| Modules (sorted by publication date) |
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Form factor (cm) |
| TE0813
MPSoC module with Xilinx Zynq UltraScale+, 2 GByte DDR4 SDRAM and 128 MByte QSPI Boot Flash dual parallel, Graphic Processing Unit (EG + EV) and Video Codec Unit (EV) depending on the variant, plug-on module with 4 x 240-pin B2B connectors. Extended temperature range.
Overview available models
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5.2 x 7.6 |
| TE0812
The Trenz Electronic TE0812 is a powerful and also space-qualified evaluation board, based on a Xilinx Zynq UltraScale+ MPSoC. Equipped with 4 GByte DDR4 SDRAM ECC, dual 64 MByte (resp. 128 MByte) serial flash memory for configuration and operation, dual 4 Mbit MRAM, dual 32 GByte e.MMC and powerful switch-mode power supplies for all on-board voltages. Industrial temperature range.
Overview available models
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9 x 9 |
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TE0865
The Trenz Electronic TE0865 is a high performance MPSoC module integrating a Xilinx Zynq UltraScale+. Furthermore, the module is equipped with 4 GByte DDR4 SDRAM with ECC on PS, 4 GByte DDR4 SDRAM on PL, 256 MByte Flash memory for configuration and operation, Gigabit Ethernet PHY and powerful switch-mode power supplies for all on-board voltages. Extended temperature range. Test board available.
Overview available models
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7.5 x 10 |
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CR00040
Arrow Electronics and Trenz Electronic developed a very small and comprehensive module for qualified CO2 measurements to support customers in their development and end products. The small CRUVI module includes Sensirion's new miniature CO2 sensor. The SCD4x family has also an integrated humidity sensor and temperature sensor. SMD compatibility and extremely compact dimensions enable cost-efficient and space-saving integration of customer designs. The CRUVI module is available with and without CO2 sensor.
Overview available models
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3.2 x 1.8 |
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TEI0022
SoC board based on Intel Cyclone V FPGA, an Ethernet PHY, one GByte DDR3 SDRAM per HPS and FPGA and one 32 MByte Quad SPI Flash memory for configuration and operation per HPS and FPGA, and powerful switching-mode power supplies for all on-board voltages.
Overview available models
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13 x 16 |
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TE0716
SoM (System on Module) based on Xilinx Zynq-7000 SoC with 1 GByte SDRAM, 32 MByte of SPI Flash memory, 10 x 12-Bit Low Power SAR ADCs, 512 Kb serial EEPROM, Gigabit Ethernet PHY transceiver, an USB PHY transceiver, a single chip USB2.0 to UART/JTAG interface (Xilinx license included), and powerful switching-mode power supplies for all on-board voltages, commercial temperature range.
Overview available models
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4.5 x 6.5 |
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TE0835
The Trenz Electronic TE0835 is based on the Xilinx Zynq UltraScale+ RFSoC. The module is equipped with 4 x 1 GByte DDR4 SDRAM memory, 2 x 64 MByte SPI Flash memory, USB2.0, Ethernet transceiver and 2 x Samtec Razor Beam Board to Board (B2B) connectors. Extended temperature range. Carrier board available.
Overview available models
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6.5 x 9 |
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TEF0010 FMC-Modul
FMC module with Xilinx Artix-7 FPGA and 4 x 16-bit GMSL serializers.
Overview available models
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6.9 x 8.4 |
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TEC810
The Trenz Electronic TEC0810 is a CompactPCI Serial Card (3U form factor) that can be used as a base for Trenz Electronic modules with a form factor of 5.2 x 7.6 cm. For configuration and service, JTAG and UART are available via USB bridge and one Gigabit Ethernet on the front panel. 48 differential signals are available on the backplane.
Overview available models
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TE0727
The ZynqBerryZero is a SoC module with integrated Xilinx Zynq-7010 FPGA and the form factor of the Raspberry Pi Zero. Furthermore, the small board is equipped with 512 MByte DDR3L SDRAM, 16 MByte Flash and various connectors, such as two microUSB connectors, a micro SD card slot, a mini HDMI and a CSI-2 connector (camera). Extended temperature range.
