Trenz Electronic FPGA and SoC Modules

The micromodules designed by Trenz Electronic feature modern FPGA's. With small size and high-density connectors, they can be used nearly everywhere.

Gigabit Ethernet and integrated USB guarantees high data transfer rates to a host PC.

Other assembly options for cost or performance optimization plus high volume prices available on request.

Trenz Electronic will not discontinue series as long as key components are available.

Through our membership in the AMD Adaptive Computing Partner Program, we learn as early as possible about upcoming discontinuations and prepare transitions to possible successors to ideally ensure a seamless transition.

Trenz Electronic Module and Carrier Board Life Cycles
Carrier boards are no longer produced if all suitable modules go EOL.

Products with integrated AMD FPGA

Series	Device Familiy	Carrier Board	Launch Year	Expected Life Cycle (in years)
TE09xx	Versal™ AI Edge		2024	21+
TE08xx	Zynq™ UltraScale+™ Kintex™ UltraScale™	TEBA08xx, TEBF08xx, TEBT08xx	2017	28
TE07xx	Zynq™ 7000 Artix™ 7 Kintex™ 7	TEBA07xx, TEBB07xx, TEB07xx, TEBT07xx, TE070x	2012	28
TE0630	Spartan™ 6 USB	TE0303	2011	19
TE0600	Spartan™ 6 Ethernet	TE0603	2010	20

Products with integrated Intel FPGA

Series	Device Family	Carrier Board	Launch Year	Expected Life Cycle (in years)
TEI0180	AGILEX^®	-	2019	16
TEI0003	Cyclone^® 10	-	2017	23
TEI0006	Cyclone^® 10	TEIB0006	2017	23
TEI0009	Cyclone^® 10	-	2017	23
TEI1000	Stratix^® 10	-	2016	19
TEI0001	MAX^® 10 FPGA	-	2014	26
TEI0010	MAX^® 10 FPGA	-	2014	26

