Trenz Electronic FPGA and SoC Modules

The micromodules designed by Trenz Electronic feature modern FPGA's. With small size and high-density connectors, they can be used nearly everywhere.

Gigabit Ethernet and integrated USB guarantees high data transfer rates to a host PC.

Other assembly options for cost or performance optimization plus high volume prices available on request.

The following tables are for guidance only. Trenz Electronic generally manufactures its own modules as long as chip manufacturers supply the respective chips.

Trenz Electronic Module and Carrier Board Life Cycles
Carrier boards are no longer produced if all suitable modules go EOL.

Estimated EOL dates are indicative only and may be delayed.

Products with integrated Xilinx FPGA

Series	Device Familiy	Carrier Board	Launch Year	Expected EOL	Expected Life Cycle
TE0140	Spartan-3	TE0143	2004	2021 (EOL confirmed)	17
TE0300	Spartan-3E		2005	2022	17
TE0320	Spartan-3A	TE0323	2005	2022	17
TE0600	Spartan-6 Ethernet	TE0603	2010	2027	17
TE0630	Spartan-6 USB	TE0303	2011	2027	16
TE07xx	Zynq-7000 Artix-7 Kintex-7	TEBA07xx, TEBB07xx, TEB07xx, TEBT07xx, TE070x	2013	2028	15
TE08xx	Zynq UltraScale+ Kintex UltraScale	TEBA08xx, TEBF08xx, TEBT08xx	2016	2031	15

Products with integrated Intel FPGA

Series	Device Family	Carrier Board	Launch Year	Expected EOL	Expected Life Cycle
TEI0001	MAX 10 FPGA	-	2014	2029	15
TEI0003	Cyclone 10	-	2017	2032	15
TEI0006	Cyclone 10	TEIB0006	2017	2032	15
TEI0009	Cyclone 10	-	2017	2032	15
TEI0010	MAX 10 FPGA	-	2014	2029	15
TEI0180	AGILEX	-	2019	2034	15

