Trenz Electronic FPGA and SoC Modules

The micromodules designed by Trenz Electronic feature modern FPGA's. With small size and high-density connectors, they can be used nearly everywhere.

Gigabit Ethernet and integrated USB guarantees high data transfer rates to a host PC.

Other assembly options for cost or performance optimization plus high volume prices available on request.

According to past experience and the current official update from AMD regarding the Zynq-7000 series (28nm) about a lifetime extension until at least 2035, the expected life cycle can be interpreted as an indicator for a minimum lifetime of the corresponding series.
Trenz Electronic will not discontinue series as long as key components are available.
Through our membership in the Xilinx Certified Partner Program, we learn as early as possible about upcoming discontinuations and prepare transitions to possible successors to ideally ensure a seamless transition.

Trenz Electronic Module and Carrier Board Life Cycles
Carrier boards are no longer produced if all suitable modules go EOL.

Products with integrated AMD FPGA

Series	Device Familiy	Carrier Board	Launch Year	Expected Life Cycle (in years)
TE0140	Spartan™ 3	TE0143	2004	17
TE0300	Spartan™ 3E		2005	17
TE0320	Spartan™ 3A	TE0323	2005	17
TE0600	Spartan™ 6 Ethernet	TE0603	2010	20
TE0630	Spartan™ 6 USB	TE0303	2011	19
TE07xx	Zynq™ 7000 Artix™ 7 Kintex™ 7	TEBA07xx, TEBB07xx, TEB07xx, TEBT07xx, TE070x	2013	22
TE08xx	Zynq™ UltraScale+™ Kintex™ UltraScale™	TEBA08xx, TEBF08xx, TEBT08xx	2016	19
TE09xx	Versal™ AI Edge		2022	15

Products with integrated Intel FPGA

Series	Device Family	Carrier Board	Launch Year	Expected Life Cycle (in years)
TEI0001	MAX 10 FPGA	-	2014	21
TEI0003	Cyclone 10	-	2017	18
TEI0006	Cyclone 10	TEIB0006	2017	18
TEI0009	Cyclone 10	-	2017	18
TEI0010	MAX 10 FPGA	-	2014	21
TEI0180	AGILEX	-	2019	16
TEI1000	Stratix® 10	-	2016	19