Modules (sorted by publication date)	Photo	Form factor (cm)
TE0813 MPSoC module with AMD Zynq UltraScale+, 2 GByte DDR4 SDRAM and 128 MByte QSPI Boot Flash dual parallel, Graphic Processing Unit (EG + EV) and Video Codec Unit (EV) depending on the variant, plug-on module with 4 x 240-pin B2B connectors. Extended temperature range. Overview available models		5.2 x 7.6
TE0865 The Trenz Electronic TE0865 is a high performance MPSoC module integrating a AMD Zynq UltraScale+. Furthermore, the module is equipped with 4 GByte DDR4 SDRAM with ECC on PS, 4 GByte DDR4 SDRAM on PL, 256 MByte Flash memory for configuration and operation, Gigabit Ethernet PHY and powerful switch-mode power supplies for all on-board voltages. Extended temperature range. Test board available. Overview available models		7.5 x 10
CR00040 Arrow Electronics and Trenz Electronic developed a very small and comprehensive module for qualified CO₂ measurements to support customers in their development and end products. The small CRUVI module includes Sensirion's new miniature CO₂ sensor. The SCD4x family has also an integrated humidity sensor and temperature sensor. SMD compatibility and extremely compact dimensions enable cost-efficient and space-saving integration of customer designs. The CRUVI module is available with and without CO₂ sensor. Overview available models		3.2 x 1.8
TEI0022 SoC board based on Intel Cyclone V FPGA, an Ethernet PHY, one GByte DDR3 SDRAM per HPS and FPGA and one 32 MByte Quad SPI Flash memory for configuration and operation per HPS and FPGA, and powerful switching-mode power supplies for all on-board voltages. Overview available models		13 x 16
TE0716 SoM (System on Module) based on AMD Zynq-7000 SoC with 1 GByte SDRAM, 32 MByte of SPI Flash memory, 10 x 12-Bit Low Power SAR ADCs, 512 Kb serial EEPROM, Gigabit Ethernet PHY transceiver, an USB PHY transceiver, a single chip USB2.0 to UART/JTAG interface (AMD license included), and powerful switching-mode power supplies for all on-board voltages, commercial temperature range. Overview available models		4.5 x 6.5
TE0835 The Trenz Electronic TE0835 is based on the AMD Zynq UltraScale+ RFSoC. The module is equipped with 4 x 1 GByte DDR4 SDRAM memory, 2 x 64 MByte SPI Flash memory, USB2.0, Ethernet transceiver and 2 x Samtec Razor Beam Board to Board (B2B) connectors. Extended temperature range. Carrier board available. Overview available models		6.5 x 9
TEF0010 FMC-Modul FMC module with AMD Artix-7 FPGA and 4 x 16-bit GMSL serializers. Overview available models		6.9 x 8.4
TE0727 The ZynqBerryZero is a SoC module with integrated AMD Zynq-7010 FPGA and the form factor of the Raspberry Pi Zero. Furthermore, the small board is equipped with 512 MByte DDR3L SDRAM, 16 MByte Flash and various connectors, such as two microUSB connectors, a micro SD card slot, a mini HDMI and a CSI-2 connector (camera). Extended temperature range. Overview available models		3 x 6.5
TE0823 MPSoC module with a low-power AMD Zynq UltraScale+ ZU3, 1 GByte LPDDR4 with low power consumption, 128 MByte QSPI Boot Flash, 8 GByte e.MMC memory, Gigabit Ethernet transceiver PHY, high speed USB2-ULPI transceiver OTG, 132 x HP PL I/Os, 4 GTR (for USB3, SATA, PCIe, DP) and 14 x PS MIOs. Industrial temperature range. Carrier board available. Overview available models		4 x 5
TE0802 MPSoC Development Board with AMD Zynq UltraScale+ ZU2, 1 GByte LPDDR4, 32 MByte SPI Flash, USB 3.0 Host (type A connector) and DisplayPort. Other assembly options for the FPGA and the memory chips are available. Extended temperature range. Overview available models		10 x 10
TE0821 MPSoC module integrating a AMD Zynq UltraScale+ ZU3EG, 2 GByte DDR4 SDRAM, 128 MByte QSPI-Boot Flash, 4 high-speed interfaces for serial I/Os (HSSIO), 34 x High Performance and 96 x High Density PL I/Os, 14 x PS MIOs, 4 x serial PS GTR transceiver, Graphic Processor Unit (GPU), extended and industrial temperature range. This module is pin compatible with TE0820 MPSoC modules. Carrier board available. Overview available models		4 x 5
TEI0006 An industrial grade module based on Intel Cyclone 10 GX. Intel Cyclone 10 GX device family delivers higher core, transceiver and I/O performance than the previous generation of low cost FPGAs. Carrierboard available. Overview available models		6 x 8
TE0890 "S7 Mini" FPGA module integrating a AMD Spartan-7, 64 MBit HyperRAM DRAM, 64 MBit Config PROM for dual-boot and/or SW code storage and dual-pinout DIP-40 or 50mil 80 pin connectors for 32 or 64 FPGA 3.3V I/Os. The module is footprint compatible with 7S6, 7S15, 7S50 FTGB-196 devices. Overview available models		2.7 x 5.2
TEC0117 "GOWIN LittleBee" Low cost FPGA module integrating a GOWIN LittleBee 1NR9 FPGA with 8 MByte internal SDRAM and 8 MByte SPI Flash for user applications. It's compatible to the Arduino MKR standard. Overview available models		2.5 x 6.15
TEC0089 DesignWare ARC EM Software Development Plattform The DesignWare® ARC® EM Software Development Platform is a flexible platform for rapid software development on ARC EM processors and subsystems. It is intended to accelerate software development and debug of ARC EM processor-based systems for a wide range of ultra-low power embedded applications such as IoT, sensor fusion, and voice applications. It includes an FPGA-based hardware board with commonly used peripherals and interfaces for extensibility. Downloadable platform packages containing different hardware configurations enable the board to be programmed with different ARC EM processors and subsystems. Overview available models		-
TEF0008 FMC Card FPGA to Mezzanine Card (FMC) based on VITA 57.1 FMC HPC Standard, with four SFP+ 10 GBit ports for fiber optical SFP modules. It is inteded for use on a FMC HPC carrier and can not be used stand-alone. Overview available models		6.9 x 8.4
TEF0007 FMC Card DisplayPort 1.2 compatible FMC card with data rates up to 5.4 Gbps and sink and source DP connector. Overview available models		6.9 x 8.4
TEM0001 "SMF2000" FPGA modul with Microsemi SmartFusion2 and 8 MByte Flash. SmartFusion2 combines a 166 MHz Cortex-M3 MCU including 256 KByte Flash and 80 KByte SRAM, as well as 12 kLUT FPGA Core Logic. The TEM0001 is ideal for evaluation and rapid prototying. It's compatible to the Arduino MKR standard. Overview available models		2.5 x 6.15
TEI0003 "CYC1000" FPGA module with an integrated Intel Cyclone 10 LP FPGA, 8 MByte SDRAM, 2 MByte Flash and a LIS3DH 3-axis sensor. It's compatible to the Arduino MKR standard. Overview available models		2.5 x 6.15
TEL0001 "LXO2000" FPGA module integrating a Lattice XO2-4000 and on-board USB/JTAG. It's compatible to the Arduino MKR standard. Overview available models		2.5 x 6.15
TEI0001 "MAX1000" FPGA IoT Maker Board that has been designed for end-to-end application development and optimised for cost. The Arrow MAX1000 board can be installed directly into a custom application or integrated on to a completely separate board. At the heart of the maker board is a compact (11x11mm) Intel MAX10 FPGA with 8000 logic elements. This single chip includes integrated flash memory, a 1Msps 12bit ADC for analogue signals and a 3.3V power supply. Other features include embedded SRAM, DSP blocks, instant-on within milliseconds, and the ability to implement Intel’s NIOS II soft core embedded processor to perform microcontroller tasks. Overview available models		2.5 x 6.15
TE0724 SoC module with AMD Zynq XC7Z010 or XC7Z020, dual-core ARM Cortex-A9 MPCore, 1 GByte DDR3L SDRAM, 32 MByte QSPI Flash memory, 1 GBit Ethernet PHY, I/O PL:80/PS:20, MAC-Adress EEPROM, 128 KBit EEProm, CAN transceiver, on-board DC/DC controller, industrial temperature range, carrier board available. Overview available models		4 x 6
TE0807 UltraSOM+ MPSoC module with AMD Zynq UltraScale+ ZU07EV, 4 GByte DDR4 SDRAM, 128 MByte SPI Boot Flash (dual parallel), plug-on module with 4 x 160-pin connectors, serial transceivers: GTR 4 (all) + GTH 16 (all), Graphic Processing Unit (GPU) + Video codec unit (VCU), extended temperature range, carrier board and individual cooling solution available. Overview available models		5.2 x 7.6
TEF1001 PCIe FMC Carrier integrating a AMD Kintex-7 FPGA (K160T, K325T or K410T), 32 MByte SPI Flash, a 4 lane PCIe, a Vita 57.1 FMC HPC Slot and a DDR3 SODIMM Socket. Overview available models		-
TE0713 FPGA module with AMD Zynq Artix-7, USB 3.0 to FIFO bridge, 1 GByte of DDR3L SDRAM, 32 MByte Flash memory, Plug-on module with 2 x 100-pin and 1 x 60-pin high-speed hermaphroditic strips, carrier board available. Overview available models		4 x 5
TE0803 MPSoC module with AMD Zynq UltraScale+, 4 x 512 MByte (2 GByte) 64-Bit DDR4 SDRAM (up to 8 GByte max), 2 x 256 MBit (2 x 32 MByte) SPI Boot Flash dual parallel (up to 512 MByte max), plug-on module with 4 x 160 pin B2B connectors, carrier board, cooling solution and starter kit available. Overview available models		5.2 x 7.6
TE0820 MPSoC module with AMD Zynq UltraScale+, 1 GByte (2 x 512 MByte) DDR4 SDRAM with 32-Bit width, 2 x 32 MByte Flash memory, B2B connectors: 2 x 100 pin and 1 x 60 pin, carrier board available. Overview available models		4 x 5
TE0714 FPGA module with AMD Artix-7 35T or 50T, 16 MByte QSPI Flash, smallest module with tranceivers, industrial temperature range, carrier board available. Overview available models		4 x 3
TE0745 SoC module with AMD Zynq-7030 or Zynq-7045, 1 GByte DDR3 SDRAM, 32 MByte SPI Flash, 1 GBit Ethernet, 8 x GTX (7030: 4 GT), RTC, industrial temperature range, carrier board available. Overview available models		5.2 x 7.6
TE0841 FPGA module with AMD Kintex UltraScale KU35/KU40, 2 GByte DDR4, 64 MByte SPI Boot Flash, 3.2 mm mounting holes for skyline heat spreader, serial transceiver: GTH 8 Lanes (all), industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0808 UltraSOM+ MPSoC module with AMD Zynq UltraScale+, 4 x 512 MByte (2 GByte) 64-Bit DDR4 memory, 2 x 256 MBit (2 x 32 MByte) SPI Boot Flash (dual parallel), B2B connectors: 4 x 160 pin, serial transceiver: GTR 4 (all) + GTH 16 (all), industrial temperature range, carrier board and starter kit available. Overview available models		5.2 x 7.6
TE0725LP FPGA module with AMD Artix-7 100T, 32 MByte Flash, optional HyperRAM or HyperFlash, 2 x 50 pin with 2,54 mm pitch, VIN 3,3V or 1,8V, commercial temperature range available (industrial temperature range on request). Overview available models		7.3 x 3.5
TE0725 FPGA module with AMD Artix-7 15T, 35T or 100T, 32 MByte Flash, from revision 03 64 MBit HyperRAM, 2 x 50 Pin with 2.54 mm pitch, optional Fiber Optic Module (125/250 or 1000 MBit/s), commercial temperature range available (industrial temperature range on request). Overview available models		7.3 x 3.5
TE0726 "ZynqBerry" SoC module with AMD Zynq-7010 with Raspberry Pi form factor, 512 MByte (128 MByte) DDR3L, 16 MByte SPI Flash, Micro SD socket, 4 USB with power switches, 100 MBit Ethernet, DSI and CSI-2 Connector (display and camera), HAT header with 26 I/O's, commercial temperature range. Overview available models		like Raspberry Pi Model 2
TE0729 SoC module with AMD Zynq-7020, 512 MByte DDR3, 32 MByte QSPI-Flash, 1 x 10/100/1000 Mbps Ethernet transceiver PHY, 2 x 10/100 Mbps Ethernet transceiver PHYs, RTC, equipped with sulfur resistant resistors, industrial temperature range, carrier board and starter kit available. Overview available models		5.2 x 7.6
TE0723 "ArduZynq" SoC module with AMD Zynq-7010 with Arduino Shield form factor, 128 MByte DDR3L; version M: 512 MByte DDR3L, 16 MByte SPI Flash, Hi-Speed USB2.0 ULPI Transceiver, 23 FPGA I/O's on B2B connectors available, commercial temperature range. Overview available models		Arduino shield
TE0782 SoC module with AMD Zynq-7035, Zynq-7045 or Zynq-7100, 1 GByte DDR3, 32 MByte QSPI Flash, 4 GByte eMMC (optional up to 64 GByte), 2 x Gigabit Ethernet Tranceiver, RTC, optional 2 x 8 MByte HyperRAM (max. 2 x 32 MByte), 16 GTX high-performance Tranceiver Lanes, industrial temperature range, test fixture available. Overview available models		8.5 x 8.5
TE0722 "DIPFORTy1 Soft Propeller" Propeller compatible DIP40 pinout module with AMD Zynq-7010, 16 MByte SPI Flash (primary boot), 33.333 MHz Clock (MEMS Oscillator), Total user accessible PL I/O: 46 (+3 Input only), MicroSD Card socket, commercial temperature range. Overview available models		1.8 x 5.1
TE0728 SoC module with AMD automotive Zynq-7020, 512 MByte DDR3, 16 MByte QSPI Flash, 2 x 100 MBit Ethernet Transceiver (PHY), 76 single ended I/O, 24 LVDS pairs (48 I/O) and 42 MIO available on B2B connectors, CAN Transceiver (PHY), automotive temperature range, carrier board available. Overview available models		6 x 6
TE0715 SoC module with AMD Zynq-7015 or Zynq-7030, 1 GByte DDR3, 32 MByte QSPI Flash, 1 GBit Ethernet, 4 GTP/GTX Tranceivers, Programmable Clock Generator: Transceiver Clock (default 125 MHz), industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0712 FPGA module with AMD Artix-7 100T or 200T, 1 GByte DDDR3, 32 MByte Quad-SPI Flash, 100 MBit Ethernet, 4 Multi Gigabit transceivers, industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0711 FPGA module with AMD Artix-7 35T or 100T, 32 MByte QSPI Flash, 100 MHz MEMS oscillator, 178 FPGA I/O's (84 differential pairs), 3 User LED's, industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0710 FPGA module with AMD Artix-7 35T or 100T, 512 MByte DDR3, 32 MByte QSPI Flash, 2 x 100 MBit Ethernet, industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0720 SoC module with AMD Zynq-7020, 256 MByte/512 MByte DDR3L/1 GByte DDR3 (depending on version), 32 MByte SPI Flash, 4 GByte e-NAND (up to 32 GByte), 152 FPGA I/O's available on B2B connectors, RTC, 3 User LED's, automotive, industrial and commercial temperature range, carrier board and starter kit available. Overview available models		4 x 5
TE0741 FPGA module with AMD Kintex-7 70T, 160T, 325T or 410T, 32 MByte Quad-SPI Flash, max. GTX transceiver data rate 10,3125 Gb/s (default 6,6 Gb/s), 8 Multi Gigabit Transceivers, 2 User LED, 1 DONE PFGA pin LED, industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0630 FPGA module with AMD Spartan-6 LX45, LX75 oder LX150, 128 MByte DDR3, 8 MByte SPI Flash, up to 40 different and up to 109 single end FPGA I/O pins available on B2B connectors, 1.2 V, 1.5 V, 2.5 V = VCCAUX and 3.3 V power rails, 4 User LED, 1 User Push-Button, 2 User DIP Switches, industrial temperature range, carrier board available. Overview available models		4 x 5
TE0600 GigaBee module with AMD Spartan-6 LX45, LX100 or LX150, two independent 128 MByte DDR SDRAM banks (optional 2 x 512 MByte DDR SDRAM), 16 MByte SPI Flash, 10/100/1000 tri-speed GBit Ethernet transceiver (PHY), JTAG Port, industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0300 FPGA module with AMD Spartan-3E, 32 MBit SPI Flash, 512 MBit DDR RAM up to 666 MByte/s bandwidth, 3 on-board DC-DC converters for high efficieny, 104 I/Os + 6 Inputs available on B2B connectors, industrial and commercial temperature range, carrier board available. Overview available models		4.05 x 4.75