Modules (sorted by publication date)	Photo	Form factor (cm)
TEI0022 SoC board based on Intel Cyclone V FPGA, an Ethernet PHY, one GByte DDR3 SDRAM per HPS and FPGA and one 32 MByte Quad SPI Flash memory for configuration and operation per HPS and FPGA, and powerful switching-mode power supplies for all on-board voltages. Overview available models		13 x 16
TE0716 SoM (System on Module) based on Xilinx Zynq-7000 SoC with 1 GByte SDRAM, 32 MByte of SPI Flash memory, 10 x 12-Bit Low Power SAR ADCs, 512 Kb serial EEPROM, Gigabit Ethernet PHY transceiver, an USB PHY transceiver, a single chip USB2.0 to UART/JTAG interface (Xilinx license included), and powerful switching-mode power supplies for all on-board voltages, commercial temperature range. Overview available models		4.5 x 6.5
TE0835 The Trenz Electronic TE0835 is based on the Xilinx Zynq UltraScale+ RFSoC. The module is equipped with 4 x 1 GByte DDR4 SDRAM memory, 2 x 64 MByte SPI Flash memory, USB2.0, Ethernet transceiver and 2 x Samtec Razor Beam Board to Board (B2B) connectors. Extended temperature range. Carrier board available. Overview available models		6.5 x 9
TEF0010 FMC-Modul FMC module with Xilinx Artix-7 FPGA and 4 x 16-bit GMSL serializers. Overview available models		6.9 x 8.4
TEC810 The Trenz Electronic TEC0810 is a CompactPCI Serial Card (3U form factor) that can be used as a base for Trenz Electronic modules with a form factor of 5.2 x 7.6 cm. For configuration and service, JTAG and UART are available via USB bridge and one Gigabit Ethernet on the front panel. 48 differential signals are available on the backplane. Overview available models		-
TE0727 The ZynqBerryZero is a SoC module with integrated Xilinx Zynq-7010 FPGA and the form factor of the Raspberry Pi Zero. Furthermore, the small board is equipped with 512 MByte DDR3L SDRAM, 16 MByte Flash and various connectors, such as two microUSB connectors, a micro SD card slot, a mini HDMI and a CSI-2 connector (camera). Extended temperature range. Overview available models		3 x 6.5
TE0823 MPSoC module with a low-power Xilinx Zynq UltraScale+ ZU3, 1 GByte LPDDR4 with low power consumption, 128 MByte QSPI Boot Flash, 8 GByte e.MMC memory, Gigabit Ethernet transceiver PHY, high speed USB2-ULPI transceiver OTG, 132 x HP PL I/Os, 4 GTR (for USB3, SATA, PCIe, DP) and 14 x PS MIOs. Industrial temperature range. Carrier board available. Overview available models		4 x 5
TE0802 MPSoC Development Board with Xilinx Zynq UltraScale+ ZU2, 1 GByte LPDDR4, 32 MByte SPI Flash, USB 3.0 Host (type A connector) and DisplayPort. Other assembly options for the FPGA and the memory chips are available. Extended temperature range. Overview available models		10 x 10
TE0821 MPSoC module integrating a Xilinx Zynq UltraScale+ ZU3EG, 2 GByte DDR4 SDRAM, 128 MByte QSPI-Boot Flash, 4 high-speed interfaces for serial I/Os (HSSIO), 34 x High Performance and 96 x High Density PL I/Os, 14 x PS MIOs, 4 x serial PS GTR transceiver, Graphic Processor Unit (GPU), extended and industrial temperature range. This module is pin compatible with TE0820 MPSoC modules. Carrier board available. Overview available models		4 x 5
TEI0006 An industrial grade module based on Intel Cyclone 10 GX. Intel Cyclone 10 GX device family delivers higher core, transceiver and I/O performance than the previous generation of low cost FPGAs. Carrierboard available. Overview available models		6 x 8
TE0890 "S7 Mini" FPGA module integrating a Xilinx Spartan-7, 64 MBit HyperRAM DRAM, 64 MBit Config PROM for dual-boot and/or SW code storage and dual-pinout DIP-40 or 50mil 80 pin connectors for 32 or 64 FPGA 3.3V I/Os. The module is footprint compatible with 7S6, 7S15, 7S50 FTGB-196 devices. Overview available models		2.7 x 5.2
TEC0117 "GOWIN LittleBee" Low cost FPGA module integrating a GOWIN LittleBee 1NR9 FPGA with 8 MByte internal SDRAM and 8 MByte SPI Flash for user applications. It's compatible to the Arduino MKR standard. Overview available models		2.5 x 6.15
TEC0089 DesignWare ARC EM Software Development Plattform The DesignWare® ARC® EM Software Development Platform is a flexible platform for rapid software development on ARC EM processors and subsystems. It is intended to accelerate software development and debug of ARC EM processor-based systems for a wide range of ultra-low power embedded applications such as IoT, sensor fusion, and voice applications. It includes an FPGA-based hardware board with commonly used peripherals and interfaces for extensibility. Downloadable platform packages containing different hardware configurations enable the board to be programmed with different ARC EM processors and subsystems. Overview available models		-
TEC0850 CompactPCI Serial Card CompactPCI Serial card integrating a Xilinx Zynq UltraScale+ MPSoC, one DDR4 SDRAM SODIMM socket with 64bit wide data bus, max. dual 512 MByte Flash memory for configuration and operation, 24 Gigabit transceivers on PL side and 4 on PS side, powerful switch-mode power supplies for all onboard voltages, USB2 and USB3 FIFO bridges and a large number of configurable I/Os available on the CompactPCI Serial backplane connectors. Overview available models		10 x 16
TEF0008 FMC-Karte FPGA to Mezzanine Card (FMC) based on VITA 57.1 FMC HPC Standard, with four SFP+ 10 GBit ports for fiber optical SFP modules. It is inteded for use on a FMC HPC carrier and can not be used stand-alone. Overview available models		6.9 x 8.4
TE0783 A high-performance, industrial-grade SoM (System on Module) based on Xilinx Zynq-7000 SoC with 1 GByte RAM (32bit wide DDR3) connected to PS, 2 GByte RAM (64bit wide DDR3) connected to PL, 4 GByte eMMC, 16 GTX high-performance transceiver lanes, 32 MByte QSPI Flash memory for conﬁguration and operation, and powerful switch-mode power supplies for all on-board voltages. Overview available models		8.5 x 8.5
TEF0007 FMC-Karte DisplayPort 1.2 compatible FMC card with data rates up to 5.4 Gbps and sink and source DP connector. Overview available models		6.9 x 8.4
TEM0001 "SMF2000" FPGA modul with Microsemi SmartFusion2 and 8 MByte Flash. SmartFusion2 combines a 166 MHz Cortex-M3 MCU including 256 KByte Flash and 80 KByte SRAM, as well as 12 kLUT FPGA Core Logic. The TEM0001 is ideal for evaluation and rapid prototying. It's compatible to the Arduino MKR standard. Overview available models		2.5 x 6.15
TEI0003 "CYC1000" FPGA module with an integrated Intel Cyclone 10 LP FPGA, 8 MByte SDRAM, 2 MByte Flash and a LIS3DH 3-axis sensor. It's compatible to the Arduino MKR standard. Overview available models		2.5 x 6.15
TEL0001 "LXO2000" FPGA module integrating a Lattice XO2-4000 and on-board USB/JTAG. It's compatible to the Arduino MKR standard. Overview available models		2.5 x 6.15
TEI0001 "MAX1000" FPGA IoT Maker Board that has been designed for end-to-end application development and optimised for cost. The Arrow MAX1000 board can be installed directly into a custom application or integrated on to a completely separate board. At the heart of the maker board is a compact (11x11mm) Intel MAX10 FPGA with 8000 logic elements. This single chip includes integrated flash memory, a 1Msps 12bit ADC for analogue signals and a 3.3V power supply. Other features include embedded SRAM, DSP blocks, instant-on within milliseconds, and the ability to implement Intel’s NIOS II soft core embedded processor to perform microcontroller tasks. Overview available models		2.5 x 6.15
TE0724 SoC module with Xilinx Zynq XC7Z010 or XC7Z020, dual-core ARM Cortex-A9 MPCore, 1 GByte DDR3L SDRAM, 32 MByte QSPI Flash memory, 1 GBit Ethernet PHY, I/O PL:80/PS:20, MAC-Adress EEPROM, 128 KBit EEProm, CAN transceiver, on-board DC/DC controller, industrial temperature range, carrier board available. Overview available models		4 x 6
TE0807 UltraSOM+ MPSoC module with Xilinx Zynq UltraScale+ ZU07EV, 4 GByte DDR4 SDRAM, 128 MByte SPI Boot Flash (dual parallel), plug-on module with 4 x 160-pin connectors, serial transceivers: GTR 4 (all) + GTH 16 (all), Graphic Processing Unit (GPU) + Video codec unit (VCU), extended temperature range, carrier board and individual cooling solution available. Overview available models		5.2 x 7.6
TEF1001 PCIe FMC Carrier integrating a Xilinx Kintex-7 FPGA (K160T, K325T or K410T), 32 MByte SPI Flash, a 4 lane PCIe, a Vita 57.1 FMC HPC Slot and a DDR3 SODIMM Socket. Overview available models		-
TE0713 FPGA module with Xilinx Zynq Artix-7, USB 3.0 to FIFO bridge, 1 GByte of DDR3L SDRAM, 32 MByte Flash memory, Plug-on module with 2 x 100-pin and 1 x 60-pin high-speed hermaphroditic strips, carrier board available. Overview available models		4 x 5
TE0803 MPSoC module with Xilinx Zynq UltraScale+, 4 x 512 MByte (2 GByte) 64-Bit DDR4 SDRAM (up to 8 GByte max), 2 x 256 MBit (2 x 32 MByte) SPI Boot Flash dual parallel (up to 512 MByte max), plug-on module with 4 x 160 pin B2B connectors, carrier board, cooling solution and starter kit available. Overview available models		5.2 x 7.6
TE0820 MPSoC module with Xilinx Zynq UltraScale+, 1 GByte (2 x 512 MByte) DDR4 SDRAM with 32-Bit width, 2 x 32 MByte Flash memory, B2B connectors: 2 x 100 pin and 1 x 60 pin, carrier board available. Overview available models		4 x 5
TE0714 FPGA module with Xilinx Artix-7 35T or 50T, 16 MByte QSPI Flash, smallest module with tranceivers, industrial temperature range, carrier board available. Overview available models		4 x 3
TE0745 SoC module with Xilinx Zynq-7030 or Zynq-7045, 1 GByte DDR3 SDRAM, 32 MByte SPI Flash, 1 GBit Ethernet, 8 x GTX (7030: 4 GT), RTC, industrial temperature range, carrier board available. Overview available models		5.2 x 7.6
TE0841 FPGA module with Xilinx Kintex UltraScale KU35/KU40, 2 GByte DDR4, 64 MByte SPI Boot Flash, 3.2 mm mounting holes for skyline heat spreader, serial transceiver: GTH 8 Lanes (all), industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0808 UltraSOM+ MPSoC module with Xilinx Zynq UltraScale+, 4 x 512 MByte (2 GByte) 64-Bit DDR4 memory, 2 x 256 MBit (2 x 32 MByte) SPI Boot Flash (dual parallel), B2B connectors: 4 x 160 pin, serial transceiver: GTR 4 (all) + GTH 16 (all), industrial temperature range, carrier board and starter kit available. Overview available models		5.2 x 7.6
TE0725LP FPGA module with Xilinx Artix-7 100T, 32 MByte Flash, optional HyperRAM or HyperFlash, 2 x 50 pin with 2,54 mm pitch, VIN 3,3V or 1,8V, commercial temperature range available (industrial temperature range on request). Overview available models		7.3 x 3.5
TE0725 FPGA module with Xilinx Artix-7 15T, 35T or 100T, 32 MByte Flash, from revision 03 64 MBit HyperRAM, 2 x 50 Pin with 2.54 mm pitch, optional Fiber Optic Module (125/250 or 1000 MBit/s), commercial temperature range available (industrial temperature range on request). Overview available models		7.3 x 3.5
TE0726 "ZynqBerry" SoC module with Xilinx Zynq-7010 with Raspberry Pi form factor, 512 MByte (128 MByte) DDR3L, 16 MByte SPI Flash, Micro SD socket, 4 USB with power switches, 100 MBit Ethernet, DSI and CSI-2 Connector (display and camera), HAT header with 26 I/O's, commercial temperature range. Overview available models		like Raspberry Pi Model 2
TE0729 SoC module with Xilinx Zynq-7020, 512 MByte DDR3, 32 MByte QSPI-Flash, 1 x 10/100/1000 Mbps Ethernet transceiver PHY, 2 x 10/100 Mbps Ethernet transceiver PHYs, RTC, equipped with sulfur resistant resistors, industrial temperature range, carrier board and starter kit available. Overview available models		5.2 x 7.6
TE0723 "ArduZynq" SoC module with Xilinx Zynq-7010 with Arduino Shield form factor, 128 MByte DDR3L; version M: 512 MByte DDR3L, 16 MByte SPI Flash, Hi-Speed USB2.0 ULPI Transceiver, 23 FPGA I/O's on B2B connectors available, commercial temperature range. Overview available models		Arduino shield
TE0782 SoC module with Xilinx Zynq-7035, Zynq-7045 or Zynq-7100, 1 GByte DDR3, 32 MByte QSPI Flash, 4 GByte eMMC (optional up to 64 GByte), 2 x Gigabit Ethernet Tranceiver, RTC, optional 2 x 8 MByte HyperRAM (max. 2 x 32 MByte), 16 GTX high-performance Tranceiver Lanes, industrial temperature range, test fixture available. Overview available models		8.5 x 8.5
TE0722 "DIPFORTy1 Soft Propeller" Propeller compatible DIP40 pinout module with Xilinx Zynq-7010, 16 MByte SPI Flash (primary boot), 33.333 MHz Clock (MEMS Oscillator), Total user accessible PL I/O: 46 (+3 Input only), MicroSD Card socket, commercial temperature range. Overview available models		1.8 x 5.1
TE0728 SoC module with Xilinx automotive Zynq-7020, 512 MByte DDR3, 16 MByte QSPI Flash, 2 x 100 MBit Ethernet Transceiver (PHY), 76 single ended I/O, 24 LVDS pairs (48 I/O) and 42 MIO available on B2B connectors, CAN Transceiver (PHY), automotive temperature range, carrier board available. Overview available models		6 x 6
TE0715 SoC module with Xilinx Zynq-7015 or Zynq-7030, 1 GByte DDR3, 32 MByte QSPI Flash, 1 GBit Ethernet, 4 GTP/GTX Tranceivers, Programmable Clock Generator: Transceiver Clock (default 125 MHz), industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0712 FPGA module with Xilinx Artix-7 100T or 200T, 1 GByte DDDR3, 32 MByte Quad-SPI Flash, 100 MBit Ethernet, 4 Multi Gigabit transceivers, industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0711 FPGA module with Xilinx Artix-7 35T or 100T, 32 MByte QSPI Flash, 100 MHz MEMS oscillator, 178 FPGA I/O's (84 differential pairs), 3 User LED's, industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0710 FPGA module with Xilinx Artix-7 35T or 100T, 512 MByte DDR3, 32 MByte QSPI Flash, 2 x 100 MBit Ethernet, industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0720 SoC module with Xilinx Zynq-7020, 256 MByte/512 MByte DDR3L/1 GByte DDR3 (depending on version), 32 MByte SPI Flash, 4 GByte e-NAND (up to 32 GByte), 152 FPGA I/O's available on B2B connectors, RTC, 3 User LED's, automotive, industrial and commercial temperature range, carrier board and starter kit available. Overview available models		4 x 5
TE0741 FPGA module with Xilinx Kintex-7 70T, 160T, 325T or 410T, 32 MByte Quad-SPI Flash, max. GTX transceiver data rate 10,3125 Gb/s (default 6,6 Gb/s), 8 Multi Gigabit Transceivers, 2 User LED, 1 DONE PFGA pin LED, industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0630 FPGA module with Xilinx Spartan-6 LX45, LX75 oder LX150, 128 MByte DDR3, 8 MByte SPI Flash, up to 40 different and up to 109 single end FPGA I/O pins available on B2B connectors, 1.2 V, 1.5 V, 2.5 V = VCCAUX and 3.3 V power rails, 4 User LED, 1 User Push-Button, 2 User DIP Switches, industrial temperature range, carrier board available. Overview available models		4 x 5
TE0600 GigaBee module with Xilinx Spartan-6 LX45, LX100 or LX150, two independent 128 MByte DDR SDRAM banks (optional 2 x 512 MByte DDR SDRAM), 16 MByte SPI Flash, 10/100/1000 tri-speed GBit Ethernet transceiver (PHY), JTAG Port, industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0320 Module with Xilinx Spartan-3A, 1 GBit DDR RAM up to 1333 MByte/s bandwidth, 32 MBit SPI Flash, 109 I/Os (+ 10 dual-purpose pins) available on B2B connectors, 4 LED, 2 Push Buttons, 8 DIP Switches, industrial and commercial temperature range, carrier board available. Overview available models		6.8 x 4.8
TE0300 FPGA module with Xilinx Spartan-3E, 32 MBit SPI Flash, 512 MBit DDR RAM up to 666 MByte/s bandwidth, 3 on-board DC-DC converters for high efficieny, 104 I/Os + 6 Inputs available on B2B connectors, industrial and commercial temperature range, carrier board available. Overview available models		4.05 x 4.75
TE0140 Module with Xilinx Spartan-3, USB 2.0 transceiver, 16 KBit EEPROM, 120 available I/O's on B2B connectors, one LED, 1 push button, commercial temperature range, carrier board available. Overview available models		5.07 x 4.36

