: 11

XMOD FTDI JTAG Adapter - Xilinx compatible

Universal USB adapter with 2 channels based on FTDI FT2232H USB2 HS interface chip.

From 27.20 € (32.37 € gross) *

TE0790-03

In Stock: 6

Heat Spreader for Trenz Electronic MPSoC TE0807

Cooling solution especially desgined for Trenz Electronic MPSoC TE0807 (from REV02). Important note: This heatsink requires a so-called gapfiller to be installed to the module.

29.00 € (34.51 € gross) *

KK0807-02

In Stock: 0

UltraITX+ Baseboard for Trenz Electronic TE080X UltraSOM+

The Trenz Electronic TEBF0808 carrier board is a baseboard for the Xilinx Zynq Ultrascale+ MPSoC modules TE0803, TE0807 und TE0808

From 479.40 € (570.49 € gross) *

TEBF0808-04A

In Stock: 86

TEB0911 UltraRack+ MPSoC Board with Xilinx Zynq UltraScale+ ZU9,6 FMC connectors

MPSoC Board with Xilinx Zynq UltraScale+ XCZU9EG-1FFVB1156E, 64bit DDR4 SODIMM (PS connected), M2 PCIe SSD (1-Lane), eMMC (bootable), Dual QSPI Flash (bootable)

From 1,860.00 € (2,213.40 € gross) *

TEB0911-04-9BEX1FA

In Stock: 0