The micromodules designed by Trenz Electronic feature modern FPGA's. With small size and high-density connectors, they can be used nearly everywhere. Gigabit Ethernet and integrated USB... read more »

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Trenz Electronic FPGA and SoC Modules

The micromodules designed by Trenz Electronic feature modern FPGA's. With small size and high-density connectors, they can be used nearly everywhere.

Gigabit Ethernet and integrated USB guarantees high data transfer rates to a host PC.

Other assembly options for cost or performance optimization plus high volume prices available on request.

Trenz Electronic will not discontinue series as long as key components are available.

Trenz Electronic Module and Carrier Board Life Cycles
Carrier boards are no longer produced if all suitable modules go EOL.

Products with integrated AMD FPGA

Series	Device Familiy	Carrier Board	Launch Year	Expected Life Cycle (in years)
TE09xx	Versal™ AI Edge		2024	21+
TE08xx	Zynq™ UltraScale+™ Kintex™ UltraScale™	TEBA08xx, TEBF08xx, TEBT08xx	2017	28
TE07xx	Zynq™ 7000 Artix™ 7 Kintex™ 7	TEBA07xx, TEBB07xx, TEB07xx, TEBT07xx, TE070x	2012	28
TE0630	Spartan™ 6 USB	TE0303	2011	19
TE0600	Spartan™ 6 Ethernet	TE0603	2010	20

Products with integrated Intel FPGA

Series	Device Family	Carrier Board	Launch Year	Expected Life Cycle (in years)
TEI0180	AGILEX^®	-	2019	16
TEI0003	Cyclone^® 10	-	2017	23
TEI0006	Cyclone^® 10	TEIB0006	2017	23
TEI0009	Cyclone^® 10	-	2017	23
TEI1000	Stratix^® 10	-	2016	19
TEI0001	MAX^® 10 FPGA	-	2014	26
TEI0010	MAX^® 10 FPGA	-	2014	26

