Trenz Electronic FPGA and SoC Modules

The micromodules designed by Trenz Electronic feature modern FPGA's. With small size and high-density connectors, they can be used nearly everywhere.

Gigabit Ethernet and integrated USB guarantees high data transfer rates to a host PC.

Other assembly options for cost or performance optimization plus high volume prices available on request.

The following tables are for guidance only. Trenz Electronic generally manufactures its own modules as long as chip manufacturers supply the respective chips.

Trenz Electronic Module and Carrier Board Life Cycles
Carrier boards are no longer produced if all suitable modules go EOL.

Estimated EOL dates are indicative only and may be delayed.

Products with integrated Xilinx FPGA

Series	Device Familiy	Carrier Board	Launch Year	Expected EOL	Expected Life Cycle
TE0140	Spartan-3	TE0143	2004	2021 (EOL confirmed)	17
TE0300	Spartan-3E		2005	2022	17
TE0320	Spartan-3A	TE0323	2005	2022	17
TE0600	Spartan-6 Ethernet	TE0603	2010	2027	17
TE0630	Spartan-6 USB	TE0303	2011	2027	16
TE07xx	Zynq-7000 Artix-7 Kintex-7	TEBA07xx, TEBB07xx, TEB07xx, TEBT07xx, TE070x	2013	2028	15
TE08xx	Zynq UltraScale+ Kintex UltraScale	TEBA08xx, TEBF08xx, TEBT08xx	2016	2031	15

Products with integrated Intel FPGA

Series	Device Family	Carrier Board	Launch Year	Expected EOL	Expected Life Cycle
TEI0001	MAX 10 FPGA	-	2014	2029	15
TEI0003	Cyclone 10	-	2017	2032	15
TEI0006	Cyclone 10	TEIB0006	2017	2032	15
TEI0009	Cyclone 10	-	2017	2032	15
TEI0010	MAX 10 FPGA	-	2014	2029	15
TEI0180	AGILEX	-	2019	2034	15