Modules (sorted by publication date)	Photo	Form factor (cm)
TE0813 MPSoC module with Xilinx Zynq UltraScale+, 2 GByte DDR4 SDRAM and 128 MByte QSPI Boot Flash dual parallel, Graphic Processing Unit (EG + EV) and Video Codec Unit (EV) depending on the variant, plug-on module with 4 x 240-pin B2B connectors. Extended temperature range. Overview available models		5.2 x 7.6
TE0812 The Trenz Electronic TE0812 is a powerful and also space-qualified evaluation board, based on a Xilinx Zynq UltraScale+ MPSoC. Equipped with 4 GByte DDR4 SDRAM ECC, dual 64 MByte (resp. 128 MByte) serial flash memory for configuration and operation, dual 4 Mbit MRAM, dual 32 GByte e.MMC and powerful switch-mode power supplies for all on-board voltages. Industrial temperature range. Overview available models		9 x 9
TE0865 The Trenz Electronic TE0865 is a high performance MPSoC module integrating a Xilinx Zynq UltraScale+. Furthermore, the module is equipped with 4 GByte DDR4 SDRAM with ECC on PS, 4 GByte DDR4 SDRAM on PL, 256 MByte Flash memory for configuration and operation, Gigabit Ethernet PHY and powerful switch-mode power supplies for all on-board voltages. Extended temperature range. Test board available. Overview available models		7.5 x 10
CR00040 Arrow Electronics and Trenz Electronic developed a very small and comprehensive module for qualified CO₂ measurements to support customers in their development and end products. The small CRUVI module includes Sensirion's new miniature CO₂ sensor. The SCD4x family has also an integrated humidity sensor and temperature sensor. SMD compatibility and extremely compact dimensions enable cost-efficient and space-saving integration of customer designs. The CRUVI module is available with and without CO₂ sensor. Overview available models		3.2 x 1.8
TEI0022 SoC board based on Intel Cyclone V FPGA, an Ethernet PHY, one GByte DDR3 SDRAM per HPS and FPGA and one 32 MByte Quad SPI Flash memory for configuration and operation per HPS and FPGA, and powerful switching-mode power supplies for all on-board voltages. Overview available models		13 x 16
TE0716 SoM (System on Module) based on Xilinx Zynq-7000 SoC with 1 GByte SDRAM, 32 MByte of SPI Flash memory, 10 x 12-Bit Low Power SAR ADCs, 512 Kb serial EEPROM, Gigabit Ethernet PHY transceiver, an USB PHY transceiver, a single chip USB2.0 to UART/JTAG interface (Xilinx license included), and powerful switching-mode power supplies for all on-board voltages, commercial temperature range. Overview available models		4.5 x 6.5
TE0835 The Trenz Electronic TE0835 is based on the Xilinx Zynq UltraScale+ RFSoC. The module is equipped with 4 x 1 GByte DDR4 SDRAM memory, 2 x 64 MByte SPI Flash memory, USB2.0, Ethernet transceiver and 2 x Samtec Razor Beam Board to Board (B2B) connectors. Extended temperature range. Carrier board available. Overview available models		6.5 x 9
TEF0010 FMC-Modul FMC module with Xilinx Artix-7 FPGA and 4 x 16-bit GMSL serializers. Overview available models		6.9 x 8.4
TEC810 The Trenz Electronic TEC0810 is a CompactPCI Serial Card (3U form factor) that can be used as a base for Trenz Electronic modules with a form factor of 5.2 x 7.6 cm. For configuration and service, JTAG and UART are available via USB bridge and one Gigabit Ethernet on the front panel. 48 differential signals are available on the backplane. Overview available models		-
TE0727 The ZynqBerryZero is a SoC module with integrated Xilinx Zynq-7010 FPGA and the form factor of the Raspberry Pi Zero. Furthermore, the small board is equipped with 512 MByte DDR3L SDRAM, 16 MByte Flash and various connectors, such as two microUSB connectors, a micro SD card slot, a mini HDMI and a CSI-2 connector (camera). Extended temperature range. Overview available models		3 x 6.5
TE0823 MPSoC module with a low-power Xilinx Zynq UltraScale+ ZU3, 1 GByte LPDDR4 with low power consumption, 128 MByte QSPI Boot Flash, 8 GByte e.MMC memory, Gigabit Ethernet transceiver PHY, high speed USB2-ULPI transceiver OTG, 132 x HP PL I/Os, 4 GTR (for USB3, SATA, PCIe, DP) and 14 x PS MIOs. Industrial temperature range. Carrier board available. Overview available models		4 x 5
TE0802 MPSoC Development Board with Xilinx Zynq UltraScale+ ZU2, 1 GByte LPDDR4, 32 MByte SPI Flash, USB 3.0 Host (type A connector) and DisplayPort. Other assembly options for the FPGA and the memory chips are available. Extended temperature range. Overview available models		10 x 10
TE0821 MPSoC module integrating a Xilinx Zynq UltraScale+ ZU3EG, 2 GByte DDR4 SDRAM, 128 MByte QSPI-Boot Flash, 4 high-speed interfaces for serial I/Os (HSSIO), 34 x High Performance and 96 x High Density PL I/Os, 14 x PS MIOs, 4 x serial PS GTR transceiver, Graphic Processor Unit (GPU), extended and industrial temperature range. This module is pin compatible with TE0820 MPSoC modules. Carrier board available. Overview available models		4 x 5
TEI0006 An industrial grade module based on Intel Cyclone 10 GX. Intel Cyclone 10 GX device family delivers higher core, transceiver and I/O performance than the previous generation of low cost FPGAs. Carrierboard available. Overview available models		6 x 8
TE0890 "S7 Mini" FPGA module integrating a Xilinx Spartan-7, 64 MBit HyperRAM DRAM, 64 MBit Config PROM for dual-boot and/or SW code storage and dual-pinout DIP-40 or 50mil 80 pin connectors for 32 or 64 FPGA 3.3V I/Os. The module is footprint compatible with 7S6, 7S15, 7S50 FTGB-196 devices. Overview available models		2.7 x 5.2
TEC0117 "GOWIN LittleBee" Low cost FPGA module integrating a GOWIN LittleBee 1NR9 FPGA with 8 MByte internal SDRAM and 8 MByte SPI Flash for user applications. It's compatible to the Arduino MKR standard. Overview available models		2.5 x 6.15
TEC0089 DesignWare ARC EM Software Development Plattform The DesignWare® ARC® EM Software Development Platform is a flexible platform for rapid software development on ARC EM processors and subsystems. It is intended to accelerate software development and debug of ARC EM processor-based systems for a wide range of ultra-low power embedded applications such as IoT, sensor fusion, and voice applications. It includes an FPGA-based hardware board with commonly used peripherals and interfaces for extensibility. Downloadable platform packages containing different hardware configurations enable the board to be programmed with different ARC EM processors and subsystems. Overview available models		-
TEC0850 CompactPCI Serial Card CompactPCI Serial card integrating a Xilinx Zynq UltraScale+ MPSoC, one DDR4 SDRAM SODIMM socket with 64bit wide data bus, max. dual 512 MByte Flash memory for configuration and operation, 24 Gigabit transceivers on PL side and 4 on PS side, powerful switch-mode power supplies for all onboard voltages, USB2 and USB3 FIFO bridges and a large number of configurable I/Os available on the CompactPCI Serial backplane connectors. Overview available models		10 x 16
TEF0008 FMC Card FPGA to Mezzanine Card (FMC) based on VITA 57.1 FMC HPC Standard, with four SFP+ 10 GBit ports for fiber optical SFP modules. It is inteded for use on a FMC HPC carrier and can not be used stand-alone. Overview available models		6.9 x 8.4
TE0783 A high-performance, industrial-grade SoM (System on Module) based on Xilinx Zynq-7000 SoC with 1 GByte RAM (32bit wide DDR3) connected to PS, 2 GByte RAM (64bit wide DDR3) connected to PL, 4 GByte eMMC, 16 GTX high-performance transceiver lanes, 32 MByte QSPI Flash memory for conﬁguration and operation, and powerful switch-mode power supplies for all on-board voltages. Overview available models		8.5 x 8.5
TEF0007 FMC Card DisplayPort 1.2 compatible FMC card with data rates up to 5.4 Gbps and sink and source DP connector. Overview available models		6.9 x 8.4
TEM0001 "SMF2000" FPGA modul with Microsemi SmartFusion2 and 8 MByte Flash. SmartFusion2 combines a 166 MHz Cortex-M3 MCU including 256 KByte Flash and 80 KByte SRAM, as well as 12 kLUT FPGA Core Logic. The TEM0001 is ideal for evaluation and rapid prototying. It's compatible to the Arduino MKR standard. Overview available models		2.5 x 6.15
TEI0003 "CYC1000" FPGA module with an integrated Intel Cyclone 10 LP FPGA, 8 MByte SDRAM, 2 MByte Flash and a LIS3DH 3-axis sensor. It's compatible to the Arduino MKR standard. Overview available models		2.5 x 6.15
TEL0001 "LXO2000" FPGA module integrating a Lattice XO2-4000 and on-board USB/JTAG. It's compatible to the Arduino MKR standard. Overview available models		2.5 x 6.15
TEI0001 "MAX1000" FPGA IoT Maker Board that has been designed for end-to-end application development and optimised for cost. The Arrow MAX1000 board can be installed directly into a custom application or integrated on to a completely separate board. At the heart of the maker board is a compact (11x11mm) Intel MAX10 FPGA with 8000 logic elements. This single chip includes integrated flash memory, a 1Msps 12bit ADC for analogue signals and a 3.3V power supply. Other features include embedded SRAM, DSP blocks, instant-on within milliseconds, and the ability to implement Intel’s NIOS II soft core embedded processor to perform microcontroller tasks. Overview available models		2.5 x 6.15
TE0724 SoC module with Xilinx Zynq XC7Z010 or XC7Z020, dual-core ARM Cortex-A9 MPCore, 1 GByte DDR3L SDRAM, 32 MByte QSPI Flash memory, 1 GBit Ethernet PHY, I/O PL:80/PS:20, MAC-Adress EEPROM, 128 KBit EEProm, CAN transceiver, on-board DC/DC controller, industrial temperature range, carrier board available. Overview available models		4 x 6
TE0807 UltraSOM+ MPSoC module with Xilinx Zynq UltraScale+ ZU07EV, 4 GByte DDR4 SDRAM, 128 MByte SPI Boot Flash (dual parallel), plug-on module with 4 x 160-pin connectors, serial transceivers: GTR 4 (all) + GTH 16 (all), Graphic Processing Unit (GPU) + Video codec unit (VCU), extended temperature range, carrier board and individual cooling solution available. Overview available models		5.2 x 7.6
TEF1001 PCIe FMC Carrier integrating a Xilinx Kintex-7 FPGA (K160T, K325T or K410T), 32 MByte SPI Flash, a 4 lane PCIe, a Vita 57.1 FMC HPC Slot and a DDR3 SODIMM Socket. Overview available models		-
TE0713 FPGA module with Xilinx Zynq Artix-7, USB 3.0 to FIFO bridge, 1 GByte of DDR3L SDRAM, 32 MByte Flash memory, Plug-on module with 2 x 100-pin and 1 x 60-pin high-speed hermaphroditic strips, carrier board available. Overview available models		4 x 5
TE0803 MPSoC module with Xilinx Zynq UltraScale+, 4 x 512 MByte (2 GByte) 64-Bit DDR4 SDRAM (up to 8 GByte max), 2 x 256 MBit (2 x 32 MByte) SPI Boot Flash dual parallel (up to 512 MByte max), plug-on module with 4 x 160 pin B2B connectors, carrier board, cooling solution and starter kit available. Overview available models		5.2 x 7.6
TE0820 MPSoC module with Xilinx Zynq UltraScale+, 1 GByte (2 x 512 MByte) DDR4 SDRAM with 32-Bit width, 2 x 32 MByte Flash memory, B2B connectors: 2 x 100 pin and 1 x 60 pin, carrier board available. Overview available models		4 x 5
TE0714 FPGA module with Xilinx Artix-7 35T or 50T, 16 MByte QSPI Flash, smallest module with tranceivers, industrial temperature range, carrier board available. Overview available models		4 x 3
TE0745 SoC module with Xilinx Zynq-7030 or Zynq-7045, 1 GByte DDR3 SDRAM, 32 MByte SPI Flash, 1 GBit Ethernet, 8 x GTX (7030: 4 GT), RTC, industrial temperature range, carrier board available. Overview available models		5.2 x 7.6
TE0841 FPGA module with Xilinx Kintex UltraScale KU35/KU40, 2 GByte DDR4, 64 MByte SPI Boot Flash, 3.2 mm mounting holes for skyline heat spreader, serial transceiver: GTH 8 Lanes (all), industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0808 UltraSOM+ MPSoC module with Xilinx Zynq UltraScale+, 4 x 512 MByte (2 GByte) 64-Bit DDR4 memory, 2 x 256 MBit (2 x 32 MByte) SPI Boot Flash (dual parallel), B2B connectors: 4 x 160 pin, serial transceiver: GTR 4 (all) + GTH 16 (all), industrial temperature range, carrier board and starter kit available. Overview available models		5.2 x 7.6
TE0725LP FPGA module with Xilinx Artix-7 100T, 32 MByte Flash, optional HyperRAM or HyperFlash, 2 x 50 pin with 2,54 mm pitch, VIN 3,3V or 1,8V, commercial temperature range available (industrial temperature range on request). Overview available models		7.3 x 3.5
TE0725 FPGA module with Xilinx Artix-7 15T, 35T or 100T, 32 MByte Flash, from revision 03 64 MBit HyperRAM, 2 x 50 Pin with 2.54 mm pitch, optional Fiber Optic Module (125/250 or 1000 MBit/s), commercial temperature range available (industrial temperature range on request). Overview available models		7.3 x 3.5
TE0726 "ZynqBerry" SoC module with Xilinx Zynq-7010 with Raspberry Pi form factor, 512 MByte (128 MByte) DDR3L, 16 MByte SPI Flash, Micro SD socket, 4 USB with power switches, 100 MBit Ethernet, DSI and CSI-2 Connector (display and camera), HAT header with 26 I/O's, commercial temperature range. Overview available models		like Raspberry Pi Model 2
TE0729 SoC module with Xilinx Zynq-7020, 512 MByte DDR3, 32 MByte QSPI-Flash, 1 x 10/100/1000 Mbps Ethernet transceiver PHY, 2 x 10/100 Mbps Ethernet transceiver PHYs, RTC, equipped with sulfur resistant resistors, industrial temperature range, carrier board and starter kit available. Overview available models		5.2 x 7.6
TE0723 "ArduZynq" SoC module with Xilinx Zynq-7010 with Arduino Shield form factor, 128 MByte DDR3L; version M: 512 MByte DDR3L, 16 MByte SPI Flash, Hi-Speed USB2.0 ULPI Transceiver, 23 FPGA I/O's on B2B connectors available, commercial temperature range. Overview available models		Arduino shield
TE0782 SoC module with Xilinx Zynq-7035, Zynq-7045 or Zynq-7100, 1 GByte DDR3, 32 MByte QSPI Flash, 4 GByte eMMC (optional up to 64 GByte), 2 x Gigabit Ethernet Tranceiver, RTC, optional 2 x 8 MByte HyperRAM (max. 2 x 32 MByte), 16 GTX high-performance Tranceiver Lanes, industrial temperature range, test fixture available. Overview available models		8.5 x 8.5
TE0722 "DIPFORTy1 Soft Propeller" Propeller compatible DIP40 pinout module with Xilinx Zynq-7010, 16 MByte SPI Flash (primary boot), 33.333 MHz Clock (MEMS Oscillator), Total user accessible PL I/O: 46 (+3 Input only), MicroSD Card socket, commercial temperature range. Overview available models		1.8 x 5.1
TE0728 SoC module with Xilinx automotive Zynq-7020, 512 MByte DDR3, 16 MByte QSPI Flash, 2 x 100 MBit Ethernet Transceiver (PHY), 76 single ended I/O, 24 LVDS pairs (48 I/O) and 42 MIO available on B2B connectors, CAN Transceiver (PHY), automotive temperature range, carrier board available. Overview available models		6 x 6
TE0715 SoC module with Xilinx Zynq-7015 or Zynq-7030, 1 GByte DDR3, 32 MByte QSPI Flash, 1 GBit Ethernet, 4 GTP/GTX Tranceivers, Programmable Clock Generator: Transceiver Clock (default 125 MHz), industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0712 FPGA module with Xilinx Artix-7 100T or 200T, 1 GByte DDDR3, 32 MByte Quad-SPI Flash, 100 MBit Ethernet, 4 Multi Gigabit transceivers, industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0711 FPGA module with Xilinx Artix-7 35T or 100T, 32 MByte QSPI Flash, 100 MHz MEMS oscillator, 178 FPGA I/O's (84 differential pairs), 3 User LED's, industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0710 FPGA module with Xilinx Artix-7 35T or 100T, 512 MByte DDR3, 32 MByte QSPI Flash, 2 x 100 MBit Ethernet, industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0720 SoC module with Xilinx Zynq-7020, 256 MByte/512 MByte DDR3L/1 GByte DDR3 (depending on version), 32 MByte SPI Flash, 4 GByte e-NAND (up to 32 GByte), 152 FPGA I/O's available on B2B connectors, RTC, 3 User LED's, automotive, industrial and commercial temperature range, carrier board and starter kit available. Overview available models		4 x 5
TE0741 FPGA module with Xilinx Kintex-7 70T, 160T, 325T or 410T, 32 MByte Quad-SPI Flash, max. GTX transceiver data rate 10,3125 Gb/s (default 6,6 Gb/s), 8 Multi Gigabit Transceivers, 2 User LED, 1 DONE PFGA pin LED, industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0630 FPGA module with Xilinx Spartan-6 LX45, LX75 oder LX150, 128 MByte DDR3, 8 MByte SPI Flash, up to 40 different and up to 109 single end FPGA I/O pins available on B2B connectors, 1.2 V, 1.5 V, 2.5 V = VCCAUX and 3.3 V power rails, 4 User LED, 1 User Push-Button, 2 User DIP Switches, industrial temperature range, carrier board available. Overview available models		4 x 5
TE0600 GigaBee module with Xilinx Spartan-6 LX45, LX100 or LX150, two independent 128 MByte DDR SDRAM banks (optional 2 x 512 MByte DDR SDRAM), 16 MByte SPI Flash, 10/100/1000 tri-speed GBit Ethernet transceiver (PHY), JTAG Port, industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0320 Module with Xilinx Spartan-3A, 1 GBit DDR RAM up to 1333 MByte/s bandwidth, 32 MBit SPI Flash, 109 I/Os (+ 10 dual-purpose pins) available on B2B connectors, 4 LED, 2 Push Buttons, 8 DIP Switches, industrial and commercial temperature range, carrier board available. Overview available models		6.8 x 4.8
TE0300 FPGA module with Xilinx Spartan-3E, 32 MBit SPI Flash, 512 MBit DDR RAM up to 666 MByte/s bandwidth, 3 on-board DC-DC converters for high efficieny, 104 I/Os + 6 Inputs available on B2B connectors, industrial and commercial temperature range, carrier board available. Overview available models		4.05 x 4.75
TE0140 Module with Xilinx Spartan-3, USB 2.0 transceiver, 16 KBit EEPROM, 120 available I/O's on B2B connectors, one LED, 1 push button, commercial temperature range, carrier board available. Overview available models		5.07 x 4.36