Modules (sorted by publication date)	Photo	Form factor (cm)
TE0813 MPSoC module with AMD Zynq UltraScale+, 2 GByte DDR4 SDRAM and 128 MByte QSPI Boot Flash dual parallel, Graphic Processing Unit (EG + EV) and Video Codec Unit (EV) depending on the variant, plug-on module with 4 x 240-pin B2B connectors. Extended temperature range. Overview available models		5.2 x 7.6
TE0865 The Trenz Electronic TE0865 is a high performance MPSoC module integrating a AMD Zynq UltraScale+. Furthermore, the module is equipped with 4 GByte DDR4 SDRAM with ECC on PS, 4 GByte DDR4 SDRAM on PL, 256 MByte Flash memory for configuration and operation, Gigabit Ethernet PHY and powerful switch-mode power supplies for all on-board voltages. Extended temperature range. Test board available. Overview available models		7.5 x 10
CR00040 Arrow Electronics and Trenz Electronic developed a very small and comprehensive module for qualified CO₂ measurements to support customers in their development and end products. The small CRUVI module includes Sensirion's new miniature CO₂ sensor. The SCD4x family has also an integrated humidity sensor and temperature sensor. SMD compatibility and extremely compact dimensions enable cost-efficient and space-saving integration of customer designs. The CRUVI module is available with and without CO₂ sensor. Overview available models		3.2 x 1.8
TEI0022 SoC board based on Intel Cyclone V FPGA, an Ethernet PHY, one GByte DDR3 SDRAM per HPS and FPGA and one 32 MByte Quad SPI Flash memory for configuration and operation per HPS and FPGA, and powerful switching-mode power supplies for all on-board voltages. Overview available models		13 x 16
TE0716 SoM (System on Module) based on AMD Zynq-7000 SoC with 1 GByte SDRAM, 32 MByte of SPI Flash memory, 10 x 12-Bit Low Power SAR ADCs, 512 Kb serial EEPROM, Gigabit Ethernet PHY transceiver, an USB PHY transceiver, a single chip USB2.0 to UART/JTAG interface (AMD license included), and powerful switching-mode power supplies for all on-board voltages, commercial temperature range. Overview available models		4.5 x 6.5
TE0835 The Trenz Electronic TE0835 is based on the AMD Zynq UltraScale+ RFSoC. The module is equipped with 4 x 1 GByte DDR4 SDRAM memory, 2 x 64 MByte SPI Flash memory, USB2.0, Ethernet transceiver and 2 x Samtec Razor Beam Board to Board (B2B) connectors. Extended temperature range. Carrier board available. Overview available models		6.5 x 9
TEF0010 FMC-Modul FMC module with AMD Artix-7 FPGA and 4 x 16-bit GMSL serializers. Overview available models		6.9 x 8.4
TE0727 The ZynqBerryZero is a SoC module with integrated AMD Zynq-7010 FPGA and the form factor of the Raspberry Pi Zero. Furthermore, the small board is equipped with 512 MByte DDR3L SDRAM, 16 MByte Flash and various connectors, such as two microUSB connectors, a micro SD card slot, a mini HDMI and a CSI-2 connector (camera). Extended temperature range. Overview available models		3 x 6.5
TE0823 MPSoC module with a low-power AMD Zynq UltraScale+ ZU3, 1 GByte LPDDR4 with low power consumption, 128 MByte QSPI Boot Flash, 8 GByte e.MMC memory, Gigabit Ethernet transceiver PHY, high speed USB2-ULPI transceiver OTG, 132 x HP PL I/Os, 4 GTR (for USB3, SATA, PCIe, DP) and 14 x PS MIOs. Industrial temperature range. Carrier board available. Overview available models		4 x 5
TE0802 MPSoC Development Board with AMD Zynq UltraScale+ ZU2, 1 GByte LPDDR4, 32 MByte SPI Flash, USB 3.0 Host (type A connector) and DisplayPort. Other assembly options for the FPGA and the memory chips are available. Extended temperature range. Overview available models		10 x 10
TE0821 MPSoC module integrating a AMD Zynq UltraScale+ ZU3EG, 2 GByte DDR4 SDRAM, 128 MByte QSPI-Boot Flash, 4 high-speed interfaces for serial I/Os (HSSIO), 34 x High Performance and 96 x High Density PL I/Os, 14 x PS MIOs, 4 x serial PS GTR transceiver, Graphic Processor Unit (GPU), extended and industrial temperature range. This module is pin compatible with TE0820 MPSoC modules. Carrier board available. Overview available models		4 x 5
TEI0006 An industrial grade module based on Intel Cyclone 10 GX. Intel Cyclone 10 GX device family delivers higher core, transceiver and I/O performance than the previous generation of low cost FPGAs. Carrierboard available. Overview available models		6 x 8
TE0890 "S7 Mini" FPGA module integrating a AMD Spartan-7, 64 MBit HyperRAM DRAM, 64 MBit Config PROM for dual-boot and/or SW code storage and dual-pinout DIP-40 or 50mil 80 pin connectors for 32 or 64 FPGA 3.3V I/Os. The module is footprint compatible with 7S6, 7S15, 7S50 FTGB-196 devices. Overview available models		2.7 x 5.2
TEC0117 "GOWIN LittleBee" Low cost FPGA module integrating a GOWIN LittleBee 1NR9 FPGA with 8 MByte internal SDRAM and 8 MByte SPI Flash for user applications. It's compatible to the Arduino MKR standard. Overview available models		2.5 x 6.15
TEC0089 DesignWare ARC EM Software Development Plattform The DesignWare® ARC® EM Software Development Platform is a flexible platform for rapid software development on ARC EM processors and subsystems. It is intended to accelerate software development and debug of ARC EM processor-based systems for a wide range of ultra-low power embedded applications such as IoT, sensor fusion, and voice applications. It includes an FPGA-based hardware board with commonly used peripherals and interfaces for extensibility. Downloadable platform packages containing different hardware configurations enable the board to be programmed with different ARC EM processors and subsystems. Overview available models		-
TEF0008 FMC Card FPGA to Mezzanine Card (FMC) based on VITA 57.1 FMC HPC Standard, with four SFP+ 10 GBit ports for fiber optical SFP modules. It is inteded for use on a FMC HPC carrier and can not be used stand-alone. Overview available models		6.9 x 8.4
TEF0007 FMC Card DisplayPort 1.2 compatible FMC card with data rates up to 5.4 Gbps and sink and source DP connector. Overview available models		6.9 x 8.4
TEM0001 "SMF2000" FPGA modul with Microsemi SmartFusion2 and 8 MByte Flash. SmartFusion2 combines a 166 MHz Cortex-M3 MCU including 256 KByte Flash and 80 KByte SRAM, as well as 12 kLUT FPGA Core Logic. The TEM0001 is ideal for evaluation and rapid prototying. It's compatible to the Arduino MKR standard. Overview available models		2.5 x 6.15
TEI0003 "CYC1000" FPGA module with an integrated Intel Cyclone 10 LP FPGA, 8 MByte SDRAM, 2 MByte Flash and a LIS3DH 3-axis sensor. It's compatible to the Arduino MKR standard. Overview available models		2.5 x 6.15
TEL0001 "LXO2000" FPGA module integrating a Lattice XO2-4000 and on-board USB/JTAG. It's compatible to the Arduino MKR standard. Overview available models		2.5 x 6.15
TEI0001 "MAX1000" FPGA IoT Maker Board that has been designed for end-to-end application development and optimised for cost. The Arrow MAX1000 board can be installed directly into a custom application or integrated on to a completely separate board. At the heart of the maker board is a compact (11x11mm) Intel MAX10 FPGA with 8000 logic elements. This single chip includes integrated flash memory, a 1Msps 12bit ADC for analogue signals and a 3.3V power supply. Other features include embedded SRAM, DSP blocks, instant-on within milliseconds, and the ability to implement Intel’s NIOS II soft core embedded processor to perform microcontroller tasks. Overview available models		2.5 x 6.15