Modules (sorted by publication date)	Photo	Form factor (cm)
CR00040 Arrow Electronics and Trenz Electronic developed a very small and comprehensive module for qualified CO₂ measurements to support customers in their development and end products. The small CRUVI module includes Sensirion's new miniature CO₂ sensor. The SCD4x family has also an integrated humidity sensor and temperature sensor. SMD compatibility and extremely compact dimensions enable cost-efficient and space-saving integration of customer designs. The CRUVI module is available with and without CO₂ sensor. Overview available models		3.2 x 1.8
TEI0022 SoC board based on Intel Cyclone V FPGA, an Ethernet PHY, one GByte DDR3 SDRAM per HPS and FPGA and one 32 MByte Quad SPI Flash memory for configuration and operation per HPS and FPGA, and powerful switching-mode power supplies for all on-board voltages. Overview available models		13 x 16
TE0716 SoM (System on Module) based on Xilinx Zynq-7000 SoC with 1 GByte SDRAM, 32 MByte of SPI Flash memory, 10 x 12-Bit Low Power SAR ADCs, 512 Kb serial EEPROM, Gigabit Ethernet PHY transceiver, an USB PHY transceiver, a single chip USB2.0 to UART/JTAG interface (Xilinx license included), and powerful switching-mode power supplies for all on-board voltages, commercial temperature range. Overview available models		4.5 x 6.5
TE0835 The Trenz Electronic TE0835 is based on the Xilinx Zynq UltraScale+ RFSoC. The module is equipped with 4 x 1 GByte DDR4 SDRAM memory, 2 x 64 MByte SPI Flash memory, USB2.0, Ethernet transceiver and 2 x Samtec Razor Beam Board to Board (B2B) connectors. Extended temperature range. Carrier board available. Overview available models		6.5 x 9
TEF0010 FMC-Modul FMC module with Xilinx Artix-7 FPGA and 4 x 16-bit GMSL serializers. Overview available models		6.9 x 8.4
TEC810 The Trenz Electronic TEC0810 is a CompactPCI Serial Card (3U form factor) that can be used as a base for Trenz Electronic modules with a form factor of 5.2 x 7.6 cm. For configuration and service, JTAG and UART are available via USB bridge and one Gigabit Ethernet on the front panel. 48 differential signals are available on the backplane. Overview available models		-
TE0727 The ZynqBerryZero is a SoC module with integrated Xilinx Zynq-7010 FPGA and the form factor of the Raspberry Pi Zero. Furthermore, the small board is equipped with 512 MByte DDR3L SDRAM, 16 MByte Flash and various connectors, such as two microUSB connectors, a micro SD card slot, a mini HDMI and a CSI-2 connector (camera). Extended temperature range. Overview available models		3 x 6.5
TE0823 MPSoC module with a low-power Xilinx Zynq UltraScale+ ZU3, 1 GByte LPDDR4 with low power consumption, 128 MByte QSPI Boot Flash, 8 GByte e.MMC memory, Gigabit Ethernet transceiver PHY, high speed USB2-ULPI transceiver OTG, 132 x HP PL I/Os, 4 GTR (for USB3, SATA, PCIe, DP) and 14 x PS MIOs. Industrial temperature range. Carrier board available. Overview available models		4 x 5
TE0802 MPSoC Development Board with Xilinx Zynq UltraScale+ ZU2, 1 GByte LPDDR4, 32 MByte SPI Flash, USB 3.0 Host (type A connector) and DisplayPort. Other assembly options for the FPGA and the memory chips are available. Extended temperature range. Overview available models		10 x 10
TE0821 MPSoC module integrating a Xilinx Zynq UltraScale+ ZU3EG, 2 GByte DDR4 SDRAM, 128 MByte QSPI-Boot Flash, 4 high-speed interfaces for serial I/Os (HSSIO), 34 x High Performance and 96 x High Density PL I/Os, 14 x PS MIOs, 4 x serial PS GTR transceiver, Graphic Processor Unit (GPU), extended and industrial temperature range. This module is pin compatible with TE0820 MPSoC modules. Carrier board available. Overview available models		4 x 5
TEI0006 An industrial grade module based on Intel Cyclone 10 GX. Intel Cyclone 10 GX device family delivers higher core, transceiver and I/O performance than the previous generation of low cost FPGAs. Carrierboard available. Overview available models		6 x 8