Overview available models
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3 x 6.5 |
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TE0823
MPSoC module with a low-power Xilinx Zynq UltraScale+ ZU3, 1 GByte LPDDR4 with low power consumption, 128 MByte QSPI Boot Flash, 8 GByte e.MMC memory, Gigabit Ethernet transceiver PHY, high speed USB2-ULPI transceiver OTG, 132 x HP PL I/Os, 4 GTR (for USB3, SATA, PCIe, DP) and 14 x PS MIOs. Industrial temperature range. Carrier board available.
Overview available models
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4 x 5 |
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TE0802
MPSoC Development Board with Xilinx Zynq UltraScale+ ZU2, 1 GByte LPDDR4, 32 MByte SPI Flash, USB 3.0 Host (type A connector) and DisplayPort. Other assembly options for the FPGA and the memory chips are available. Extended temperature range.
Overview available models
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10 x 10 |
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TE0821
MPSoC module integrating a Xilinx Zynq UltraScale+ ZU3EG, 2 GByte DDR4 SDRAM, 128 MByte QSPI-Boot Flash, 4 high-speed interfaces for serial I/Os (HSSIO), 34 x High Performance and 96 x High Density PL I/Os, 14 x PS MIOs, 4 x serial PS GTR transceiver, Graphic Processor Unit (GPU), extended and industrial temperature range. This module is pin compatible with TE0820 MPSoC modules. Carrier board available.
Overview available models
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4 x 5 |
| TEI0006
An industrial grade module based on Intel Cyclone 10 GX. Intel Cyclone 10 GX device family delivers higher core, transceiver and I/O performance than the previous generation of low cost FPGAs. Carrierboard available.
Overview available models
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6 x 8 |
| TE0890 "S7 Mini"
FPGA module integrating a Xilinx Spartan-7, 64 MBit HyperRAM DRAM, 64 MBit Config PROM for dual-boot and/or SW code storage and dual-pinout DIP-40 or 50mil 80 pin connectors for 32 or 64 FPGA 3.3V I/Os. The module is footprint compatible with 7S6, 7S15, 7S50 FTGB-196 devices.
Overview available models
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2.7 x 5.2 |
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TEC0117 "GOWIN LittleBee"
Low cost FPGA module integrating a GOWIN LittleBee 1NR9 FPGA with 8 MByte internal SDRAM and 8 MByte SPI Flash for user applications. It's compatible to the Arduino MKR standard.
Overview available models
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2.5 x 6.15 |
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TEC0089 DesignWare ARC EM Software Development Plattform
The DesignWare® ARC® EM Software Development Platform is a flexible platform for rapid software development on ARC EM processors and subsystems. It is intended to accelerate software development and debug of ARC EM processor-based systems for a wide range of ultra-low power embedded applications such as IoT, sensor fusion, and voice applications. It includes an FPGA-based hardware board with commonly used peripherals and interfaces for extensibility. Downloadable platform packages containing different hardware configurations enable the board to be programmed with different ARC EM processors and subsystems.
Overview available models
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TEC0850 CompactPCI Serial Card
CompactPCI Serial card integrating a Xilinx Zynq UltraScale+ MPSoC, one DDR4 SDRAM SODIMM socket with 64bit wide data bus, max. dual 512 MByte Flash memory for configuration and operation, 24 Gigabit transceivers on PL side and 4 on PS side, powerful switch-mode power supplies for all onboard voltages, USB2 and USB3 FIFO bridges and a large number of configurable I/Os available on the CompactPCI Serial backplane connectors.
Overview available models
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10 x 16 |
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TEF0008 FMC Card
FPGA to Mezzanine Card (FMC) based on VITA 57.1 FMC HPC Standard, with four SFP+ 10 GBit ports for fiber optical SFP modules. It is inteded for use on a FMC HPC carrier and can not be used stand-alone.
Overview available models
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6.9 x 8.4 |
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TE0783
A high-performance, industrial-grade SoM (System on Module) based on Xilinx Zynq-7000 SoC with 1 GByte RAM (32bit wide DDR3) connected to PS, 2 GByte RAM (64bit wide DDR3) connected to PL, 4 GByte eMMC, 16 GTX high-performance transceiver lanes, 32 MByte QSPI Flash memory for configuration and operation, and powerful switch-mode power supplies for all on-board voltages.