The micromodules designed by Trenz Electronic feature modern FPGA's. With small size and high-density connectors, they can be used nearly everywhere. Gigabit Ethernet and integrated USB... read more »

Close window

Trenz Electronic FPGA and SoC Modules

The micromodules designed by Trenz Electronic feature modern FPGA's. With small size and high-density connectors, they can be used nearly everywhere.

Gigabit Ethernet and integrated USB guarantees high data transfer rates to a host PC.

Other assembly options for cost or performance optimization plus high volume prices available on request.

Trenz Electronic Module and Carrier Board Life Cycles
Carrier boards are no longer produced if all suitable modules go EOL.

Products with integrated AMD FPGA

Series	Device Familiy	Carrier Board	Launch Year	Expected Life Cycle (in years)
TE0140	Spartan™ 3	TE0143	2004	17
TE0300	Spartan™ 3E		2005	17
TE0320	Spartan™ 3A	TE0323	2005	17
TE0600	Spartan™ 6 Ethernet	TE0603	2010	20
TE0630	Spartan™ 6 USB	TE0303	2011	19
TE07xx	Zynq™ 7000 Artix™ 7 Kintex™ 7	TEBA07xx, TEBB07xx, TEB07xx, TEBT07xx, TE070x	2013	22
TE08xx	Zynq™ UltraScale+™ Kintex™ UltraScale™	TEBA08xx, TEBF08xx, TEBT08xx	2016	19
TE09xx	Versal™ AI Edge		2022	15

Products with integrated Intel FPGA

Series	Device Family	Carrier Board	Launch Year	Expected Life Cycle (in years)
TEI0001	MAX 10 FPGA	-	2014	21
TEI0003	Cyclone 10	-	2017	18
TEI0006	Cyclone 10	TEIB0006	2017	18
TEI0009	Cyclone 10	-	2017	18
TEI0010	MAX 10 FPGA	-	2014	21
TEI0180	AGILEX	-	2019	16
TEI1000	Stratix® 10	-	2016	19