The micromodules designed by Trenz Electronic feature modern FPGA's. With small size and high-density connectors, they can be used nearly everywhere. Gigabit Ethernet and integrated USB... read more »

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Trenz Electronic FPGA and SoC Modules

The micromodules designed by Trenz Electronic feature modern FPGA's. With small size and high-density connectors, they can be used nearly everywhere.

Gigabit Ethernet and integrated USB guarantees high data transfer rates to a host PC.

Other assembly options for cost or performance optimization plus high volume prices available on request.

The following tables are for guidance only. Trenz Electronic generally manufactures its own modules as long as chip manufacturers supply the respective chips.

Trenz Electronic Module and Carrier Board Life Cycles
Carrier boards are no longer produced if all suitable modules go EOL.

Estimated EOL dates are indicative only and may be delayed.

Products with integrated Xilinx FPGA

Series	Device Familiy	Carrier Board	Launch Year	Expected EOL	Expected Life Cycle
TE0140	Spartan-3	TE0143	2004	2021 (EOL confirmed)	17
TE0300	Spartan-3E		2005	2022	17
TE0320	Spartan-3A	TE0323	2005	2022	17
TE0600	Spartan-6 Ethernet	TE0603	2010	2027	17
TE0630	Spartan-6 USB	TE0303	2011	2027	16
TE07xx	Zynq-7000 Artix-7 Kintex-7	TEBA07xx, TEBB07xx, TEB07xx, TEBT07xx, TE070x	2013	2028	15
TE08xx	Zynq UltraScale+ Kintex UltraScale	TEBA08xx, TEBF08xx, TEBT08xx	2016	2031	15

Products with integrated Intel FPGA

Series	Device Family	Carrier Board	Launch Year	Expected EOL	Expected Life Cycle
TEI0001	MAX 10 FPGA	-	2014	2029	15
TEI0003	Cyclone 10	-	2017	2032	15
TEI0006	Cyclone 10	TEIB0006	2017	2032	15
TEI0009	Cyclone 10	-	2017	2032	15
TEI0010	MAX 10 FPGA	-	2014	2029	15
TEI0180	AGILEX	-	2019	2034	15