Overview available models
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8.5 x 8.5 |
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TEF0007 FMC Card
DisplayPort 1.2 compatible FMC card with data rates up to 5.4 Gbps and sink and source DP connector.
Overview available models
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6.9 x 8.4 |
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TEM0001 "SMF2000"
FPGA modul with Microsemi SmartFusion2 and 8 MByte Flash. SmartFusion2 combines a 166 MHz Cortex-M3 MCU including 256 KByte Flash and 80 KByte SRAM, as well as 12 kLUT FPGA Core Logic. The TEM0001 is ideal for evaluation and rapid prototying. It's compatible to the Arduino MKR standard.
Overview available models
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2.5 x 6.15 |
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TEI0003 "CYC1000"
FPGA module with an integrated Intel Cyclone 10 LP FPGA, 8 MByte SDRAM, 2 MByte Flash and a LIS3DH 3-axis sensor. It's compatible to the Arduino MKR standard.
Overview available models
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2.5 x 6.15 |
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TEL0001 "LXO2000"
FPGA module integrating a Lattice XO2-4000 and on-board USB/JTAG. It's compatible to the Arduino MKR standard.
Overview available models
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2.5 x 6.15 |
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TEI0001 "MAX1000"
FPGA IoT Maker Board that has been designed for end-to-end application development and optimised for cost. The Arrow MAX1000 board can be installed directly into a custom application or integrated on to a completely separate board. At the heart of the maker board is a compact (11x11mm) Intel MAX10 FPGA with 8000 logic elements. This single chip includes integrated flash memory, a 1Msps 12bit ADC for analogue signals and a 3.3V power supply. Other features include embedded SRAM, DSP blocks, instant-on within milliseconds, and the ability to implement Intel’s NIOS II soft core embedded processor to perform microcontroller tasks.
Overview available models
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2.5 x 6.15 |
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TE0724
SoC module with Xilinx Zynq XC7Z010 or XC7Z020, dual-core ARM Cortex-A9 MPCore, 1 GByte DDR3L SDRAM, 32 MByte QSPI Flash memory, 1 GBit Ethernet PHY, I/O PL:80/PS:20, MAC-Adress EEPROM, 128 KBit EEProm, CAN transceiver, on-board DC/DC controller, industrial temperature range, carrier board available.
Overview available models
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4 x 6 |
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TE0807 UltraSOM+
MPSoC module with Xilinx Zynq UltraScale+ ZU07EV, 4 GByte DDR4 SDRAM, 128 MByte SPI Boot Flash (dual parallel), plug-on module with 4 x 160-pin connectors, serial transceivers: GTR 4 (all) + GTH 16 (all), Graphic Processing Unit (GPU) + Video codec unit (VCU), extended temperature range, carrier board and individual cooling solution available.
Overview available models
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5.2 x 7.6 |
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TEF1001
PCIe FMC Carrier integrating a Xilinx Kintex-7 FPGA (K160T, K325T or K410T), 32 MByte SPI Flash, a 4 lane PCIe, a Vita 57.1 FMC HPC Slot and a DDR3 SODIMM Socket.
Overview available models
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TE0713
FPGA module with Xilinx Zynq Artix-7, USB 3.0 to FIFO bridge, 1 GByte of DDR3L SDRAM, 32 MByte Flash memory, Plug-on module with 2 x 100-pin and 1 x 60-pin high-speed hermaphroditic strips, carrier board available.
Overview available models
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4 x 5 |
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TE0803
MPSoC module with Xilinx Zynq UltraScale+, 4 x 512 MByte (2 GByte) 64-Bit DDR4 SDRAM (up to 8 GByte max), 2 x 256 MBit (2 x 32 MByte) SPI Boot Flash dual parallel (up to 512 MByte max), plug-on module with 4 x 160 pin B2B connectors, carrier board, cooling solution and starter kit available.
Overview available models
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5.2 x 7.6 |
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TE0820
MPSoC module with Xilinx Zynq UltraScale+, 1 GByte (2 x 512 MByte) DDR4 SDRAM with 32-Bit width, 2 x 32 MByte Flash memory, B2B connectors: 2 x 100 pin and 1 x 60 pin, carrier board available.
Overview available models
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4 x 5 |
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TE0714
FPGA module with Xilinx Artix-7 35T or 50T, 16 MByte QSPI Flash, smallest module with tranceivers, industrial temperature range, carrier board available.