Modules (sorted by publication date)	Photo	Form factor (cm)
TE0813 MPSoC module with Xilinx Zynq UltraScale+, 2 GByte DDR4 SDRAM and 128 MByte QSPI Boot Flash dual parallel, Graphic Processing Unit (EG + EV) and Video Codec Unit (EV) depending on the variant, plug-on module with 4 x 240-pin B2B connectors. Extended temperature range. Overview available models		5.2 x 7.6
TE0812 The Trenz Electronic TE0812 is a powerful and also space-qualified evaluation board, based on a Xilinx Zynq UltraScale+ MPSoC. Equipped with 4 GByte DDR4 SDRAM ECC, dual 64 MByte (resp. 128 MByte) serial flash memory for configuration and operation, dual 4 Mbit MRAM, dual 32 GByte e.MMC and powerful switch-mode power supplies for all on-board voltages. Industrial temperature range. Overview available models		9 x 9
TE0865 The Trenz Electronic TE0865 is a high performance MPSoC module integrating a Xilinx Zynq UltraScale+. Furthermore, the module is equipped with 4 GByte DDR4 SDRAM with ECC on PS, 4 GByte DDR4 SDRAM on PL, 256 MByte Flash memory for configuration and operation, Gigabit Ethernet PHY and powerful switch-mode power supplies for all on-board voltages. Extended temperature range. Test board available. Overview available models		7.5 x 10
CR00040 Arrow Electronics and Trenz Electronic developed a very small and comprehensive module for qualified CO₂ measurements to support customers in their development and end products. The small CRUVI module includes Sensirion's new miniature CO₂ sensor. The SCD4x family has also an integrated humidity sensor and temperature sensor. SMD compatibility and extremely compact dimensions enable cost-efficient and space-saving integration of customer designs. The CRUVI module is available with and without CO₂ sensor. Overview available models		3.2 x 1.8
TEI0022 SoC board based on Intel Cyclone V FPGA, an Ethernet PHY, one GByte DDR3 SDRAM per HPS and FPGA and one 32 MByte Quad SPI Flash memory for configuration and operation per HPS and FPGA, and powerful switching-mode power supplies for all on-board voltages. Overview available models		13 x 16
TE0716 SoM (System on Module) based on Xilinx Zynq-7000 SoC with 1 GByte SDRAM, 32 MByte of SPI Flash memory, 10 x 12-Bit Low Power SAR ADCs, 512 Kb serial EEPROM, Gigabit Ethernet PHY transceiver, an USB PHY transceiver, a single chip USB2.0 to UART/JTAG interface (Xilinx license included), and powerful switching-mode power supplies for all on-board voltages, commercial temperature range. Overview available models		4.5 x 6.5
TE0835 The Trenz Electronic TE0835 is based on the Xilinx Zynq UltraScale+ RFSoC. The module is equipped with 4 x 1 GByte DDR4 SDRAM memory, 2 x 64 MByte SPI Flash memory, USB2.0, Ethernet transceiver and 2 x Samtec Razor Beam Board to Board (B2B) connectors. Extended temperature range. Carrier board available. Overview available models		6.5 x 9
TEF0010 FMC-Modul FMC module with Xilinx Artix-7 FPGA and 4 x 16-bit GMSL serializers. Overview available models		6.9 x 8.4
TEC810 The Trenz Electronic TEC0810 is a CompactPCI Serial Card (3U form factor) that can be used as a base for Trenz Electronic modules with a form factor of 5.2 x 7.6 cm. For configuration and service, JTAG and UART are available via USB bridge and one Gigabit Ethernet on the front panel. 48 differential signals are available on the backplane. Overview available models		-
TE0727 The ZynqBerryZero is a SoC module with integrated Xilinx Zynq-7010 FPGA and the form factor of the Raspberry Pi Zero. Furthermore, the small board is equipped with 512 MByte DDR3L SDRAM, 16 MByte Flash and various connectors, such as two microUSB connectors, a micro SD card slot, a mini HDMI and a CSI-2 connector (camera). Extended temperature range. Overview available models		3 x 6.5
TE0823 MPSoC module with a low-power Xilinx Zynq UltraScale+ ZU3, 1 GByte LPDDR4 with low power consumption, 128 MByte QSPI Boot Flash, 8 GByte e.MMC memory, Gigabit Ethernet transceiver PHY, high speed USB2-ULPI transceiver OTG, 132 x HP PL I/Os, 4 GTR (for USB3, SATA, PCIe, DP) and 14 x PS MIOs. Industrial temperature range. Carrier board available. Overview available models		4 x 5
TE0802 MPSoC Development Board with Xilinx Zynq UltraScale+ ZU2, 1 GByte LPDDR4, 32 MByte SPI Flash, USB 3.0 Host (type A connector) and DisplayPort. Other assembly options for the FPGA and the memory chips are available. Extended temperature range. Overview available models		10 x 10
TE0821 MPSoC module integrating a Xilinx Zynq UltraScale+ ZU3EG, 2 GByte DDR4 SDRAM, 128 MByte QSPI-Boot Flash, 4 high-speed interfaces for serial I/Os (HSSIO), 34 x High Performance and 96 x High Density PL I/Os, 14 x PS MIOs, 4 x serial PS GTR transceiver, Graphic Processor Unit (GPU), extended and industrial temperature range. This module is pin compatible with TE0820 MPSoC modules. Carrier board available. Overview available models		4 x 5
TEI0006 An industrial grade module based on Intel Cyclone 10 GX. Intel Cyclone 10 GX device family delivers higher core, transceiver and I/O performance than the previous generation of low cost FPGAs. Carrierboard available. Overview available models		6 x 8
TE0890 "S7 Mini" FPGA module integrating a Xilinx Spartan-7, 64 MBit HyperRAM DRAM, 64 MBit Config PROM for dual-boot and/or SW code storage and dual-pinout DIP-40 or 50mil 80 pin connectors for 32 or 64 FPGA 3.3V I/Os. The module is footprint compatible with 7S6, 7S15, 7S50 FTGB-196 devices. Overview available models		2.7 x 5.2
TEC0117 "GOWIN LittleBee" Low cost FPGA module integrating a GOWIN LittleBee 1NR9 FPGA with 8 MByte internal SDRAM and 8 MByte SPI Flash for user applications. It's compatible to the Arduino MKR standard. Overview available models		2.5 x 6.15
TEC0089 DesignWare ARC EM Software Development Plattform The DesignWare® ARC® EM Software Development Platform is a flexible platform for rapid software development on ARC EM processors and subsystems. It is intended to accelerate software development and debug of ARC EM processor-based systems for a wide range of ultra-low power embedded applications such as IoT, sensor fusion, and voice applications. It includes an FPGA-based hardware board with commonly used peripherals and interfaces for extensibility. Downloadable platform packages containing different hardware configurations enable the board to be programmed with different ARC EM processors and subsystems. Overview available models		-
TEC0850 CompactPCI Serial Card CompactPCI Serial card integrating a Xilinx Zynq UltraScale+ MPSoC, one DDR4 SDRAM SODIMM socket with 64bit wide data bus, max. dual 512 MByte Flash memory for configuration and operation, 24 Gigabit transceivers on PL side and 4 on PS side, powerful switch-mode power supplies for all onboard voltages, USB2 and USB3 FIFO bridges and a large number of configurable I/Os available on the CompactPCI Serial backplane connectors. Overview available models		10 x 16
TEF0008 FMC Card FPGA to Mezzanine Card (FMC) based on VITA 57.1 FMC HPC Standard, with four SFP+ 10 GBit ports for fiber optical SFP modules. It is inteded for use on a FMC HPC carrier and can not be used stand-alone. Overview available models		6.9 x 8.4
TE0783 A high-performance, industrial-grade SoM (System on Module) based on Xilinx Zynq-7000 SoC with 1 GByte RAM (32bit wide DDR3) connected to PS, 2 GByte RAM (64bit wide DDR3) connected to PL, 4 GByte eMMC, 16 GTX high-performance transceiver lanes, 32 MByte QSPI Flash memory for conﬁguration and operation, and powerful switch-mode power supplies for all on-board voltages. Overview available models		8.5 x 8.5
TEF0007 FMC Card DisplayPort 1.2 compatible FMC card with data rates up to 5.4 Gbps and sink and source DP connector. Overview available models		6.9 x 8.4
TEM0001 "SMF2000" FPGA modul with Microsemi SmartFusion2 and 8 MByte Flash. SmartFusion2 combines a 166 MHz Cortex-M3 MCU including 256 KByte Flash and 80 KByte SRAM, as well as 12 kLUT FPGA Core Logic. The TEM0001 is ideal for evaluation and rapid prototying. It's compatible to the Arduino MKR standard. Overview available models		2.5 x 6.15
TEI0003 "CYC1000" FPGA module with an integrated Intel Cyclone 10 LP FPGA, 8 MByte SDRAM, 2 MByte Flash and a LIS3DH 3-axis sensor. It's compatible to the Arduino MKR standard. Overview available models		2.5 x 6.15
TEL0001 "LXO2000" FPGA module integrating a Lattice XO2-4000 and on-board USB/JTAG. It's compatible to the Arduino MKR standard. Overview available models		2.5 x 6.15