TE0724 SoC module with AMD Zynq XC7Z010 or XC7Z020, dual-core ARM Cortex-A9 MPCore, 1 GByte DDR3L SDRAM, 32 MByte QSPI Flash memory, 1 GBit Ethernet PHY, I/O PL:80/PS:20, MAC-Adress EEPROM, 128 KBit EEProm, CAN transceiver, on-board DC/DC controller, industrial temperature range, carrier board available. Overview available models		4 x 6
TE0807 UltraSOM+ MPSoC module with AMD Zynq UltraScale+ ZU07EV, 4 GByte DDR4 SDRAM, 128 MByte SPI Boot Flash (dual parallel), plug-on module with 4 x 160-pin connectors, serial transceivers: GTR 4 (all) + GTH 16 (all), Graphic Processing Unit (GPU) + Video codec unit (VCU), extended temperature range, carrier board and individual cooling solution available. Overview available models		5.2 x 7.6
TEF1001 PCIe FMC Carrier integrating a AMD Kintex-7 FPGA (K160T, K325T or K410T), 32 MByte SPI Flash, a 4 lane PCIe, a Vita 57.1 FMC HPC Slot and a DDR3 SODIMM Socket. Overview available models		-
TE0713 FPGA module with AMD Zynq Artix-7, USB 3.0 to FIFO bridge, 1 GByte of DDR3L SDRAM, 32 MByte Flash memory, Plug-on module with 2 x 100-pin and 1 x 60-pin high-speed hermaphroditic strips, carrier board available. Overview available models		4 x 5
TE0803 MPSoC module with AMD Zynq UltraScale+, 4 x 512 MByte (2 GByte) 64-Bit DDR4 SDRAM (up to 8 GByte max), 2 x 256 MBit (2 x 32 MByte) SPI Boot Flash dual parallel (up to 512 MByte max), plug-on module with 4 x 160 pin B2B connectors, carrier board, cooling solution and starter kit available. Overview available models		5.2 x 7.6
TE0820 MPSoC module with AMD Zynq UltraScale+, 1 GByte (2 x 512 MByte) DDR4 SDRAM with 32-Bit width, 2 x 32 MByte Flash memory, B2B connectors: 2 x 100 pin and 1 x 60 pin, carrier board available. Overview available models		4 x 5
TE0714 FPGA module with AMD Artix-7 35T or 50T, 16 MByte QSPI Flash, smallest module with tranceivers, industrial temperature range, carrier board available. Overview available models		4 x 3
TE0745 SoC module with AMD Zynq-7030 or Zynq-7045, 1 GByte DDR3 SDRAM, 32 MByte SPI Flash, 1 GBit Ethernet, 8 x GTX (7030: 4 GT), RTC, industrial temperature range, carrier board available. Overview available models		5.2 x 7.6
TE0841 FPGA module with AMD Kintex UltraScale KU35/KU40, 2 GByte DDR4, 64 MByte SPI Boot Flash, 3.2 mm mounting holes for skyline heat spreader, serial transceiver: GTH 8 Lanes (all), industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0808 UltraSOM+ MPSoC module with AMD Zynq UltraScale+, 4 x 512 MByte (2 GByte) 64-Bit DDR4 memory, 2 x 256 MBit (2 x 32 MByte) SPI Boot Flash (dual parallel), B2B connectors: 4 x 160 pin, serial transceiver: GTR 4 (all) + GTH 16 (all), industrial temperature range, carrier board and starter kit available. Overview available models		5.2 x 7.6
TE0725LP FPGA module with AMD Artix-7 100T, 32 MByte Flash, optional HyperRAM or HyperFlash, 2 x 50 pin with 2,54 mm pitch, VIN 3,3V or 1,8V, commercial temperature range available (industrial temperature range on request). Overview available models		7.3 x 3.5
TE0725 FPGA module with AMD Artix-7 15T, 35T or 100T, 32 MByte Flash, from revision 03 64 MBit HyperRAM, 2 x 50 Pin with 2.54 mm pitch, optional Fiber Optic Module (125/250 or 1000 MBit/s), commercial temperature range available (industrial temperature range on request). Overview available models		7.3 x 3.5
TE0726 "ZynqBerry" SoC module with AMD Zynq-7010 with Raspberry Pi form factor, 512 MByte (128 MByte) DDR3L, 16 MByte SPI Flash, Micro SD socket, 4 USB with power switches, 100 MBit Ethernet, DSI and CSI-2 Connector (display and camera), HAT header with 26 I/O's, commercial temperature range. Overview available models		like Raspberry Pi Model 2
TE0729 SoC module with AMD Zynq-7020, 512 MByte DDR3, 32 MByte QSPI-Flash, 1 x 10/100/1000 Mbps Ethernet transceiver PHY, 2 x 10/100 Mbps Ethernet transceiver PHYs, RTC, equipped with sulfur resistant resistors, industrial temperature range, carrier board and starter kit available. Overview available models		5.2 x 7.6
TE0723 "ArduZynq" SoC module with AMD Zynq-7010 with Arduino Shield form factor, 128 MByte DDR3L; version M: 512 MByte DDR3L, 16 MByte SPI Flash, Hi-Speed USB2.0 ULPI Transceiver, 23 FPGA I/O's on B2B connectors available, commercial temperature range. Overview available models		Arduino shield
TE0782 SoC module with AMD Zynq-7035, Zynq-7045 or Zynq-7100, 1 GByte DDR3, 32 MByte QSPI Flash, 4 GByte eMMC (optional up to 64 GByte), 2 x Gigabit Ethernet Tranceiver, RTC, optional 2 x 8 MByte HyperRAM (max. 2 x 32 MByte), 16 GTX high-performance Tranceiver Lanes, industrial temperature range, test fixture available. Overview available models		8.5 x 8.5
TE0722 "DIPFORTy1 Soft Propeller" Propeller compatible DIP40 pinout module with AMD Zynq-7010, 16 MByte SPI Flash (primary boot), 33.333 MHz Clock (MEMS Oscillator), Total user accessible PL I/O: 46 (+3 Input only), MicroSD Card socket, commercial temperature range. Overview available models		1.8 x 5.1
TE0728 SoC module with AMD automotive Zynq-7020, 512 MByte DDR3, 16 MByte QSPI Flash, 2 x 100 MBit Ethernet Transceiver (PHY), 76 single ended I/O, 24 LVDS pairs (48 I/O) and 42 MIO available on B2B connectors, CAN Transceiver (PHY), automotive temperature range, carrier board available. Overview available models		6 x 6
TE0715 SoC module with AMD Zynq-7015 or Zynq-7030, 1 GByte DDR3, 32 MByte QSPI Flash, 1 GBit Ethernet, 4 GTP/GTX Tranceivers, Programmable Clock Generator: Transceiver Clock (default 125 MHz), industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0712 FPGA module with AMD Artix-7 100T or 200T, 1 GByte DDDR3, 32 MByte Quad-SPI Flash, 100 MBit Ethernet, 4 Multi Gigabit transceivers, industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0711 FPGA module with AMD Artix-7 35T or 100T, 32 MByte QSPI Flash, 100 MHz MEMS oscillator, 178 FPGA I/O's (84 differential pairs), 3 User LED's, industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0710 FPGA module with AMD Artix-7 35T or 100T, 512 MByte DDR3, 32 MByte QSPI Flash, 2 x 100 MBit Ethernet, industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0720 SoC module with AMD Zynq-7020, 256 MByte/512 MByte DDR3L/1 GByte DDR3 (depending on version), 32 MByte SPI Flash, 4 GByte e-NAND (up to 32 GByte), 152 FPGA I/O's available on B2B connectors, RTC, 3 User LED's, automotive, industrial and commercial temperature range, carrier board and starter kit available. Overview available models		4 x 5
TE0741 FPGA module with AMD Kintex-7 70T, 160T, 325T or 410T, 32 MByte Quad-SPI Flash, max. GTX transceiver data rate 10,3125 Gb/s (default 6,6 Gb/s), 8 Multi Gigabit Transceivers, 2 User LED, 1 DONE PFGA pin LED, industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0630 FPGA module with AMD Spartan-6 LX45, LX75 oder LX150, 128 MByte DDR3, 8 MByte SPI Flash, up to 40 different and up to 109 single end FPGA I/O pins available on B2B connectors, 1.2 V, 1.5 V, 2.5 V = VCCAUX and 3.3 V power rails, 4 User LED, 1 User Push-Button, 2 User DIP Switches, industrial temperature range, carrier board available. Overview available models		4 x 5
TE0600 GigaBee module with AMD Spartan-6 LX45, LX100 or LX150, two independent 128 MByte DDR SDRAM banks (optional 2 x 512 MByte DDR SDRAM), 16 MByte SPI Flash, 10/100/1000 tri-speed GBit Ethernet transceiver (PHY), JTAG Port, industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0300 FPGA module with AMD Spartan-3E, 32 MBit SPI Flash, 512 MBit DDR RAM up to 666 MByte/s bandwidth, 3 on-board DC-DC converters for high efficieny, 104 I/Os + 6 Inputs available on B2B connectors, industrial and commercial temperature range, carrier board available. Overview available models		4.05 x 4.75