Overview available models
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4 x 3 |
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TE0745
SoC module with Xilinx Zynq-7030 or Zynq-7045, 1 GByte DDR3 SDRAM, 32 MByte SPI Flash, 1 GBit Ethernet, 8 x GTX (7030: 4 GT), RTC, industrial temperature range, carrier board available.
Overview available models
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5.2 x 7.6 |
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TE0841
FPGA module with Xilinx Kintex UltraScale KU35/KU40, 2 GByte DDR4, 64 MByte SPI Boot Flash, 3.2 mm mounting holes for skyline heat spreader, serial transceiver: GTH 8 Lanes (all), industrial and commercial temperature range, carrier board available.
Overview available models
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4 x 5 |
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TE0808 UltraSOM+
MPSoC module with Xilinx Zynq UltraScale+, 4 x 512 MByte (2 GByte) 64-Bit DDR4 memory, 2 x 256 MBit (2 x 32 MByte) SPI Boot Flash (dual parallel), B2B connectors: 4 x 160 pin, serial transceiver: GTR 4 (all) + GTH 16 (all), industrial temperature range, carrier board and starter kit available.
Overview available models
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5.2 x 7.6 |
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TE0725LP
FPGA module with Xilinx Artix-7 100T, 32 MByte Flash, optional HyperRAM or HyperFlash, 2 x 50 pin with 2,54 mm pitch, VIN 3,3V or 1,8V, commercial temperature range available (industrial temperature range on request).
Overview available models
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7.3 x 3.5 |
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TE0725
FPGA module with Xilinx Artix-7 15T, 35T or 100T, 32 MByte Flash, from revision 03 64 MBit HyperRAM, 2 x 50 Pin with 2.54 mm pitch, optional Fiber Optic Module (125/250 or 1000 MBit/s), commercial temperature range available (industrial temperature range on request).
Overview available models
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7.3 x 3.5 |
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TE0726 "ZynqBerry"
SoC module with Xilinx Zynq-7010 with Raspberry Pi form factor, 512 MByte (128 MByte) DDR3L, 16 MByte SPI Flash, Micro SD socket, 4 USB with power switches, 100 MBit Ethernet, DSI and CSI-2 Connector (display and camera), HAT header with 26 I/O's, commercial temperature range.
Overview available models
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like Raspberry Pi
Model 2 |
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TE0729
SoC module with Xilinx Zynq-7020, 512 MByte DDR3, 32 MByte QSPI-Flash, 1 x 10/100/1000 Mbps Ethernet transceiver PHY, 2 x 10/100 Mbps Ethernet transceiver PHYs, RTC, equipped with sulfur resistant resistors, industrial temperature range, carrier board and starter kit available.
Overview available models
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5.2 x 7.6 |
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TE0723 "ArduZynq"
SoC module with Xilinx Zynq-7010 with Arduino Shield form factor, 128 MByte DDR3L; version M: 512 MByte DDR3L, 16 MByte SPI Flash, Hi-Speed USB2.0 ULPI Transceiver, 23 FPGA I/O's on B2B connectors available, commercial temperature range.
Overview available models
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Arduino shield |
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TE0782
SoC module with Xilinx Zynq-7035, Zynq-7045 or Zynq-7100, 1 GByte DDR3, 32 MByte QSPI Flash, 4 GByte eMMC (optional up to 64 GByte), 2 x Gigabit Ethernet Tranceiver, RTC, optional 2 x 8 MByte HyperRAM (max. 2 x 32 MByte), 16 GTX high-performance Tranceiver Lanes, industrial temperature range, test fixture available.
Overview available models
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8.5 x 8.5 |
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TE0722 "DIPFORTy1 Soft Propeller"
Propeller compatible DIP40 pinout module with Xilinx Zynq-7010, 16 MByte SPI Flash (primary boot), 33.333 MHz Clock (MEMS Oscillator), Total user accessible PL I/O: 46 (+3 Input only), MicroSD Card socket, commercial temperature range.
Overview available models
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1.8 x 5.1 |
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TE0728
SoC module with Xilinx automotive Zynq-7020, 512 MByte DDR3, 16 MByte QSPI Flash, 2 x 100 MBit Ethernet Transceiver (PHY), 76 single ended I/O, 24 LVDS pairs (48 I/O) and 42 MIO available on B2B connectors, CAN Transceiver (PHY), automotive temperature range, carrier board available.