TEI0001 "MAX1000" FPGA IoT Maker Board that has been designed for end-to-end application development and optimised for cost. The Arrow MAX1000 board can be installed directly into a custom application or integrated on to a completely separate board. At the heart of the maker board is a compact (11x11mm) Intel MAX10 FPGA with 8000 logic elements. This single chip includes integrated flash memory, a 1Msps 12bit ADC for analogue signals and a 3.3V power supply. Other features include embedded SRAM, DSP blocks, instant-on within milliseconds, and the ability to implement Intel’s NIOS II soft core embedded processor to perform microcontroller tasks. Overview available models		2.5 x 6.15
TE0724 SoC module with Xilinx Zynq XC7Z010 or XC7Z020, dual-core ARM Cortex-A9 MPCore, 1 GByte DDR3L SDRAM, 32 MByte QSPI Flash memory, 1 GBit Ethernet PHY, I/O PL:80/PS:20, MAC-Adress EEPROM, 128 KBit EEProm, CAN transceiver, on-board DC/DC controller, industrial temperature range, carrier board available. Overview available models		4 x 6
TE0807 UltraSOM+ MPSoC module with Xilinx Zynq UltraScale+ ZU07EV, 4 GByte DDR4 SDRAM, 128 MByte SPI Boot Flash (dual parallel), plug-on module with 4 x 160-pin connectors, serial transceivers: GTR 4 (all) + GTH 16 (all), Graphic Processing Unit (GPU) + Video codec unit (VCU), extended temperature range, carrier board and individual cooling solution available. Overview available models		5.2 x 7.6
TEF1001 PCIe FMC Carrier integrating a Xilinx Kintex-7 FPGA (K160T, K325T or K410T), 32 MByte SPI Flash, a 4 lane PCIe, a Vita 57.1 FMC HPC Slot and a DDR3 SODIMM Socket. Overview available models		-
TE0713 FPGA module with Xilinx Zynq Artix-7, USB 3.0 to FIFO bridge, 1 GByte of DDR3L SDRAM, 32 MByte Flash memory, Plug-on module with 2 x 100-pin and 1 x 60-pin high-speed hermaphroditic strips, carrier board available. Overview available models		4 x 5
TE0803 MPSoC module with Xilinx Zynq UltraScale+, 4 x 512 MByte (2 GByte) 64-Bit DDR4 SDRAM (up to 8 GByte max), 2 x 256 MBit (2 x 32 MByte) SPI Boot Flash dual parallel (up to 512 MByte max), plug-on module with 4 x 160 pin B2B connectors, carrier board, cooling solution and starter kit available. Overview available models		5.2 x 7.6
TE0820 MPSoC module with Xilinx Zynq UltraScale+, 1 GByte (2 x 512 MByte) DDR4 SDRAM with 32-Bit width, 2 x 32 MByte Flash memory, B2B connectors: 2 x 100 pin and 1 x 60 pin, carrier board available. Overview available models		4 x 5
TE0714 FPGA module with Xilinx Artix-7 35T or 50T, 16 MByte QSPI Flash, smallest module with tranceivers, industrial temperature range, carrier board available. Overview available models		4 x 3
TE0745 SoC module with Xilinx Zynq-7030 or Zynq-7045, 1 GByte DDR3 SDRAM, 32 MByte SPI Flash, 1 GBit Ethernet, 8 x GTX (7030: 4 GT), RTC, industrial temperature range, carrier board available. Overview available models		5.2 x 7.6
TE0841 FPGA module with Xilinx Kintex UltraScale KU35/KU40, 2 GByte DDR4, 64 MByte SPI Boot Flash, 3.2 mm mounting holes for skyline heat spreader, serial transceiver: GTH 8 Lanes (all), industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0808 UltraSOM+ MPSoC module with Xilinx Zynq UltraScale+, 4 x 512 MByte (2 GByte) 64-Bit DDR4 memory, 2 x 256 MBit (2 x 32 MByte) SPI Boot Flash (dual parallel), B2B connectors: 4 x 160 pin, serial transceiver: GTR 4 (all) + GTH 16 (all), industrial temperature range, carrier board and starter kit available. Overview available models		5.2 x 7.6
TE0725LP FPGA module with Xilinx Artix-7 100T, 32 MByte Flash, optional HyperRAM or HyperFlash, 2 x 50 pin with 2,54 mm pitch, VIN 3,3V or 1,8V, commercial temperature range available (industrial temperature range on request). Overview available models		7.3 x 3.5
TE0725 FPGA module with Xilinx Artix-7 15T, 35T or 100T, 32 MByte Flash, from revision 03 64 MBit HyperRAM, 2 x 50 Pin with 2.54 mm pitch, optional Fiber Optic Module (125/250 or 1000 MBit/s), commercial temperature range available (industrial temperature range on request). Overview available models		7.3 x 3.5
TE0726 "ZynqBerry" SoC module with Xilinx Zynq-7010 with Raspberry Pi form factor, 512 MByte (128 MByte) DDR3L, 16 MByte SPI Flash, Micro SD socket, 4 USB with power switches, 100 MBit Ethernet, DSI and CSI-2 Connector (display and camera), HAT header with 26 I/O's, commercial temperature range. Overview available models		like Raspberry Pi Model 2
TE0729 SoC module with Xilinx Zynq-7020, 512 MByte DDR3, 32 MByte QSPI-Flash, 1 x 10/100/1000 Mbps Ethernet transceiver PHY, 2 x 10/100 Mbps Ethernet transceiver PHYs, RTC, equipped with sulfur resistant resistors, industrial temperature range, carrier board and starter kit available. Overview available models		5.2 x 7.6
TE0723 "ArduZynq" SoC module with Xilinx Zynq-7010 with Arduino Shield form factor, 128 MByte DDR3L; version M: 512 MByte DDR3L, 16 MByte SPI Flash, Hi-Speed USB2.0 ULPI Transceiver, 23 FPGA I/O's on B2B connectors available, commercial temperature range. Overview available models		Arduino shield
TE0782 SoC module with Xilinx Zynq-7035, Zynq-7045 or Zynq-7100, 1 GByte DDR3, 32 MByte QSPI Flash, 4 GByte eMMC (optional up to 64 GByte), 2 x Gigabit Ethernet Tranceiver, RTC, optional 2 x 8 MByte HyperRAM (max. 2 x 32 MByte), 16 GTX high-performance Tranceiver Lanes, industrial temperature range, test fixture available. Overview available models		8.5 x 8.5
TE0722 "DIPFORTy1 Soft Propeller" Propeller compatible DIP40 pinout module with Xilinx Zynq-7010, 16 MByte SPI Flash (primary boot), 33.333 MHz Clock (MEMS Oscillator), Total user accessible PL I/O: 46 (+3 Input only), MicroSD Card socket, commercial temperature range. Overview available models		1.8 x 5.1
TE0728 SoC module with Xilinx automotive Zynq-7020, 512 MByte DDR3, 16 MByte QSPI Flash, 2 x 100 MBit Ethernet Transceiver (PHY), 76 single ended I/O, 24 LVDS pairs (48 I/O) and 42 MIO available on B2B connectors, CAN Transceiver (PHY), automotive temperature range, carrier board available. Overview available models		6 x 6
TE0715 SoC module with Xilinx Zynq-7015 or Zynq-7030, 1 GByte DDR3, 32 MByte QSPI Flash, 1 GBit Ethernet, 4 GTP/GTX Tranceivers, Programmable Clock Generator: Transceiver Clock (default 125 MHz), industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0712 FPGA module with Xilinx Artix-7 100T or 200T, 1 GByte DDDR3, 32 MByte Quad-SPI Flash, 100 MBit Ethernet, 4 Multi Gigabit transceivers, industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0711 FPGA module with Xilinx Artix-7 35T or 100T, 32 MByte QSPI Flash, 100 MHz MEMS oscillator, 178 FPGA I/O's (84 differential pairs), 3 User LED's, industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0710 FPGA module with Xilinx Artix-7 35T or 100T, 512 MByte DDR3, 32 MByte QSPI Flash, 2 x 100 MBit Ethernet, industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0720 SoC module with Xilinx Zynq-7020, 256 MByte/512 MByte DDR3L/1 GByte DDR3 (depending on version), 32 MByte SPI Flash, 4 GByte e-NAND (up to 32 GByte), 152 FPGA I/O's available on B2B connectors, RTC, 3 User LED's, automotive, industrial and commercial temperature range, carrier board and starter kit available. Overview available models		4 x 5
TE0741 FPGA module with Xilinx Kintex-7 70T, 160T, 325T or 410T, 32 MByte Quad-SPI Flash, max. GTX transceiver data rate 10,3125 Gb/s (default 6,6 Gb/s), 8 Multi Gigabit Transceivers, 2 User LED, 1 DONE PFGA pin LED, industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0630 FPGA module with Xilinx Spartan-6 LX45, LX75 oder LX150, 128 MByte DDR3, 8 MByte SPI Flash, up to 40 different and up to 109 single end FPGA I/O pins available on B2B connectors, 1.2 V, 1.5 V, 2.5 V = VCCAUX and 3.3 V power rails, 4 User LED, 1 User Push-Button, 2 User DIP Switches, industrial temperature range, carrier board available. Overview available models		4 x 5
TE0600 GigaBee module with Xilinx Spartan-6 LX45, LX100 or LX150, two independent 128 MByte DDR SDRAM banks (optional 2 x 512 MByte DDR SDRAM), 16 MByte SPI Flash, 10/100/1000 tri-speed GBit Ethernet transceiver (PHY), JTAG Port, industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0320 Module with Xilinx Spartan-3A, 1 GBit DDR RAM up to 1333 MByte/s bandwidth, 32 MBit SPI Flash, 109 I/Os (+ 10 dual-purpose pins) available on B2B connectors, 4 LED, 2 Push Buttons, 8 DIP Switches, industrial and commercial temperature range, carrier board available. Overview available models		6.8 x 4.8
TE0300 FPGA module with Xilinx Spartan-3E, 32 MBit SPI Flash, 512 MBit DDR RAM up to 666 MByte/s bandwidth, 3 on-board DC-DC converters for high efficieny, 104 I/Os + 6 Inputs available on B2B connectors, industrial and commercial temperature range, carrier board available. Overview available models		4.05 x 4.75
TE0140 Module with Xilinx Spartan-3, USB 2.0 transceiver, 16 KBit EEPROM, 120 available I/O's on B2B connectors, one LED, 1 push button, commercial temperature range, carrier board available. Overview available models		5.07 x 4.36