Modules (sorted by publication date)	Photo	Form factor (cm)
TEI0022 SoC board based on Intel Cyclone V FPGA, an Ethernet PHY, one GByte DDR3 SDRAM per HPS and FPGA and one 32 MByte Quad SPI Flash memory for configuration and operation per HPS and FPGA, and powerful switching-mode power supplies for all on-board voltages. Overview available models		13 x 16
TE0716 SoM (System on Module) based on Xilinx Zynq-7000 SoC with 1 GByte SDRAM, 32 MByte of SPI Flash memory, 10 x 12-Bit Low Power SAR ADCs, 512 Kb serial EEPROM, Gigabit Ethernet PHY transceiver, an USB PHY transceiver, a single chip USB2.0 to UART/JTAG interface (Xilinx license included), and powerful switching-mode power supplies for all on-board voltages, commercial temperature range. Overview available models		4.5 x 6.5
TE0835 The Trenz Electronic TE0835 is based on the Xilinx Zynq UltraScale+ RFSoC. The module is equipped with 4 x 1 GByte DDR4 SDRAM memory, 2 x 64 MByte SPI Flash memory, USB2.0, Ethernet transceiver and 2 x Samtec Razor Beam Board to Board (B2B) connectors. Extended temperature range. Carrier board available. Overview available models		6.5 x 9
TEF0010 FMC-Modul FMC module with Xilinx Artix-7 FPGA and 4 x 16-bit GMSL serializers. Overview available models		6.9 x 8.4
TEC810 The Trenz Electronic TEC0810 is a CompactPCI Serial Card (3U form factor) that can be used as a base for Trenz Electronic modules with a form factor of 5.2 x 7.6 cm. For configuration and service, JTAG and UART are available via USB bridge and one Gigabit Ethernet on the front panel. 48 differential signals are available on the backplane. Overview available models		-
TE0727 The ZynqBerryZero is a SoC module with integrated Xilinx Zynq-7010 FPGA and the form factor of the Raspberry Pi Zero. Furthermore, the small board is equipped with 512 MByte DDR3L SDRAM, 16 MByte Flash and various connectors, such as two microUSB connectors, a micro SD card slot, a mini HDMI and a CSI-2 connector (camera). Extended temperature range. Overview available models		3 x 6.5
TE0823 MPSoC module with a low-power Xilinx Zynq UltraScale+ ZU3, 1 GByte LPDDR4 with low power consumption, 128 MByte QSPI Boot Flash, 8 GByte e.MMC memory, Gigabit Ethernet transceiver PHY, high speed USB2-ULPI transceiver OTG, 132 x HP PL I/Os, 4 GTR (for USB3, SATA, PCIe, DP) and 14 x PS MIOs. Industrial temperature range. Carrier board available. Overview available models		4 x 5
TE0802 MPSoC Development Board with Xilinx Zynq UltraScale+ ZU2, 1 GByte LPDDR4, 32 MByte SPI Flash, USB 3.0 Host (type A connector) and DisplayPort. Other assembly options for the FPGA and the memory chips are available. Extended temperature range. Overview available models		10 x 10
TE0821 MPSoC module integrating a Xilinx Zynq UltraScale+ ZU3EG, 2 GByte DDR4 SDRAM, 128 MByte QSPI-Boot Flash, 4 high-speed interfaces for serial I/Os (HSSIO), 34 x High Performance and 96 x High Density PL I/Os, 14 x PS MIOs, 4 x serial PS GTR transceiver, Graphic Processor Unit (GPU), extended and industrial temperature range. This module is pin compatible with TE0820 MPSoC modules. Carrier board available. Overview available models		4 x 5
TEI0006 An industrial grade module based on Intel Cyclone 10 GX. Intel Cyclone 10 GX device family delivers higher core, transceiver and I/O performance than the previous generation of low cost FPGAs. Carrierboard available. Overview available models		6 x 8
TE0890 "S7 Mini" FPGA module integrating a Xilinx Spartan-7, 64 MBit HyperRAM DRAM, 64 MBit Config PROM for dual-boot and/or SW code storage and dual-pinout DIP-40 or 50mil 80 pin connectors for 32 or 64 FPGA 3.3V I/Os. The module is footprint compatible with 7S6, 7S15, 7S50 FTGB-196 devices. Overview available models		2.7 x 5.2
TEC0117 "GOWIN LittleBee" Low cost FPGA module integrating a GOWIN LittleBee 1NR9 FPGA with 8 MByte internal SDRAM and 8 MByte SPI Flash for user applications. It's compatible to the Arduino MKR standard. Overview available models		2.5 x 6.15
TEC0089 DesignWare ARC EM Software Development Plattform The DesignWare® ARC® EM Software Development Platform is a flexible platform for rapid software development on ARC EM processors and subsystems. It is intended to accelerate software development and debug of ARC EM processor-based systems for a wide range of ultra-low power embedded applications such as IoT, sensor fusion, and voice applications. It includes an FPGA-based hardware board with commonly used peripherals and interfaces for extensibility. Downloadable platform packages containing different hardware configurations enable the board to be programmed with different ARC EM processors and subsystems. Overview available models		-
TEC0850 CompactPCI Serial Card CompactPCI Serial card integrating a Xilinx Zynq UltraScale+ MPSoC, one DDR4 SDRAM SODIMM socket with 64bit wide data bus, max. dual 512 MByte Flash memory for configuration and operation, 24 Gigabit transceivers on PL side and 4 on PS side, powerful switch-mode power supplies for all onboard voltages, USB2 and USB3 FIFO bridges and a large number of configurable I/Os available on the CompactPCI Serial backplane connectors. Overview available models		10 x 16
TEF0008 FMC-Karte FPGA to Mezzanine Card (FMC) based on VITA 57.1 FMC HPC Standard, with four SFP+ 10 GBit ports for fiber optical SFP modules. It is inteded for use on a FMC HPC carrier and can not be used stand-alone. Overview available models		6.9 x 8.4
TE0783 A high-performance, industrial-grade SoM (System on Module) based on Xilinx Zynq-7000 SoC with 1 GByte RAM (32bit wide DDR3) connected to PS, 2 GByte RAM (64bit wide DDR3) connected to PL, 4 GByte eMMC, 16 GTX high-performance transceiver lanes, 32 MByte QSPI Flash memory for conﬁguration and operation, and powerful switch-mode power supplies for all on-board voltages. Overview available models		8.5 x 8.5
TEF0007 FMC-Karte DisplayPort 1.2 compatible FMC card with data rates up to 5.4 Gbps and sink and source DP connector. Overview available models		6.9 x 8.4
TEM0001 "SMF2000" FPGA modul with Microsemi SmartFusion2 and 8 MByte Flash. SmartFusion2 combines a 166 MHz Cortex-M3 MCU including 256 KByte Flash and 80 KByte SRAM, as well as 12 kLUT FPGA Core Logic. The TEM0001 is ideal for evaluation and rapid prototying. It's compatible to the Arduino MKR standard. Overview available models		2.5 x 6.15
TEI0003 "CYC1000" FPGA module with an integrated Intel Cyclone 10 LP FPGA, 8 MByte SDRAM, 2 MByte Flash and a LIS3DH 3-axis sensor. It's compatible to the Arduino MKR standard. Overview available models		2.5 x 6.15
TEL0001 "LXO2000" FPGA module integrating a Lattice XO2-4000 and on-board USB/JTAG. It's compatible to the Arduino MKR standard. Overview available models		2.5 x 6.15
TEI0001 "MAX1000" FPGA IoT Maker Board that has been designed for end-to-end application development and optimised for cost. The Arrow MAX1000 board can be installed directly into a custom application or integrated on to a completely separate board. At the heart of the maker board is a compact (11x11mm) Intel MAX10 FPGA with 8000 logic elements. This single chip includes integrated flash memory, a 1Msps 12bit ADC for analogue signals and a 3.3V power supply. Other features include embedded SRAM, DSP blocks, instant-on within milliseconds, and the ability to implement Intel’s NIOS II soft core embedded processor to perform microcontroller tasks. Overview available models		2.5 x 6.15
TE0724 SoC module with Xilinx Zynq XC7Z010 or XC7Z020, dual-core ARM Cortex-A9 MPCore, 1 GByte DDR3L SDRAM, 32 MByte QSPI Flash memory, 1 GBit Ethernet PHY, I/O PL:80/PS:20, MAC-Adress EEPROM, 128 KBit EEProm, CAN transceiver, on-board DC/DC controller, industrial temperature range, carrier board available. Overview available models		4 x 6