TE0890 "S7 Mini" FPGA module integrating a Xilinx Spartan-7, 64 MBit HyperRAM DRAM, 64 MBit Config PROM for dual-boot and/or SW code storage and dual-pinout DIP-40 or 50mil 80 pin connectors for 32 or 64 FPGA 3.3V I/Os. The module is footprint compatible with 7S6, 7S15, 7S50 FTGB-196 devices. Overview available models		2.7 x 5.2
TEC0117 "GOWIN LittleBee" Low cost FPGA module integrating a GOWIN LittleBee 1NR9 FPGA with 8 MByte internal SDRAM and 8 MByte SPI Flash for user applications. It's compatible to the Arduino MKR standard. Overview available models		2.5 x 6.15
TEC0089 DesignWare ARC EM Software Development Plattform The DesignWare® ARC® EM Software Development Platform is a flexible platform for rapid software development on ARC EM processors and subsystems. It is intended to accelerate software development and debug of ARC EM processor-based systems for a wide range of ultra-low power embedded applications such as IoT, sensor fusion, and voice applications. It includes an FPGA-based hardware board with commonly used peripherals and interfaces for extensibility. Downloadable platform packages containing different hardware configurations enable the board to be programmed with different ARC EM processors and subsystems. Overview available models		-
TEC0850 CompactPCI Serial Card CompactPCI Serial card integrating a Xilinx Zynq UltraScale+ MPSoC, one DDR4 SDRAM SODIMM socket with 64bit wide data bus, max. dual 512 MByte Flash memory for configuration and operation, 24 Gigabit transceivers on PL side and 4 on PS side, powerful switch-mode power supplies for all onboard voltages, USB2 and USB3 FIFO bridges and a large number of configurable I/Os available on the CompactPCI Serial backplane connectors. Overview available models		10 x 16
TEF0008 FMC Card FPGA to Mezzanine Card (FMC) based on VITA 57.1 FMC HPC Standard, with four SFP+ 10 GBit ports for fiber optical SFP modules. It is inteded for use on a FMC HPC carrier and can not be used stand-alone. Overview available models		6.9 x 8.4
TE0783 A high-performance, industrial-grade SoM (System on Module) based on Xilinx Zynq-7000 SoC with 1 GByte RAM (32bit wide DDR3) connected to PS, 2 GByte RAM (64bit wide DDR3) connected to PL, 4 GByte eMMC, 16 GTX high-performance transceiver lanes, 32 MByte QSPI Flash memory for conﬁguration and operation, and powerful switch-mode power supplies for all on-board voltages. Overview available models		8.5 x 8.5
TEF0007 FMC Card DisplayPort 1.2 compatible FMC card with data rates up to 5.4 Gbps and sink and source DP connector. Overview available models		6.9 x 8.4
TEM0001 "SMF2000" FPGA modul with Microsemi SmartFusion2 and 8 MByte Flash. SmartFusion2 combines a 166 MHz Cortex-M3 MCU including 256 KByte Flash and 80 KByte SRAM, as well as 12 kLUT FPGA Core Logic. The TEM0001 is ideal for evaluation and rapid prototying. It's compatible to the Arduino MKR standard. Overview available models		2.5 x 6.15
TEI0003 "CYC1000" FPGA module with an integrated Intel Cyclone 10 LP FPGA, 8 MByte SDRAM, 2 MByte Flash and a LIS3DH 3-axis sensor. It's compatible to the Arduino MKR standard. Overview available models		2.5 x 6.15
TEL0001 "LXO2000" FPGA module integrating a Lattice XO2-4000 and on-board USB/JTAG. It's compatible to the Arduino MKR standard. Overview available models		2.5 x 6.15
TEI0001 "MAX1000" FPGA IoT Maker Board that has been designed for end-to-end application development and optimised for cost. The Arrow MAX1000 board can be installed directly into a custom application or integrated on to a completely separate board. At the heart of the maker board is a compact (11x11mm) Intel MAX10 FPGA with 8000 logic elements. This single chip includes integrated flash memory, a 1Msps 12bit ADC for analogue signals and a 3.3V power supply. Other features include embedded SRAM, DSP blocks, instant-on within milliseconds, and the ability to implement Intel’s NIOS II soft core embedded processor to perform microcontroller tasks. Overview available models		2.5 x 6.15