Filter

1 From 7

Heat Sink for Trenz Electronic Modules TE0741-05, spring-loaded embedded

Please check assembly instructions! Made especially for modules from the TE0741-05 series

from 15.00 € (17.85 € gross)

33866

In Stock: 0

Heat Spreader for Trenz Electronic Modules TE0714 from REV04

Cooling solution especially designed for Trenz Electronic module TE0714 from REV04

from 23.40 € (27.85 € gross)

KK0714-04

In Stock: 0

Heat Sink for Trenz Electronic FPGA Modules TE0741 Revision 04 und 05

Please check assembly instructions! Heat dissipations Chipset Heat Sink with Clip for the modules TE0741-04 and 05

from 9.59 € (11.41 € gross)

33013

In Stock: 0

ZynqBerryZero Module with AMD Zynq™ 7010-1C, 512 MByte DDR3L SDRAM, 3 x 6,5 cm

Raspberry Pi Zero form factor, AMD/Xilinx Zynq™ XC7Z010-1CLG225C FPGA, 512 MByte DDR3L SDRAM, 16 MByte Flash, USB, mini HDMI, 26 GPIO, size: 3 x 6,5 cm

from 83.93 € (99.88 € gross)

TE0727-03-41C34

In Stock: 0

Heat Spreader for Trenz Electronic MPSoC Modules TE0803-03 und -04

Cooling solution especially desgined for Trenz Electronic MPSoC module TE0803 (Revision 03 and 04).

from 11.40 € (13.57 € gross)

KK0803-04A

In Stock: 0

TE0703 - Carrier board for Trenz Electronic modules with 4 x 5 cm form factor

Carrier Board for 4 x 5 cm Trenz Electronic SoMs with 3 x Samtec LSHM Series Connectors

from 73.03 € (86.91 € gross)

TE0703-07

In Stock: 0

MPSoC Module with AMD Zynq™ UltraScale+™ ZU4CG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm

AMD/Xilinx Zynq™ UltraScale+™ XCZU4CG-1SFVC784E, 2 GByte DDR4, 128 MByte QSPI Boot Flash, 8 GByte e.MMC, size: 4 x 5 cm

from 297.48 € (354.00 € gross)

TE0820-05-4AE81MA

In Stock: 0

MPSoC Module with AMD Zynq™ UltraScale+™ ZU4EV-1I, 2 GByte DDR4 SDRAM, 4 x 5 cm

AMD/Xilinx Zynq™ UltraScale+™ XCZU4EV-1SFVC784I, 2 GByte DDR4, 128 MByte QSPI Boot Flash, 8 GByte e.MMC, size: 4 x 5 cm

from 582.23 € (692.85 € gross)

TE0820-05-4DI81MA

In Stock: 0

MPSoC Module with AMD Zynq™ UltraScale+™ ZU4EV-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm

AMD/Xilinx Zynq™ UltraScale+™ XCZU4EV-1SFVC784E, 2 GByte DDR4, 128 MByte QSPI Boot Flash, 8 GByte e.MMC, size: 4 x 5 cm

from 371.18 € (441.70 € gross)

TE0820-05-4DE81MA

In Stock: 0

MPSoC Module with AMD Zynq™ UltraScale+™ ZU3EG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm

AMD/Xilinx Zynq™ UltraScale+™ XCZU3EG-1SFVC784E, 2 GByte DDR4, 128 MByte QSPI Boot Flash, 8 GByte e.MMC, size: 4 x 5 cm

from 314.23 € (373.93 € gross)

TE0820-05-3BE81MA

In Stock: 0

MPSoC Module with AMD Zynq™ UltraScale+™ ZU3CG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm

AMD/Xilinx Zynq™ UltraScale+™ XCZU3CG-1SFVC784E, 2 GByte DDR4, 128 MByte QSPI Boot Flash, 8 GByte e.MMC, size: 4 x 5 cm

from 274.03 € (326.10 € gross)

TE0820-05-3AE81MA

In Stock: 0

MPSoC Module with AMD Zynq™ UltraScale+™ ZU2EG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm

AMD/Xilinx Zynq™ UltraScale+™ XCZU2EG-1SFVC784E, 2 GByte DDR4, 128 MByte QSPI Boot Flash, 8 GByte e.MMC, size: 4 x 5 cm

from 253.93 € (302.18 € gross)

TE0820-05-2BE81MA

In Stock: 0

MPSoC Module with AMD Zynq™ UltraScale+™ ZU2CG-1I, 2 GByte DDR4 SDRAM, 4 x 5 cm

AMD/Xilinx Zynq™ UltraScale+™ XCZU2CG-1SFVC784I, 2 GByte DDR4, 128 MByte QSPI Boot Flash, 8 GByte e.MMC, size: 4 x 5 cm

from 247.23 € (294.20 € gross)