TE0807 UltraSOM+ MPSoC module with Xilinx Zynq UltraScale+ ZU07EV, 4 GByte DDR4 SDRAM, 128 MByte SPI Boot Flash (dual parallel), plug-on module with 4 x 160-pin connectors, serial transceivers: GTR 4 (all) + GTH 16 (all), Graphic Processing Unit (GPU) + Video codec unit (VCU), extended temperature range, carrier board and individual cooling solution available. Overview available models		5.2 x 7.6
TEF1001 PCIe FMC Carrier integrating a Xilinx Kintex-7 FPGA (K160T, K325T or K410T), 32 MByte SPI Flash, a 4 lane PCIe, a Vita 57.1 FMC HPC Slot and a DDR3 SODIMM Socket. Overview available models		-
TE0713 FPGA module with Xilinx Zynq Artix-7, USB 3.0 to FIFO bridge, 1 GByte of DDR3L SDRAM, 32 MByte Flash memory, Plug-on module with 2 x 100-pin and 1 x 60-pin high-speed hermaphroditic strips, carrier board available. Overview available models		4 x 5
TE0803 MPSoC module with Xilinx Zynq UltraScale+, 4 x 512 MByte (2 GByte) 64-Bit DDR4 SDRAM (up to 8 GByte max), 2 x 256 MBit (2 x 32 MByte) SPI Boot Flash dual parallel (up to 512 MByte max), plug-on module with 4 x 160 pin B2B connectors, carrier board, cooling solution and starter kit available. Overview available models		5.2 x 7.6
TE0820 MPSoC module with Xilinx Zynq UltraScale+, 1 GByte (2 x 512 MByte) DDR4 SDRAM with 32-Bit width, 2 x 32 MByte Flash memory, B2B connectors: 2 x 100 pin and 1 x 60 pin, carrier board available. Overview available models		4 x 5
TE0714 FPGA module with Xilinx Artix-7 35T or 50T, 16 MByte QSPI Flash, smallest module with tranceivers, industrial temperature range, carrier board available. Overview available models		4 x 3
TE0745 SoC module with Xilinx Zynq-7030 or Zynq-7045, 1 GByte DDR3 SDRAM, 32 MByte SPI Flash, 1 GBit Ethernet, 8 x GTX (7030: 4 GT), RTC, industrial temperature range, carrier board available. Overview available models		5.2 x 7.6
TE0841 FPGA module with Xilinx Kintex UltraScale KU35/KU40, 2 GByte DDR4, 64 MByte SPI Boot Flash, 3.2 mm mounting holes for skyline heat spreader, serial transceiver: GTH 8 Lanes (all), industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0808 UltraSOM+ MPSoC module with Xilinx Zynq UltraScale+, 4 x 512 MByte (2 GByte) 64-Bit DDR4 memory, 2 x 256 MBit (2 x 32 MByte) SPI Boot Flash (dual parallel), B2B connectors: 4 x 160 pin, serial transceiver: GTR 4 (all) + GTH 16 (all), industrial temperature range, carrier board and starter kit available. Overview available models		5.2 x 7.6
TE0725LP FPGA module with Xilinx Artix-7 100T, 32 MByte Flash, optional HyperRAM or HyperFlash, 2 x 50 pin with 2,54 mm pitch, VIN 3,3V or 1,8V, commercial temperature range available (industrial temperature range on request). Overview available models		7.3 x 3.5
TE0725 FPGA module with Xilinx Artix-7 15T, 35T or 100T, 32 MByte Flash, from revision 03 64 MBit HyperRAM, 2 x 50 Pin with 2.54 mm pitch, optional Fiber Optic Module (125/250 or 1000 MBit/s), commercial temperature range available (industrial temperature range on request). Overview available models		7.3 x 3.5
TE0726 "ZynqBerry" SoC module with Xilinx Zynq-7010 with Raspberry Pi form factor, 512 MByte (128 MByte) DDR3L, 16 MByte SPI Flash, Micro SD socket, 4 USB with power switches, 100 MBit Ethernet, DSI and CSI-2 Connector (display and camera), HAT header with 26 I/O's, commercial temperature range. Overview available models		like Raspberry Pi Model 2
TE0729 SoC module with Xilinx Zynq-7020, 512 MByte DDR3, 32 MByte QSPI-Flash, 1 x 10/100/1000 Mbps Ethernet transceiver PHY, 2 x 10/100 Mbps Ethernet transceiver PHYs, RTC, equipped with sulfur resistant resistors, industrial temperature range, carrier board and starter kit available. Overview available models		5.2 x 7.6
TE0723 "ArduZynq" SoC module with Xilinx Zynq-7010 with Arduino Shield form factor, 128 MByte DDR3L; version M: 512 MByte DDR3L, 16 MByte SPI Flash, Hi-Speed USB2.0 ULPI Transceiver, 23 FPGA I/O's on B2B connectors available, commercial temperature range. Overview available models		Arduino shield
TE0782 SoC module with Xilinx Zynq-7035, Zynq-7045 or Zynq-7100, 1 GByte DDR3, 32 MByte QSPI Flash, 4 GByte eMMC (optional up to 64 GByte), 2 x Gigabit Ethernet Tranceiver, RTC, optional 2 x 8 MByte HyperRAM (max. 2 x 32 MByte), 16 GTX high-performance Tranceiver Lanes, industrial temperature range, test fixture available. Overview available models		8.5 x 8.5
TE0722 "DIPFORTy1 Soft Propeller" Propeller compatible DIP40 pinout module with Xilinx Zynq-7010, 16 MByte SPI Flash (primary boot), 33.333 MHz Clock (MEMS Oscillator), Total user accessible PL I/O: 46 (+3 Input only), MicroSD Card socket, commercial temperature range. Overview available models		1.8 x 5.1
TE0728 SoC module with Xilinx automotive Zynq-7020, 512 MByte DDR3, 16 MByte QSPI Flash, 2 x 100 MBit Ethernet Transceiver (PHY), 76 single ended I/O, 24 LVDS pairs (48 I/O) and 42 MIO available on B2B connectors, CAN Transceiver (PHY), automotive temperature range, carrier board available. Overview available models		6 x 6
TE0715 SoC module with Xilinx Zynq-7015 or Zynq-7030, 1 GByte DDR3, 32 MByte QSPI Flash, 1 GBit Ethernet, 4 GTP/GTX Tranceivers, Programmable Clock Generator: Transceiver Clock (default 125 MHz), industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0712 FPGA module with Xilinx Artix-7 100T or 200T, 1 GByte DDDR3, 32 MByte Quad-SPI Flash, 100 MBit Ethernet, 4 Multi Gigabit transceivers, industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0711 FPGA module with Xilinx Artix-7 35T or 100T, 32 MByte QSPI Flash, 100 MHz MEMS oscillator, 178 FPGA I/O's (84 differential pairs), 3 User LED's, industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0710 FPGA module with Xilinx Artix-7 35T or 100T, 512 MByte DDR3, 32 MByte QSPI Flash, 2 x 100 MBit Ethernet, industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0720 SoC module with Xilinx Zynq-7020, 256 MByte/512 MByte DDR3L/1 GByte DDR3 (depending on version), 32 MByte SPI Flash, 4 GByte e-NAND (up to 32 GByte), 152 FPGA I/O's available on B2B connectors, RTC, 3 User LED's, automotive, industrial and commercial temperature range, carrier board and starter kit available. Overview available models		4 x 5
TE0741 FPGA module with Xilinx Kintex-7 70T, 160T, 325T or 410T, 32 MByte Quad-SPI Flash, max. GTX transceiver data rate 10,3125 Gb/s (default 6,6 Gb/s), 8 Multi Gigabit Transceivers, 2 User LED, 1 DONE PFGA pin LED, industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0630 FPGA module with Xilinx Spartan-6 LX45, LX75 oder LX150, 128 MByte DDR3, 8 MByte SPI Flash, up to 40 different and up to 109 single end FPGA I/O pins available on B2B connectors, 1.2 V, 1.5 V, 2.5 V = VCCAUX and 3.3 V power rails, 4 User LED, 1 User Push-Button, 2 User DIP Switches, industrial temperature range, carrier board available. Overview available models		4 x 5
TE0600 GigaBee module with Xilinx Spartan-6 LX45, LX100 or LX150, two independent 128 MByte DDR SDRAM banks (optional 2 x 512 MByte DDR SDRAM), 16 MByte SPI Flash, 10/100/1000 tri-speed GBit Ethernet transceiver (PHY), JTAG Port, industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0320 Module with Xilinx Spartan-3A, 1 GBit DDR RAM up to 1333 MByte/s bandwidth, 32 MBit SPI Flash, 109 I/Os (+ 10 dual-purpose pins) available on B2B connectors, 4 LED, 2 Push Buttons, 8 DIP Switches, industrial and commercial temperature range, carrier board available. Overview available models		6.8 x 4.8
TE0300 FPGA module with Xilinx Spartan-3E, 32 MBit SPI Flash, 512 MBit DDR RAM up to 666 MByte/s bandwidth, 3 on-board DC-DC converters for high efficieny, 104 I/Os + 6 Inputs available on B2B connectors, industrial and commercial temperature range, carrier board available. Overview available models		4.05 x 4.75
TE0140 Module with Xilinx Spartan-3, USB 2.0 transceiver, 16 KBit EEPROM, 120 available I/O's on B2B connectors, one LED, 1 push button, commercial temperature range, carrier board available. Overview available models		5.07 x 4.36