Overview available models
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6 x 6 |
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TE0715
SoC module with Xilinx Zynq-7015 or Zynq-7030, 1 GByte DDR3, 32 MByte QSPI Flash, 1 GBit Ethernet, 4 GTP/GTX Tranceivers, Programmable Clock Generator: Transceiver Clock (default 125 MHz), industrial and commercial temperature range, carrier board available.
Overview available models
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4 x 5 |
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TE0712
FPGA module with Xilinx Artix-7 100T or 200T, 1 GByte DDDR3, 32 MByte Quad-SPI Flash, 100 MBit Ethernet, 4 Multi Gigabit transceivers, industrial and commercial temperature range, carrier board available.
Overview available models
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4 x 5 |
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TE0711
FPGA module with Xilinx Artix-7 35T or 100T, 32 MByte QSPI Flash, 100 MHz MEMS oscillator, 178 FPGA I/O's (84 differential pairs), 3 User LED's, industrial and commercial temperature range, carrier board available.
Overview available models
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4 x 5 |
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TE0710
FPGA module with Xilinx Artix-7 35T or 100T, 512 MByte DDR3, 32 MByte QSPI Flash, 2 x 100 MBit Ethernet, industrial and commercial temperature range, carrier board available.
Overview available models
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4 x 5 |
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TE0720
SoC module with Xilinx Zynq-7020, 256 MByte/512 MByte DDR3L/1 GByte DDR3 (depending on version), 32 MByte SPI Flash, 4 GByte e-NAND (up to 32 GByte), 152 FPGA I/O's available on B2B connectors, RTC, 3 User LED's, automotive, industrial and commercial temperature range, carrier board and starter kit available.
Overview available models
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4 x 5 |
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TE0741
FPGA module with Xilinx Kintex-7 70T, 160T, 325T or 410T, 32 MByte Quad-SPI Flash, max. GTX transceiver data rate 10,3125 Gb/s (default 6,6 Gb/s), 8 Multi Gigabit Transceivers, 2 User LED, 1 DONE PFGA pin LED, industrial and commercial temperature range, carrier board available.
Overview available models
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4 x 5 |
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TE0630
FPGA module with Xilinx Spartan-6 LX45, LX75 oder LX150, 128 MByte DDR3, 8 MByte SPI Flash, up to 40 different and up to 109 single end FPGA I/O pins available on B2B connectors, 1.2 V, 1.5 V, 2.5 V = VCCAUX and 3.3 V power rails, 4 User LED, 1 User Push-Button, 2 User DIP Switches, industrial temperature range, carrier board available.
Overview available models
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4 x 5 |
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TE0600
GigaBee module with Xilinx Spartan-6 LX45, LX100 or LX150, two independent 128 MByte DDR SDRAM banks (optional 2 x 512 MByte DDR SDRAM), 16 MByte SPI Flash, 10/100/1000 tri-speed GBit Ethernet transceiver (PHY), JTAG Port, industrial and commercial temperature range, carrier board available.
Overview available models
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4 x 5 |
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TE0320
Module with Xilinx Spartan-3A, 1 GBit DDR RAM up to 1333 MByte/s bandwidth, 32 MBit SPI Flash, 109 I/Os (+ 10 dual-purpose pins) available on B2B connectors, 4 LED, 2 Push Buttons, 8 DIP Switches, industrial and commercial temperature range, carrier board available.
Overview available models
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6.8 x 4.8 |
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TE0300
FPGA module with Xilinx Spartan-3E, 32 MBit SPI Flash, 512 MBit DDR RAM up to 666 MByte/s bandwidth, 3 on-board DC-DC converters for high efficieny, 104 I/Os + 6 Inputs available on B2B connectors, industrial and commercial temperature range, carrier board available.
Overview available models
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4.05 x 4.75 |
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TE0140
Module with Xilinx Spartan-3, USB 2.0 transceiver, 16 KBit EEPROM, 120 available I/O's on B2B connectors, one LED, 1 push button, commercial temperature range, carrier board available.
Overview available models
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5.07 x 4.36 |