TE0820-05-2AI81MA

In Stock: 0

MPSoC Module with AMD Zynq™ UltraScale+™ ZU2CG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm

AMD/Xilinx Zynq™ UltraScale+™ XCZU2CG-1SFVC784E, 2 GByte DDR4, 128 MByte QSPI Boot Flash, 8 GByte e.MMC, size: 4 x 5 cm

from 223.78 € (266.30 € gross)

TE0820-05-2AE81MA

In Stock: 0

MPSoC Module with AMD Zynq™ UltraScale+™ ZU5EV-1I, 2 GByte DDR4 SDRAM, 4 x 5 cm

AMD/Xilinx Zynq™ UltraScale+™ XCZU5EV-1SFVC784I, 2 GByte DDR4, 128 MByte QSPI Boot Flash, 8 GByte e.MMC, size: 4 x 5 cm

from 897.13 € (1,067.58 € gross)

TE0820-05-5DI81MA

In Stock: 0

MPSoC Module with AMD Zynq™ UltraScale+™ ZU2EG-1I, 2 GByte DDR4 SDRAM, 4 x 5 cm

AMD/Xilinx Zynq™ UltraScale+™ XCZU2EG-1SFVC784I, 2 GByte DDR4, 128 MByte QSPI Boot Flash, 8 GByte e.MMC, size: 4 x 5 cm

from 274.03 € (326.10 € gross)

TE0820-05-2BI81MA

In Stock: 0

MPSoC Module with AMD Zynq™ UltraScale+™ ZU2EG-1I, 2 GByte DDR4, 4 x 5 cm, LP

AMD/Xilinx Zynq™ UltraScale+™ XCZU2EG-1SFVC784I, 2 GByte DDR4, 128 MByte QSPI Boot Flash, 8 GByte e.MMC, size: 4 x 5 cm

from 274.03 € (326.10 € gross)

TE0820-05-2BI81ML

In Stock: 0

MPSoC Module with AMD Zynq™ UltraScale+™ ZU2EG-1E, 2 GByte DDR4, 4 x 5 cm, LP

AMD/Xilinx Zynq™ UltraScale+™ XCZU2EG-1SFVC784E, 2 GByte DDR4, 128 MByte QSPI Boot Flash, 8 GByte e.MMC, size: 4 x 5 cm

from 247.23 € (294.20 € gross)

TE0820-05-2BE81ML

In Stock: 0

FPGA Module with AMD Kintex™ 7 70T-2C, 32 MByte QSPI Flash, 4 x 5 cm

AMD/Xilinx Kintex™ 7 XC7K070T-2FBG676C, 32 MByte QSPI Flash, 8 High Speed Transceiver, size: 4 x 5 cm

from 236.40 € (281.32 € gross)

TE0741-05-A2C-1-A

In Stock: 0

FPGA Module with AMD Kintex™ 7 160T-2I, 32 MByte QSPI Flash, 4 x 5 cm

AMD/Xilinx Kintex™ 7 XC7K160T-2FBG676I, 32 MByte QSPI Flash, 8 High Speed Transceiver, size: 4 x 5 cm

from 434.40 € (516.94 € gross)

TE0741-05-B2I-1-A

In Stock: 0

FPGA Module with AMD Kintex™ 7 410T-2I, 32 MByte QSPI Flash, 4 x 5 cm

AMD/Xilinx Kintex™ 7 XC7K410T-2FBG676I, 32 MByte QSPI Flash, 8 High Speed transceiver, size: 4 x 5 cm

from 884.40 € (1,052.44 € gross)

TE0741-05-G2I-1-A

In Stock: 0

FPGA-Module with AMD Kintex™ 7K160T-2C, 32 MByte QSPI Flash, 4 x 5 cm

AMD/Xilinx Kintex™ 7 XC7K160T-2FFG676C, 32 MByte QSPI Flash, 8 High Speed Transceiver, size: 4 x 5 cm

from 467.40 € (556.21 € gross)

TE0741-05-B2C-1-AF

In Stock: 0

FPGA Module with AMD Kintex™ 7 70T-2I, 32 MByte QSPI Flash, 4 x 5 cm

AMD/Xilinx Kintex™ 7 XC7K70T-2FBG676I, 32 MByte QSPI Flash, 8 High Speed Transceiver, size: 4 x 5 cm

from 266.40 € (317.02 € gross)

TE0741-05-A2I-1-A

In Stock: 0

FPGA Module with AMD Kintex™ 7 160T-2C, 32 MByte QSPI Flash, 4 x 5 cm

AMD/Xilinx Kintex™ 7 XC7K160T-2FBG676C, 32 MByte QSPI Flash, 8 High Speed Transceiver, size: 4 x 5 cm

from 389.40 € (463.39 € gross)

TE0741-05-B2C-1-A

In Stock: 0

FPGA Module with AMD Kintex™ 7 325T-2C, 32 MByte QSPI Flash, 4 x 5 cm

AMD/Xilinx Kintex™ 7 XC7K325T-2FBG676C, 32 MByte QSPI Flash, 8 High Speed Transceiver, size: 4 x 5 cm

from 512.40 € (609.76 € gross)

TE0741-05-D2C-1-A

In Stock: 0

FPGA Module with AMD Kintex™ 7 325T-2I, 32 MByte QSPI Flash, 4 x 5 cm

AMD/Xilinx Kintex™ 7 XC7K325T-2FBG676I, 32 MByte QSPI Flash, 8 High Speed Transceiver, size: 4 x 5 cm

from 509.40 € (606.19 € gross)

TE0741-05-D2I-1-A

In Stock: 0

FPGA Module with AMD Kintex™ 7 410T-2C, 32 MByte QSPI Flash, 4 x 5 cm

AMD/Xilinx Kintex™ 7 XC7K410T-2FBG676C, 32 MByte QSPI Flash, 8 High Speed Transceiver, size: 4 x 5 cm

from 779.40 € (927.49 € gross)

TE0741-05-G2C-1-A

In Stock: 0

"ZynqBerry" SoC Module with AMD Zynq™ 7010-1C, Raspberry Pi 3 compatible

Raspberry Pi 3 compatible module integrating a AMD/Xilinx Zynq™ XC7Z010-1CLG225C FPGA, 512 MByte ECC DDR3L, 16 MByte Flash and Ethernet

from 99.33 € (118.20 € gross)

TE0726-04-41C94-A

In Stock: 0

High IO FPGA-Module with AMD Artix™ 7A35T-2C, USB, 4 x 5 cm

AMD/Xilinx Artix™ 7 XC7A35T-2CSG324C, 32 MByte SPI Flash memory supporting XiP, 100 MHz MEMS oscillator, 178 I/O's, size: 4 x 5 cm

from 65.40 € (77.83 € gross)

TE0711-02-42C-1-A

In Stock: 0

High IO FPGA-Module with AMD Artix™ 7A35T-2I, USB, 4 x 5 cm

AMD/Xilinx Artix™ 7 XC7A35T-2CSG324I, 32 MByte SPI Flash memory supporting XiP, 100 MHz MEMS oscillator, 178 I/O's, size: 4 x 5 cm

from 77.40 € (92.11 € gross)

TE0711-02-42I-1-A

In Stock: 0

High IO FPGA-Module with AMD Artix™ 7A100T-2C, USB, 4 x 5 cm

AMD/Xilinx Artix™ 7 XC7A100T-2CSG324C, 32 MByte SPI Flash memory supporting XiP, 100 MHz MEMS oscillator, 178 I/O's, size: 4 x 5 cm

from 113.40 € (134.95 € gross)

TE0711-02-72C-1-A

In Stock: 0

High IO FPGA-Module with AMD Artix™ 7A100T-2I, USB, 4 x 5 cm

AMD/Xilinx Artix™ 7 XC7A100T-2CSG324I, 32 MByte SPI Flash memory supporting XiP, 100 MHz MEMS oscillator, 178 I/O's, size: 4 x 5 cm

from 134.40 € (159.94 € gross)