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MPSoC Module TE0807 with Zynq UltraScale+ ZU7EV-E and mounted Heat Spreader

TE0807-03-7DE21-A module including pre-assembled heat spreader, Xilinx Zynq UltraScale+ XCZU7EV-1FBVB900E, 4 GByte DDR4, 128 MByte QSPI Boot Flash, size: 5.2 x 7.6 cm

From 883.73 € (1,051.64 € gross) *

TE0807-03-7DE21-AK

In Stock: 0

MPSoC Module TE0807 with Zynq UltraScale+ ZU4EG-E and mounted Heat Spreader

TE0807-03-4BE21-A module including pre-assembled heat spreader, Xilinx Zynq UltraScale+ XCZU4EG-1FBVB900E, 4 GByte DDR4, 128 MByte QSPI Boot Flash, size: 5.2 x 7.6 cm

From 468.33 € (557.31 € gross) *

TE0807-03-4BE21-AK

In Stock: 0

MPSoC Module with Xilinx Zynq UltraScale+ ZU3CG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm

Xilinx Zynq UltraScale+ XCZU3CG-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 8 GByte e.MMC, size: 4 x 5 cm

From 207.03 € (246.37 € gross) *

TE0820-04-3AE21FA

In Stock: 0

SoC Module with Xilinx Zynq-7020, 1 GByte DDR3L, 4 x 6 cm

Xilinx Zynq XC7Z020-1CLG400I, Dual-core ARM Cortex-A9, 1 GByte DDR3L SDRAM, 64 MByte QSPI Flash, 1 GBit Ethernet PHY, size: 4 x 6 cm

From 107.40 € (127.81 € gross) *

TE0724-04-61I33-A

In Stock: 0

PCIe Baseboard for Trenz Electronic TE0835 RFSoC

Equipped with a microSD card reader, microUSB2.0, 21x UMCC connectors and six SMD connectors, 6 x green user LEDs, reset push button, DIP switch for mode

From 299.40 € (356.29 € gross) *

TEB0835-02-A

In Stock: 5

MPSoC Module with Xilinx Zynq UltraScale+ ZU2CG-1I, 2 GByte DDR4 SDRAM, 4 x 5 cm

Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784I, 2 GByte DDR4, 128 MByte SPI Boot Flash, 8 GByte e.MMC, size: 4 x 5 cm

From 193.63 € (230.42 € gross) *

TE0820-04-2AI21FA

In Stock: 0

MAXCO2 Evaluation kit for precise CO2 measurement

The MAXCO2 is a compact evaluation kit for precise CO2 measurement of ambient air in rooms with direct display of specified CO2 levels via 8 LEDS.

70.00 € (83.30 € gross) *

TEI0024-01

In Stock: 0

MPSoC Module with Xilinx Zynq UltraScale+ ZU4EV-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm

Xilinx Zynq UltraScale+ XCZU4EV-1SFVC784E, 2 GByte DDR4, 128 MByte QSPI Boot Flash, 8 GByte e.MMC Memory, size: 4 x 5 cm

389.00 € (462.91 € gross) * €399.00 *

TE0820-03-4DE21FA

In Stock: 14

MPSoC Module with Xilinx Zynq UltraScale+ ZU2EG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm

Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E, 2 GByte DDR4, 128 MByte QSPI Boot Flash, 8 GByte e.MMC, size: 4 x 5 cm

From 200.33 € (238.39 € gross) *

TE0820-04-2BE21FA

In Stock: 0

SoC Module with Xilinx Zynq-7010, 1 GByte DDR3L, 4 x 6 cm

Xilinx Zynq XC7Z010-1CLG400I, Dual-core ARM Cortex-A9, 1 GByte DDR3L SDRAM, 64 MByte QSPI Flash, 1 GBit Ethernet PHY, size: 4 x 6 cm

From 80.40 € (95.68 € gross) *

TE0724-04-41I33-A

In Stock: 0

MPSoC Module with Xilinx Zynq UltraScale+ ZU3EG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm

Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 8 GByte e.MMC, size: 4 x 5 cm

From 233.83 € (278.26 € gross) *

TE0820-04-3BE21FA

In Stock: 0

icoUSBaseboard: FTDI Interfacebasis for icoBoard

USB FTDI Interface Board for icoBoard

From 26.13 € (31.09 € gross) *

TE0889-03

In Stock: 0

Dual fast Ethernet FPGA Module with Xilinx Artix-7 35T, 512 MB DDR3, 4 x 5 cm

Xilinx Artix-7 XC7A35T-2CSG324I, 32 MByte Quad-SPI Flash, 512 MByte DDR3, Dual 100 MBit Ethernet PHY, size: 4 x 5 cm