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Microchip PolarFire® SoC FPGA 25T-1I, 1 GByte LPDDR4 SDRAM, 4 x 5 cm

Industrial-grade Microchip PolarFire® MPFS025T-1FCVG484I FPGA, 1 GByte LPDDR4 SDRAM, 64 MByte SPI Flash, size: 4 x 5 cm

from 93.13 € (110.82 € gross)

TEM0007-01-CAD31-A

In Stock: 0

Basisboard for Trenz Electronic TEM0010 SoM

Carrier board for the Trenz Electronic TEM0010 SoM

Price on request

TEMB0010-01-A

In Stock: 0

Baseboard for Trenz Electronic TEI1000 SoM

Carrier board for the Altera® Stratix® 10 SoM TEI1000

from 243.88 € (290.22 € gross)

TEB1000-02-A

In Stock: 0

CRUVI HDMI Adapter

CRUVI Adapter for HDMI with high-speed level shifter PTN3363

15.00 € (17.85 € gross)

CR00240-01-A

In Stock: 14

FPGA module with GateMate A1 from Cologne Chip, 16 MByte QSPI Flash, 4 x 5 cm

Cologne Chip GateMate CCGM1A1 FPGA, 16 MByte Quad SPI flash, 2 x 100 pin B2B connector, 25 MHz Clock Oscillator, One SerDes lane, 118 Total I/O

from 121.68 € (144.80 € gross)

TEG2000-01-A1I-1A

In Stock: 98

MPSoC-Module with AMD Zynq™ UltraScale+™ ZU4EG-1E incl. Heat Spreader

TE0813-02-4BE81-A module including pre-assembled heat spreader, size: 5.2 x 7.6 cm

from 287.43 € (342.04 € gross)

TE0813-02-4BE81-AK

In Stock: 2

SoC Module with Stratix® 10 SX 1SX040 plus ARM Processor, 1 GByte DDR4, 6 x 8 cm

Altera® Stratix® 10 SX 1SX040HH3F35I3VG SoC FPGA, 1 GByte DDR4, 64 MByte QSPI Flash, 18 Gigabit Transeivers, MAX® 10 System Controller, size: 6 x 8 cm

409.00 € (486.71 € gross)

TEI1000-02-A3I11-A

In Stock: 0

TE0820-05-4DE81MAS Starter Kit

TE0820-05-4DE81MA MPSoC module with AMD Zynq™ UltraScale+™ ZU4EV on a TE0703-07 carrier including heat sink and accessories.

599.00 € (712.81 € gross)

TE0820-05-4DE81MAS

In Stock: 0

Pmod-Compatible CAN-FD transceiver, industrial temperature range

Pmod-Compatible CAN-FD transceiver,compatible with Digilent's Pmod interfaces.

from 12.73 € (15.15 € gross)

TEP0001-02-A

In Stock: 99

AMD Versal™ AI Edge SoM with VE2302 device, 4 x 5.64 cm

AMD Versal™ AI Edge adaptive SoC XCVE2302-1LSESFVA784, 2 x 4 GB LPDDR4, 256 MByte OSPI Flash, 32 GByte eMMC, 2Kbit EEPROM, 8 x GTYP Transceiver, 2 x Samtec ADM B2B connectors, size: 4 x 5.64 cm

from 622.43 € (740.69 € gross)

TE0955-01-EGBE32-A

In Stock: 0

RFSoC Module with AMD Zynq™ UltraScale+™ ZU25DR-1E, 4 GByte DDR4, 6.5 x 9 cm

AMD Zynq™ UltraScale+™ RFSoC XCZU25DR-1FFVE1156E Gen1, 4 GByte DDR4, 128 MByte SPI Boot Flash, 8 RF-ADCs with 4.096 GSPS, 8 RF-DACs with 6.554 GSPS

Price on request

TE0835-03-MXE81-A

In Stock: 3

icoBoard Version 1.1 with 8 Mbit SRAM

Lattice FPGA with 8k LUT, 100 MHz max. clock, 8 Mbit of SRAM and programmable in Verilog by a complete open source FPGA toolchain

from 59.63 € (70.96 € gross)

TE0887-04-M

In Stock: 90

SoC Module with Altera® Agilex™ 5E, 2 GB LPDDR4 SDRAM, 5.2 x 7.6 cm

Altera® Agilex™ 5E A5ED065B, 2 GB LPDDR4 SDRAM, 256 MB QSPI Flash, size: 5.2 x 7.6 cm

from 351.08 € (417.79 € gross)

TEI0187-01-T4E11-A

In Stock: 0

MPSoC Module with AMD Zynq™ UltraScale+™ ZU5EV-1I, 4 GByte DDR4, 4 x 5,64 cm

AMD Zynq™ UltraScale+™ XCZU5EV-1SFVC784I, 4 GByte DDR4 SDRAM with ECC, 2 x 64 MByte QSPI Flash, Samtec ADM6-60 connector, size: 4 x 5.64 cm

from 602.33 € (716.77 € gross)

AM0010-02-5DI81MA

In Stock: 0

MPSoC Module with AMD Zynq™ UltraScale+™ ZU4CG-1E, 4 GByte DDR4, 4 x 5.64 cm

AMD Zynq™ UltraScale+™ XCZU4CG-1SFVC784E, 4 GByte DDR4 SDRAM with ECC, 2 x 64 MByte QSPI Flash, Samtec ADM6-60 connector, size: 4 x 5.64 cm

from 320.93 € (381.91 € gross)

AM0010-02-4AE81MA

In Stock: 0

Heat Spreader for Trenz Electronic MPSoC Module TE0817-02

Cooling solution especially desgined for Trenz Electronic MPSoC module TE0817-02

from 19.43 € (23.12 € gross)