TE0724 SoC module with Xilinx Zynq XC7Z010 or XC7Z020, dual-core ARM Cortex-A9 MPCore, 1 GByte DDR3L SDRAM, 32 MByte QSPI Flash memory, 1 GBit Ethernet PHY, I/O PL:80/PS:20, MAC-Adress EEPROM, 128 KBit EEProm, CAN transceiver, on-board DC/DC controller, industrial temperature range, carrier board available. Overview available models		4 x 6
TE0807 UltraSOM+ MPSoC module with Xilinx Zynq UltraScale+ ZU07EV, 4 GByte DDR4 SDRAM, 128 MByte SPI Boot Flash (dual parallel), plug-on module with 4 x 160-pin connectors, serial transceivers: GTR 4 (all) + GTH 16 (all), Graphic Processing Unit (GPU) + Video codec unit (VCU), extended temperature range, carrier board and individual cooling solution available. Overview available models		5.2 x 7.6
TEF1001 PCIe FMC Carrier integrating a Xilinx Kintex-7 FPGA (K160T, K325T or K410T), 32 MByte SPI Flash, a 4 lane PCIe, a Vita 57.1 FMC HPC Slot and a DDR3 SODIMM Socket. Overview available models		-
TE0713 FPGA module with Xilinx Zynq Artix-7, USB 3.0 to FIFO bridge, 1 GByte of DDR3L SDRAM, 32 MByte Flash memory, Plug-on module with 2 x 100-pin and 1 x 60-pin high-speed hermaphroditic strips, carrier board available. Overview available models		4 x 5
TE0803 MPSoC module with Xilinx Zynq UltraScale+, 4 x 512 MByte (2 GByte) 64-Bit DDR4 SDRAM (up to 8 GByte max), 2 x 256 MBit (2 x 32 MByte) SPI Boot Flash dual parallel (up to 512 MByte max), plug-on module with 4 x 160 pin B2B connectors, carrier board, cooling solution and starter kit available. Overview available models		5.2 x 7.6
TE0820 MPSoC module with Xilinx Zynq UltraScale+, 1 GByte (2 x 512 MByte) DDR4 SDRAM with 32-Bit width, 2 x 32 MByte Flash memory, B2B connectors: 2 x 100 pin and 1 x 60 pin, carrier board available. Overview available models		4 x 5
TE0714 FPGA module with Xilinx Artix-7 35T or 50T, 16 MByte QSPI Flash, smallest module with tranceivers, industrial temperature range, carrier board available. Overview available models		4 x 3
TE0745 SoC module with Xilinx Zynq-7030 or Zynq-7045, 1 GByte DDR3 SDRAM, 32 MByte SPI Flash, 1 GBit Ethernet, 8 x GTX (7030: 4 GT), RTC, industrial temperature range, carrier board available. Overview available models		5.2 x 7.6
TE0841 FPGA module with Xilinx Kintex UltraScale KU35/KU40, 2 GByte DDR4, 64 MByte SPI Boot Flash, 3.2 mm mounting holes for skyline heat spreader, serial transceiver: GTH 8 Lanes (all), industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0808 UltraSOM+ MPSoC module with Xilinx Zynq UltraScale+, 4 x 512 MByte (2 GByte) 64-Bit DDR4 memory, 2 x 256 MBit (2 x 32 MByte) SPI Boot Flash (dual parallel), B2B connectors: 4 x 160 pin, serial transceiver: GTR 4 (all) + GTH 16 (all), industrial temperature range, carrier board and starter kit available. Overview available models		5.2 x 7.6
TE0725LP FPGA module with Xilinx Artix-7 100T, 32 MByte Flash, optional HyperRAM or HyperFlash, 2 x 50 pin with 2,54 mm pitch, VIN 3,3V or 1,8V, commercial temperature range available (industrial temperature range on request). Overview available models		7.3 x 3.5
TE0725 FPGA module with Xilinx Artix-7 15T, 35T or 100T, 32 MByte Flash, from revision 03 64 MBit HyperRAM, 2 x 50 Pin with 2.54 mm pitch, optional Fiber Optic Module (125/250 or 1000 MBit/s), commercial temperature range available (industrial temperature range on request). Overview available models		7.3 x 3.5
TE0726 "ZynqBerry" SoC module with Xilinx Zynq-7010 with Raspberry Pi form factor, 512 MByte (128 MByte) DDR3L, 16 MByte SPI Flash, Micro SD socket, 4 USB with power switches, 100 MBit Ethernet, DSI and CSI-2 Connector (display and camera), HAT header with 26 I/O's, commercial temperature range. Overview available models		like Raspberry Pi Model 2