From 71.40 € (84.97 € gross) *

TE0710-02-42I21-A

In Stock: 0

MPSoC Module with Xilinx Zynq UltraScale+ ZU4EG-2E, 4 GB DDR4, 5.2 x 7.6 cm, LP

Low profile (1 mm) socket strips, Xilinx Zynq UltraScale+ XCZU4EG-2SFVC784E FPGA. 4 GByte DDR4, 128 MByte QSPI Boot Flash, size: 5.2 x 7.6 cm

From 300.83 € (357.99 € gross) *

TE0803-03-4GE21-L

In Stock: 31

MPSoC Module with Xilinx Zynq UltraScale+ ZU7EV-1E, 4 GByte DDR4, 5.2 x 7.6 cm

Xilinx Zynq UltraScale+ XCZU7EV-1FBVB900E, 4 GByte DDR4, 128 MByte QSPI Boot Flash, size: 5.2 x 7.6 cm

From 850.23 € (1,011.77 € gross) *

TE0807-03-7DE21-A

In Stock: 16

FPGA Module with Xilinx Artix-7 XC7A50T-2CSG325I, 1.8V Configuration, 4 x 3 cm

Xilinx Artix-7 XC7A50T-2CSG325I, 16 MByte QSPI Flash memory, plug-on module with 2 × 100-pin high speed connectors, special 1.8V configuration

From 56.40 € (67.12 € gross) *

TE0714-03-50-2IAC6

In Stock: 497

Trenz Electronic 4 x 5 Module Carrier for CRUVI Extension Boards

3 x High Speed CRUVI B2B connectors , 1 x Low Speed CRUVI B2B connector, Intel Max 10 FPGA as system controller, Gigabit RJ45 LAN socket, microSD card socket, micro USB2.0 socket

From 77.05 € (91.69 € gross) *

TEB0707-02

In Stock: 0

CRUVI Motor Driver Module

Mezzanine card, supports motors with up to 4 phases up to 40V.

From 137.35 € (163.45 € gross) *

CR00140-02

In Stock: 0

Carrier Board for Trenz Electronic TEM0005 Microsemi SmartFusion2 SoC

Equipped with a LAN socket, a FTDI JTAG/UART to USB2.0 solution, three low speed and one high speed CRUVI B2B Connectors, a Pmod Connector.

From 79.73 € (94.88 € gross) *

TEMB0005-01

In Stock: 0

MPSoC Module with Xilinx Zynq UltraScale+ ZU2CG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm

Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 8 GByte e.MMC, size: 4 x 5 cm

From 173.53 € (206.50 € gross) *

TE0820-04-2AE21FA

In Stock: 0

DataStorm DAQ - M-Board FMC Carrier for M-Series Precision Converters

Intel Cyclone V 5CSEMA5F31C8N FPGA, 1 GByte DDR3-SDRAM for HPS and FPGA, 32 MByte QSPI Flash for HPS and FPGA, LPC FMC Connector, 4 x Pmod Connector, 4 x USB 2.0 Host, JTAG, UART, Ethernet, HDMI

From 361.86 € (430.61 € gross) *

TEI0022-03

In Stock: 0

TE0716 - SoM with Xilinx Zynq-7000 SoC XC7Z020, 1 GByte DDR3L, 45 x 65 mm

SoM with Xilinx Zynq-7000 SoC XC7Z020, 1 GByte DDR3L-1600 SDRAM, 32 MByte SPI Flash memory, Gigabit Ethernet PHY, USB PHY, USB2.0 to UART/JTAG

From 143.40 € (170.65 € gross) *

TE0716-01-61C32-A

In Stock: 0

MPSoC Module with Xilinx Zynq UltraScale+ ZU3EG-1E, 2 GByte DDR4, 4 x 5 cm, LP

Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 8 GByte e.MMC, size: 4 x 5 cm, low profile (2,5 mm)

From 233.83 € (278.26 € gross) *

TE0820-04-3BE21FL

In Stock: 0

PCIe FMC Carrier with Xilinx Kintex-7 325T, 4 Lane PCIe GEN2, DDR3 SODIMM ECC

Xilinx Kintex-7 XC7K325T-2FBG676C, Vita 57.1 FMC HPC Slot, 4 lane PCIe Gen 2, DDR3 SODIMM Socket, 32 MByte SPI Flash

From 501.83 € (597.18 € gross) *

TEF1001-02-325-2C

In Stock: 0

MPSoC Module with Xilinx Zynq UltraScale+ ZU4EV-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm

Xilinx Zynq UltraScale+ XCZU4EV-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 8 GByte e.MMC, size: 4 x 5 cm

From 274.03 € (326.10 € gross) *

TE0820-04-4DE21FA

In Stock: 4

RFSoC Module with Xilinx Zynq UltraScale+ RFSoC ZU25DR-1, 4 GB DDR4, 6.5x9 cm

Xilinx Zynq UltraScale+ RFSoC XCZU25DR-1FFVE1156E, 4 GByte DDR4, 128 MByte SPI Boot Flash

From 3,540.00 € (4,212.60 € gross) *

TE0835-02-MXE21-A

In Stock: 6

Heat Spreader for Trenz Electronic MPSoC Modules TE0803

Cooling solution especially desgined for Trenz Electronic MPSoC module TE0803 (from REV03).

From 23.40 € (27.85 € gross) *

KK0803-03A

In Stock: 0

IceZero with Lattice ICE40HX, 4 MBit external SRAM, 5.6 x 3.05 cm

Low cost general purpose Lattice FPGA platform for the RaspberryPi. It includes 4 MBit of external SRAM and 4 2x6 Pmod interfaces for 32 3.3V LVCMOS IO's to external expansion devices.

From 22.78 € (27.11 € gross) *

TE0876-02-A

In Stock: 0

S7 Mini - Fully Open-Source Module with Xilinx Spartan-7 7S25, 64 Mbit HyperRAM

Fully Open-Source Spartan-7 Module, 64 Mbit Config PROM for dual-boot and/or SW code storage, 64 Mbit HyperRAM DRAM, 5V supply input

From 22.78 € (27.11 € gross) *

TE0890-01-P1C-5-A

In Stock: 0

Testboard for Trenz Electronic MPSoC modules TE0803, TE0807 and TE0808

Testboard for TE0803, TE0807 and TE0808 MPSoC modules, single 3.3V input, header for TE0790 JTAG/UART Adapter

From 109.88 € (130.76 € gross) *

TEBT0808-02

In Stock: 21

MPSoC Module with Xilinx Zynq UltraScale+ ZU4EG-1E, 4 GByte DDR4, 5.2 x 7.6 cm

Xilinx Zynq UltraScale+ XCZU4EG-1FBVB900E, 4 GByte DDR4, 128 MByte QSPI Boot Flash, size: 5.2 x 7.6 cm

From 434.83 € (517.45 € gross) *

TE0807-03-4BE21-A

In Stock: 0

FPGA Module with Intel Cyclone 10 GX, 2 GByte DDR3L SDRAM, 6 x 8 cm

Intel Cyclone 10 GX 10CX220YF780I5G, 2 GByte DDR3L SDRAM, 256 MByte SPI Flash, 226 I/O's, Gigabit Ethernet, EEPROM, Size: 6 x 8 cm

From 333.66 € (397.06 € gross) *

TEI0006-03-220-5I

In Stock: 0

Dual fast Ethernet FPGA Module with Xilinx Artix-7 100T, 512 MB DDR3, 4 x 5 cm

Xilinx Artix-7 XC7A100T-2CSG324I, 32 MByte Quad-SPI Flash, 512 MByte DDR3, Dual 100 MBit Ethernet PHY, size: 4 x 5 cm