KK0817-02

In Stock: 1

MPSoC Module with AMD Zynq™ UltraScale+™ ZU4EG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm

AMD Zynq™ UltraScale+™ XCZU4EG-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 8 GByte e.MMC, size: 4 x 5 cm

from 260.63 € (310.15 € gross)

TE0820-05-4BE81MA

In Stock: 180

MPSoC Module with AMD Zynq™ UltraScale+™ ZU3EG-1I, 2 GByte DDR4, 4 x 5 cm, LP

AMD Zynq™ UltraScale+™ XCZU3EG-1SFVC784I, 2 GByte DDR4, 128 MByte QSPI Boot Flash, 8 GByte e.MMC, size: 4 x 5 cm, low profile (2,5 mm)

from 334.33 € (397.85 € gross)

TE0820-05-3BI81ML

In Stock: 1

MAX1000 - IoT Maker Board, 8kLE, 8 MByte SDRAM, 8 MByte Flash, 6.15 x 2.5 cm

The MAX1000 is based on the MAX®10 FPGA from Altera® and is a complete production board, designed for evaluation and final products.

34.00 € (40.46 € gross)

TEI0001-04-DBC87A

In Stock: 0

UltraSOM+ MPSoC Module with AMD Zynq™ UltraScale+™ ZU15EG-1E, 4 GByte DDR4

AMD Zynq™ UltraScale+™ XCZU15EG-1FFVC900E, 4 GByte DDR4 SDRAM, 128 MByte SPI Boot Flash, 20 x serial high speed transceiver, size: 5.2 x 7.6 cm

from 990.93 € (1,179.21 € gross)

TE0808-05-BBE81-E

In Stock: 0

UltraSOM+ MPSoC Module with AMD Zynq™ UltraScale+™ ZU9EG-1E, 4 GByte DDR4

AMD Zynq™ UltraScale+™ XCZU9EG-1FFVC900E, 4 GByte DDR4 SDRAM, 128 MByte SPI Boot Flash, 20 x serial high speed transceiver, size: 5.2 x 7.6 cm

from 776.53 € (924.07 € gross)

TE0808-05-9BE81-E

In Stock: 0

UltraSOM+ MPSoC Module with AMD Zynq™ UltraScale+™ ZU6EG-1E, 4 GByte DDR4

AMD Zynq™ UltraScale+™ ZU6EG-1FFVC900E, 4 GByte DDR4 SDRAM, 128 MByte Flash memory, 20 serial high speed transceivers, size: 5.2 x 7.6 cm

from 662.63 € (788.53 € gross)

TE0808-05-6BE81-E

In Stock: 0

CRUVI GT FMC Adapter

FMC to CRUVI adapter

79.00 € (94.01 € gross)

CR00112-01-A

In Stock: 57

MPSoC Module with AMD Zynq™ UltraScale+™ ZU3CG-1E, 4 GByte DDR4, 4 x 5 cm

AMD Zynq™ UltraScale+™ XCZU3CG-1SFVC784E, 4 GByte DDR4, 128 MByte Flash, 64 GByte e.MMC, pin-compatible with TE0820, size: 4 x 5 cm

from 274.03 € (326.10 € gross)

TE0821-02-3AE91PA

In Stock: 0

MPSoC Module with Zynq™ UltraScale+™ ZU11EG-1I, 4GB DDR4 ECC (PS), 4GB DDR4 (PL)

AMD Zynq™ UltraScale+™ XCZU11EG-2FFVC1760I, 4 GByte DDR4 SDRAM+ECC (PS), 4 GByte DDR4 SDRAM (PL), 128 MByte QSPI Boot Flash, size: 7.5 x 10 cm

from 7,062.48 € (8,404.35 € gross)

TE0865-02-AGI81MA

In Stock: 0

MPSoC Modul wit Zynq™ UltraScale+™ ZU17EG-2I, 4 GB DDR4 ECC (PS), 4 GB DDR4 (PL)

AMD Zynq™ UltraScale+™ XCZU17EG-2FFVC1760I, 4 GByte DDR4 SDRAM+ECC(PS), 4 GByte DDR4 SDRAM (PL), 256 MByte QSPI Boot Flash, size: 7.5 x 10 cm

from 4,103.28 € (4,882.90 € gross)

TE0865-02-DGI83MA

In Stock: 0

MPSoC Module with Zynq™ UltraScale+™ ZU19EG-1I, 4 GB DDR4 ECC(PS), 4 GB DDR4(PL)

AMD Zynq™ UltraScale+™ XCZU19EG-1FFVC1760I, 4 GByte DDR4 SDRAM+ECC(PS), 4 GByte DDR4 SDRAM (PL),256 MByte QSPI Boot Flash, size: 7.5 x 10 cm

from 2,713.68 € (3,229.28 € gross)

TE0865-02-FBI83MA

In Stock: 0

MPSoC Module with Zynq™ UltraScale+™ ZU19EG-2E, 4 GB DDR4 (PS), 4 GB DDR4 (PL)

AMD Zynq™ UltraScale+™ XCZU19EG-2FFVC1760E, 4 GByte DDR4 SDRAM+ECC(PS), 4 GByte DDR4 SDRAM (PL), 256 MByte QSPI Boot Flash, size: 7,5 x 10 cm

from 3,678.48 € (4,377.39 € gross)

TE0865-02-FGE83MA

In Stock: 0

MPSoC Module with Zynq™ UltraScale+™ ZU17EG-2E, 8 GB DDR4 ECC(PS), 8 GB DDR4(PL)

AMD Zynq™ UltraScale+™ XCZU17EG-2FFVC1760E, 8 GByte DDR4 SDRAM+ECC (PS), 8 GByte DDR4 SDRAM (PL), 256 MByte QSPI Boot Flash, size: 7.5 x 10 cm

from 3,433.68 € (4,086.08 € gross)

TE0865-02-DGE93MA

In Stock: 0

MPSoC Module with Zynq™ UltraScale+™ ZU19EG-1E, 4 GB DDR4 ECC(PS), 4 GB DDR4(PL)

AMD Zynq™ UltraScale+™ XCZU19EG-1FFVC1760E, 4 GByte DDR4 SDRAM+ECC (PS), 4 GByte DDR4 SDRAM (PL), 256 MByte QSPI Boot Flash, size: 7,5 x 10 cm

from 2,764.08 € (3,289.26 € gross)

TE0865-02-FBE83MA

In Stock: 7

MPSoC Module with Zynq™ UltraScale+™ ZU11EG-1I, 4 GB DDR4 ECC(PS), 4 GB DDR4(PL)

AMD Zynq™ UltraScale+™ XCZU11EG-1FFVC1760I, 4 GByte DDR4 SDRAM+ECC (PS), 4 GByte DDR4 SDRAM (PL), 128 MByte QSPI Boot Flash, size: 7.5 x 10 cm

from 2,591.28 € (3,083.62 € gross)

TE0865-02-ABI81MA

In Stock: 10

MPSoC Module with Zynq™ UltraScale+™ ZU17EG-2E, 4 GB DDR4 ECC(PS), 4 GB DDR4(PL)

AMD Zynq™ UltraScale+™ XCZU17EG-2FFVC1760E, 4 GByte DDR4 SDRAM+ECC (PS), 4 GByte DDR4 SDRAM (PL), 256 MByte QSPI Boot Flash, size: 7.5 x 10 cm

from 3,383.28 € (4,026.10 € gross)