TE0711-02-72I-1-A

In Stock: 0

Dual fast Ethernet FPGA Module with AMD Artix™ 7A100T, 512 MB DDR3L, 4 x 5 cm

AMD/Xilinx Artix™ 7 XC7A100T-2CSG324I, 32 MByte Quad-SPI Flash, 512 MByte DDR3, dual 100 MBit Ethernet PHY, size: 4 x 5 cm

from 143.40 € (170.65 € gross)

TE0710-03-72I21-A

In Stock: 0

Dual fast Ethernet FPGA Module with AMD Artix™ 7A35T-2I, 512 MB DDR3L, 4 x 5 cm

AMD/Xilinx Artix™ 7 XC7A35T-2CSG324I, 32 MByte Quad-SPI Flash, 512 MByte DDR3, dual 100 MBit Ethernet PHY, size: 4 x 5 cm

from 83.40 € (99.25 € gross)

TE0710-03-42I21-A

In Stock: 0

Dual fast Ethernet FPGA Module with AMD Artix™ 7A35T-2C, 512 MB DDR3L, 4 x 5 cm

AMD/Xilinx Artix™ 7 XC7A35T-2CSG324C, 32 MByte Quad-SPI Flash, 512 MByte DDR3, dual 100 MBit Ethernet PHY, size: 4 x 5 cm

from 71.40 € (84.97 € gross)

TE0710-03-42C21-A

In Stock: 0

Dual fast Ethernet FPGA Module with AMD Artix™ 7A100T-2C, 512 MB DDR3L, 4 x 5 cm

AMD/Xilinx Artix™ 7 XC7A100T-2CSG324C, 32 MByte Quad-SPI Flash, 512 MByte DDR3, dual 100 MBit Ethernet PHY, size: 4 x 5 cm

from 119.40 € (142.09 € gross)

TE0710-03-72C21-A

In Stock: 0

MPSoC Module with AMD Zynq™ UltraScale+™ ZU2CG-1E, 4 GByte DDR4, 5.2 x 7.6 cm

AMD/Xilinx Zynq™ UltraScale+™ XCZU2CG-1SFVC784E, 4 GByte DDR4, 128 MByte QSPI Boot Flash, Samtec ADM6-60 connectors, size: 5.2 x 7.6 cm

from 217.08 € (258.33 € gross)

TE0813-02-2AE81-A

In Stock: 0

MPSoC Module with AMD Zynq™ UltraScale+™ ZU2EG-1E, 4 GByte DDR4, 5.2 x 7.6 cm

AMD/Xilinx Zynq™ UltraScale+™ XCZU2EG-1SFVC784E, 4 GByte DDR4, 128 MByte QSPI Boot Flash, Samtec ADM6-60 connector, size: 5.2 x 7.6 cm

from 247.23 € (294.20 € gross)

TE0813-02-2BE81-A

In Stock: 0

MPSoC Module with AMD Zynq™ UltraScale+™ ZU3CG-1E, 4 GByte DDR4, 5.2 x 7.6 cm

AMD/Xilinx Zynq™ UltraScale+™ XCZU3CG-1SFVC784E, 4 GByte DDR4, 128 MByte QSPI Boot Flash, Samtec ADM6-60 connector, size: 5.2 x 7.6 cm

from 267.33 € (318.12 € gross)

TE0813-02-3AE81-A

In Stock: 0

MPSoC Module with AMD Zynq™ UltraScale+™ ZU3EG-1E, 4 GByte DDR4, 5.2 x 7.6 cm

AMD/Xilinx Zynq™ UltraScale+™ XCZU3EG-1SFVC784E, 4 GByte DDR4, 128 MByte QSPI Boot Flash, Samtec ADM6-60 connector, size: 5.2 x 7.6 cm

from 310.88 € (369.95 € gross)

TE0813-02-3BE81-A

In Stock: 0

MPSoC Module with AMD Zynq™ UltraScale+™ ZU4CG-1E, 4 GByte DDR4, 5.2 x 7.6 cm

AMD/Xilinx Zynq™ UltraScale+™ XCZU4CG-1SFVC784E, 4 GByte DDR4, 128 MByte QSPI Boot Flash, Samtec ADM6-60 connector, size: 5.2 x 7.6 cm

from 304.18 € (361.97 € gross)

TE0813-02-4AE81-A

In Stock: 0

MPSoC Module with AMD Zynq™ UltraScale+™ ZU4EG-1E, 4 GByte DDR4, 5.2 x 7.6 cm

AMD/Xilinx Zynq™ UltraScale+™ XCZU4EG-1SFVC784E, 4 GByte DDR4, 128 MByte QSPI Boot Flash, Samtec ADM6-60 connectors, size: 5.2 x 7.6 cm

from 337.68 € (401.84 € gross)

TE0813-02-4BE81-A

In Stock: 0

MPSoC Module with AMD Zynq™ UltraScale+™ ZU4EV-1E, 4 GByte DDR4, 5.2 x 7.6 cm

AMD/Xilinx Zynq™ UltraScale+™ XCZU4EV-1SFVC784E, 4 GByte DDR4, 128 MByte QSPI Boot Flash, Samtec ADM6-60 connector, size: 5.2 x 7.6 cm

from 377.88 € (449.68 € gross)

TE0813-02-4DE81-A

In Stock: 0

MPSoC Module with AMD Zynq™ UltraScale+™ ZU5EV-1E, 4 GByte DDR4, 5.2 x 7.6 cm

AMD/Xilinx Zynq™ UltraScale+™ XCZU5EV-1SFVC784E, 4 GByte DDR4, 128 MByte QSPI Boot Flash, Samtec ADM6-60 connector, size: 5.2 x 7.6 cm

from 756.43 € (900.15 € gross)

TE0813-02-5DE81-A

In Stock: 0

MPSoC Module with AMD Zynq™ UltraScale+™ ZU5EV-1I, 4 GByte DDR4, 5.2 x 7.6 cm

AMD/Xilinx Zynq™ UltraScale+™ XCZU5EV-1SFVC784I, 4 GByte DDR4, 128 MByte QSPI Flash, Samtec ADM6-60 connector, size: 5.2 x 7.6 cm

from 923.93 € (1,099.48 € gross)

TE0813-02-5DI81-A

In Stock: 0

DIPFORTy1 "Soft Propeller" mit AMD Zynq™ 7007S-1C, 16 MByte Flash

AMD/Xilinx Zynq™ 7 XC7Z007S-1CLG225C, DIP40 form factor, 16 MByte SPI Flash, size: 1.8 x 5.1 cm

from 35.40 € (42.13 € gross)

TE0722-03-11C-4-A

In Stock: 0

DIPFORTy1 "Soft Propeller" with AMD Zynq™ 7010-1C, 16 MByte Flash

AMD/Xilinx Zynq™ XC7Z010-1CLG225C, DIP40 form factor, 16 MByte SPI Flash, size: 1.8 x 5.1 cm

from 38.40 € (45.70 € gross)

TE0722-03-41C-4-A

In Stock: 0

DIPFORTy1 "Soft Propeller" with AMD Zynq™ 7010-1C, 16 MByte Flash

AMD/Xilinx Zynq™ XC7Z010-1CLG225I, DIP40 form factor, 16 MByte SPI Flash, size: 1.8 x 5.1 cm, industrial temperature range

from 41.40 € (49.27 € gross)

TE0722-03-41I-4-A

In Stock: 0

SoM with AMD Zynq™ 7030-1I, 1 GByte DDR3L, 5.2 x 7.6 cm

AMD/Xilinx Zynq™ SoC XC7Z030-1FBG676I, 1 GByte DDR3L SDRAM, 64 MByte QSPI Flash, USB 2.0 OTG, 250 I/O's, size 5.2 x 7.6 cm

from 347.73 € (413.80 € gross)

TE0745-03-71I31-A

In Stock: 0

SoM with AMD Zynq™ 7030-1I and Heat Spreader, 1 GByte DDR3L, 5.2 x 7.6 cm

TE0745-03-71I31-A module including pre-assembled heat spreader

Price on request

TE0745-03-71I31-AK

In Stock: 0

1 From 7