From 113.40 € (134.95 € gross) *

TE0710-02-72I21-A

In Stock: 1

MPSoC Module with Xilinx Zynq UltraScale+ ZU5EV-1I, 2 GByte DDR4 SDRAM, 4 x 5 cm

Xilinx Zynq UltraScale+ XCZU5EV-1SFVC784I, 2 GByte DDR4, 128 MByte SPI Boot Flash, 8 GByte e.MMC, size: 4 x 5 cm

From 669.33 € (796.50 € gross) *

TE0820-04-5DI21FA

In Stock: 0

CompactPCI Serial Card

CompactPCI Serial Card for Trenz Electronic modules with form factor 5.2 x 7.6 cm, compatible with TE0803, TE0807 and TE0808

From 599.40 € (713.29 € gross) *

TEC0810-03

In Stock: 5

ZynqBerryZero Module with Xilinx Zynq-7010, 512 MB DDR3L SDRAM, 3 x 6.5 cm

Raspberry Pi Zero form factor, Xilinx Zynq XC7Z010-1CLG225C FPGA, 512 MByte DDR3L SDRAM, 16 MByte Flash, USB, mini HDMI, 26 GPIO, size: 3 x 6,5 cm

From 76.23 € (90.71 € gross) *

TE0727-02-41C34

In Stock: 1

MPSoC Module with Xilinx Zynq UltraScale+ ZU3CG-1, 4 GByte DDR4 SDRAM, 4 x 5 cm

Xilinx Zynq UltraScale+ XCZU3CG-1SFVC784E, 4 GByte DDR4, 128 MByte SPI Boot Flash, 64 GByte e.MMC, size: 4 x 5 cm, pin compatible with TE0820

From 267.33 € (318.12 € gross) *

TE0821-01-3AE31KA

In Stock: 0

MPSoC Module with Xilinx Zynq UltraScale+ ZU4CG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm

Xilinx Zynq UltraScale+ XCZU4CG-1SFVC784E, 2 GByte DDR4, 128 MByte QSPI Boot Flash, 8 GByte e.MMC, size: 4 x 5 cm

From 297.48 € (354.00 € gross) *

TE0820-04-4AE21FA

In Stock: 0

MPSoC Module with Xilinx Zynq UltraScale+ ZU2EG-1E, 2 GByte DDR4, 4 x 5 cm, LP

Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784I, 2 GByte DDR4, 128 MByte QSPI Boot Flash, 8 GByte e.MMC, size: 4 x 5 cm

From 233.83 € (278.26 € gross) *

TE0820-04-2BI21FL

In Stock: 0

MPSoC Module with Xilinx Zynq UltraScale+ ZU2EG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm

Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784I, 2 GByte DDR4, 128 MByte QSPI Boot Flash, 8 GByte e.MMC, size: 4 x 5 cm

From 233.83 € (278.26 € gross) *

TE0820-04-2BI21FA

In Stock: 0

MPSoC Module with Xilinx Zynq UltraScale+ ZU2EG-1E, 2 GByte DDR4, 4 x 5 cm, LP

Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E, 2 GByte DDR4, 128 MByte QSPI Boot Flash, 8 GByte e.MMC, size: 4 x 5 cm

From 200.33 € (238.39 € gross) *

TE0820-04-2BE21FL

In Stock: 0

PCIe FMC Carrier with Xilinx Virtex-7 FPGA, 8 Lane PCIe GEN2, SO-DIMM SDRAM

Xilinx Virtex-7 XC7VX330T-2FFG1157C, DDR3 SODIM Socket, 32 MByte SPI Flash, FMC HPC, 8 lane PCIe Gen 2 capable

From 1,139.40 € (1,355.89 € gross) *

TEC0330-05

In Stock: 0

SoM with Xilinx Zynq XC7Z045-2FFG676I, 1 GByte DDR3L SDRAM, 5.2 x 7.6 cm

Xilinx Zynq-7045 SoC XC7Z045-2FFG676I, 1 GByte DDR3L SDRAM, 64 MByte QSPI Flash, USB 2.0 OTG, 250 I/O's

From 911.20 € (1,084.33 € gross) *

TE0745-02-92I11-F

In Stock: 1

MPSoC Module TE0803 with Zynq UltraScale+ ZU3CG-E and mounted Heat Spreader

TE0803-03-3AE11-A module including pre-assembled heat spreader, Xilinx Zynq UltraScale+ XCZU3CG-1SFVC784E, 2 GByte DDR4, 128 MByte QSPI Boot Flash, size: 5.2 x 7.6 cm

From 251.25 € (298.99 € gross) *

TE0803-03-3AE11-AK

In Stock: 0

UltraSOM+ MPSoC Module with Zynq UltraScale+ ZU15EG and mounted Heat Spreader

TE0808-05-BBE21-A module including pre-assembled heat spreader, Xilinx Zynq UltraScale+ XCZU15EG-1FFVC900E, 4 GByte DDR4 SDRAM, 128 MByte SPI Boot Flash, size: 5.2 x 7.6 cm

From 967.48 € (1,151.30 € gross) *

TE0808-05-BBE21-AK

In Stock: 0

UltraSOM+ MPSoC-Module with Zynq UltraScale+ ZU9EG-I and mounted Heat Spreader

TE0808-05-9GI21-A module including pre-assembled heat spreader, Xilinx Zynq UltraScale+ XCZU9EG-2FFVC900I, 4 GByte DDR4 SDRAM, 128 MByte SPI Boot Flash, size: 5.2 x 7.6 cm

From 1,138.33 € (1,354.61 € gross) *

TE0808-05-9GI21-AK

In Stock: 0

UltraSOM+ MPSoC Module with Zynq UltraScale+ ZU9EG-E and mounted Heat Spreader

TE0808-05-9BE21-A module including pre-assembled heat spreader, Xilinx Zynq UltraScale+ XCZU9EG-1FFVC900E, 4 GByte DDR4 SDRAM, 128 MByte SPI Boot Flash, size: 5.2 x 7.6 cm

From 786.58 € (936.03 € gross) *

TE0808-05-9BE21-AK

In Stock: 0

UltraSOM+ MPSoC Module with Zynq UltraScale+ ZU6EG-E and mounted Heat Spreader

TE0808-05-6BE21-A module including pre-assembled heat spreader, Xilinx Zynq UltraScale+ XCZU6EG-1FFVC900E, 4 GByte DDR4 SDRAM, 128 MByte SPI Boot Flash, size: 5.2 x 7.6 cm

From 642.53 € (764.61 € gross) *

TE0808-05-6BE21-AK

In Stock: 0

TE0808-05-9GI21-AS Starter Kit with Zynq UltraScale+ ZU9 FPGA Module

TE0808-05-9GI21-A MPSoC module with pre-mounted heat sink on TEBF0808-04A carrier board in a Core V1 Mini-ITX enclosure. Also included: Be Quiet! 400W power supply, 2 x XMOD FTDI JTAG adapters (built-in), 8 GB micro SD card, USB cable,...

From 1,657.58 € (1,972.52 € gross) *

TE0808-05-9GI21-AS

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TE0808-05-9BE21-AS Starter Kit with Zynq UltraScale+ ZU9 FPGA Module

TE0808-05-9BE21-A MPSoC module with pre-mounted heat sink on TEBF0808-04A carrier board in a Core V1 Mini-ITX enclosure. Also included: Be Quiet! 400W power supply, 2 x XMOD FTDI JTAG adapters (built-in), 8 GB micro SD card, USB cable,...

From 1,285.73 € (1,530.02 € gross) *

TE0808-05-9BE21-AS

In Stock: 0

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