TE0865-02-DGE83MA

In Stock: 0

UltraSOM+ MPSoC Module with AMD Zynq™ UltraScale+™ ZU6EG-1E, 4 GByte DDR4, LP

Low Profile Terminal/Socket Strips (1 mm), AMD Zynq™ UltraScale+™ ZU6EG-1FFVC900E, 4 GByte DDR4, 128 MByte SPI Flash, 20 x serial high speed transceiver, size: 5.2 x 7.6 cm

from 662.63 € (788.53 € gross)

TE0808-05-6BE81-F

In Stock: 0

MPSoC Module with AMD Zynq™ UltraScale+™ ZU7CG-1I, 4 GByte DDR4, 5.2 x 7.6 cm

AMD Zynq™ UltraScale+™ XCZU7CG-1FBVB900I, 4 GByte DDR4, 128 MByte QSPI Boot Flash, size: 5,2 x 7,6 cm

from 1,366.13 € (1,625.69 € gross)

TE0807-04-7AI81-A

In Stock: 0

RFSoC Module with AMD Zynq™ UltraScale+™ ZU47DR-1E incl. Heat Spreader

TE0835-03-TXE81-E module including pre-assembled heat spreader, size: 6.5 x 9 cm

Price on request

TE0835-03-TXE81-AK

In Stock: 0

UltraSOM+ MPSoC Module with AMD Zynq™ UltraScale+™ ZU15EG-1E incl. Heat Spreader

TE0808-05-BBE21-A module including pre-assembled heat spreader, size: 5.2 x 7.6 cm

from 1,017.73 € (1,211.10 € gross)

TE0808-05-BBE81-EK

In Stock: 0

UltraSOM+ MPSoC Module with AMD Zynq™ UltraScale+™ ZU9EG-1E incl. Heat Spreader

TE0808-05-9BE81-E module including pre-assembled heat spreader, size: 5.2 x 7.6 cm

from 796.63 € (947.99 € gross)

TE0808-05-9BE81-EK

In Stock: 0

UltraSOM+ MPSoC Module with AMD Zynq™ UltraScale+™ ZU6EG-1E incl. Heat Spreader

TE0808-05-6BE81-E module including pre-assembled heat spreader, size: 5.2 x 7.6 cm

from 682.73 € (812.45 € gross)

TE0808-05-6BE81-EK

In Stock: 0

UltraSOM+ MPSoC-Module with AMD Zynq™ UltraScale+™ ZU9EG-2I incl. Heat Spreader

TE0808-05-9GI21-A module including pre-assembled heat spreader, size: 5.2 x 7.6 cm

from 1,011.03 € (1,203.13 € gross)

TE0808-05-9GI81-EK

In Stock: 0

Starter Kit with AMD Zynq™ UltraScale+™ ZU7EV-1E MPSoC module

MPSoC module TE0817 with pre-assembled heat sink on a TEBF0818 carrier board in a Core Mini-ITX case, accessories included.

2,069.00 € (2,462.11 € gross)

TE0817-02-7DE81-AS

In Stock: 0

MPSoC Module with AMD Zynq™ UltraScale+™ ZU7EV-1E incl. Heat Spreader

TE0807-04-7DE81-A module including pre-assembled heat spreader, size: 5.2 x 7.6 cm

from 1,198.63 € (1,426.37 € gross)

TE0807-04-7DE81-AK

In Stock: 0

MPSoC Module with AMD Zynq™ UltraScale+™ ZU4EG-1E incl. Heat Spreader

TE0807-04-4BE81-A module including pre-assembled heat spreader, size: 5.2 x 7.6 cm

from 575.53 € (684.88 € gross)

TE0807-04-4BE81-AK

In Stock: 0

PCIe FMC Carrier with AMD Kintex 7 160T, DDR3 SODIMM ECC, GTX 6,6 Gb/s

AMD Kintex-7 XC7K160T-2FBG676I, Vita 57.1 FMC HPC Slot, 4 lane PCIe Gen 2, 32 MByte SPI Flash, with mounted heat sink

from 665.40 € (791.83 € gross)

TEF1001-03-B2IX4-K

In Stock: 12

PCIe FMC Carrier with AMD Kintex 7 325T, DDR3 SODIMM ECC, GTX 6,6 Gb/s

AMD Kintex-7 XC7K325T-2FBG676C, Vita 57.1 FMC HPC Slot, 4 lane PCIe Gen 2, 32 MByte SPI Flash, with mounted heat sink

from 755.40 € (898.93 € gross)

TEF1001-03-D2CX4-K

In Stock: 0

PCIe FMC Carrier with AMD Kintex 7 160T, DDR3 SODIMM ECC, GTX 10,31 Gb/s

AMD Kintex-7 XC7K160T-2FFG676I, Vita 57.1 FMC HPC Slot, 4 lane PCIe Gen 2, 32 MByte SPI Flash, with mounted heat sink

from 755.40 € (898.93 € gross)

TEF1001-03-B2IX4-M

In Stock: 7

PCIe FMC Carrier with AMD Kintex 7 410T, DDR3 SODIMM ECC, GTX 6,6 Gb/s

AMD Kintex-7 XC7K410T-2FBG676I, Vita 57.1 FMC HPC Slot, 4 lane PCIe Gen 2, 32 MByte SPI Flash, with mounted heat sink

from 1,211.40 € (1,441.57 € gross)

TEF1001-03-G2IX4-K

In Stock: 0

MPSoC Module with AMD Zynq™ UltraScale+™ ZU7EV-1E, 4 GByte DDR4, 5.2 x 7.6 cm

AMD Zynq™ UltraScale+™ XCZU7EV-1FBVB900E, 4 GByte DDR4, 128 MByte QSPI Boot Flash, size: 5,2 x 7,6 cm

from 1,178.53 € (1,402.45 € gross)

TE0807-04-7DE81-A

In Stock: 0

MPSoC Module with AMD Zynq™ UltraScale+™ ZU4EG-1E, 4 GByte DDR4, 5.2 x 7.6 cm

AMD Zynq™ UltraScale+™ XCZU4EG-1FBVB900E, 4 GByte DDR4, 128 MByte QSPI Boot Flash, size: 5,2 x 7,6 cm

from 568.83 € (676.91 € gross)

TE0807-04-4BE81-A

In Stock: 0

MPSoC Module with AMD Zynq™ UltraScale+™ ZU4EV-1E, 4 GByte DDR4, low profile

AMD Zynq™ UltraScale+™ XCZU4EV-1SFVC784E, 4 GByte SDRAM, 128 MByte Flash, 8 GByte e.MMC, pin-compatible with TE0820, size: 4 x 5 cm

from 354.43 € (421.77 € gross)

TE0821-02-4DE91ML

In Stock: 0

MPSoC Module with AMD Zynq™ UltraScale+™ ZU2CG-1E, 4 GByte DDR4, 4 x 5 cm

AMD Zynq™ UltraScale+™ XCZU2CG-1SFVC784E, 4 GByte DDR4, 128 MByte Flash, 64 GByte e.MMC, pin-compatible with TE0820, size: 4 x 5 cm

from 220.43 € (262.31 € gross)

TE0821-02-2AE91PA

In Stock: 10

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