TE0729 SoC module with Xilinx Zynq-7020, 512 MByte DDR3, 32 MByte QSPI-Flash, 1 x 10/100/1000 Mbps Ethernet transceiver PHY, 2 x 10/100 Mbps Ethernet transceiver PHYs, RTC, equipped with sulfur resistant resistors, industrial temperature range, carrier board and starter kit available. Overview available models		5.2 x 7.6
TE0723 "ArduZynq" SoC module with Xilinx Zynq-7010 with Arduino Shield form factor, 128 MByte DDR3L; version M: 512 MByte DDR3L, 16 MByte SPI Flash, Hi-Speed USB2.0 ULPI Transceiver, 23 FPGA I/O's on B2B connectors available, commercial temperature range. Overview available models		Arduino shield
TE0782 SoC module with Xilinx Zynq-7035, Zynq-7045 or Zynq-7100, 1 GByte DDR3, 32 MByte QSPI Flash, 4 GByte eMMC (optional up to 64 GByte), 2 x Gigabit Ethernet Tranceiver, RTC, optional 2 x 8 MByte HyperRAM (max. 2 x 32 MByte), 16 GTX high-performance Tranceiver Lanes, industrial temperature range, test fixture available. Overview available models		8.5 x 8.5
TE0722 "DIPFORTy1 Soft Propeller" Propeller compatible DIP40 pinout module with Xilinx Zynq-7010, 16 MByte SPI Flash (primary boot), 33.333 MHz Clock (MEMS Oscillator), Total user accessible PL I/O: 46 (+3 Input only), MicroSD Card socket, commercial temperature range. Overview available models		1.8 x 5.1
TE0728 SoC module with Xilinx automotive Zynq-7020, 512 MByte DDR3, 16 MByte QSPI Flash, 2 x 100 MBit Ethernet Transceiver (PHY), 76 single ended I/O, 24 LVDS pairs (48 I/O) and 42 MIO available on B2B connectors, CAN Transceiver (PHY), automotive temperature range, carrier board available. Overview available models		6 x 6
TE0715 SoC module with Xilinx Zynq-7015 or Zynq-7030, 1 GByte DDR3, 32 MByte QSPI Flash, 1 GBit Ethernet, 4 GTP/GTX Tranceivers, Programmable Clock Generator: Transceiver Clock (default 125 MHz), industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0712 FPGA module with Xilinx Artix-7 100T or 200T, 1 GByte DDDR3, 32 MByte Quad-SPI Flash, 100 MBit Ethernet, 4 Multi Gigabit transceivers, industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0711 FPGA module with Xilinx Artix-7 35T or 100T, 32 MByte QSPI Flash, 100 MHz MEMS oscillator, 178 FPGA I/O's (84 differential pairs), 3 User LED's, industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0710 FPGA module with Xilinx Artix-7 35T or 100T, 512 MByte DDR3, 32 MByte QSPI Flash, 2 x 100 MBit Ethernet, industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0720 SoC module with Xilinx Zynq-7020, 256 MByte/512 MByte DDR3L/1 GByte DDR3 (depending on version), 32 MByte SPI Flash, 4 GByte e-NAND (up to 32 GByte), 152 FPGA I/O's available on B2B connectors, RTC, 3 User LED's, automotive, industrial and commercial temperature range, carrier board and starter kit available. Overview available models		4 x 5
TE0741 FPGA module with Xilinx Kintex-7 70T, 160T, 325T or 410T, 32 MByte Quad-SPI Flash, max. GTX transceiver data rate 10,3125 Gb/s (default 6,6 Gb/s), 8 Multi Gigabit Transceivers, 2 User LED, 1 DONE PFGA pin LED, industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0630 FPGA module with Xilinx Spartan-6 LX45, LX75 oder LX150, 128 MByte DDR3, 8 MByte SPI Flash, up to 40 different and up to 109 single end FPGA I/O pins available on B2B connectors, 1.2 V, 1.5 V, 2.5 V = VCCAUX and 3.3 V power rails, 4 User LED, 1 User Push-Button, 2 User DIP Switches, industrial temperature range, carrier board available. Overview available models		4 x 5
TE0600 GigaBee module with Xilinx Spartan-6 LX45, LX100 or LX150, two independent 128 MByte DDR SDRAM banks (optional 2 x 512 MByte DDR SDRAM), 16 MByte SPI Flash, 10/100/1000 tri-speed GBit Ethernet transceiver (PHY), JTAG Port, industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0320 Module with Xilinx Spartan-3A, 1 GBit DDR RAM up to 1333 MByte/s bandwidth, 32 MBit SPI Flash, 109 I/Os (+ 10 dual-purpose pins) available on B2B connectors, 4 LED, 2 Push Buttons, 8 DIP Switches, industrial and commercial temperature range, carrier board available. Overview available models		6.8 x 4.8
TE0300 FPGA module with Xilinx Spartan-3E, 32 MBit SPI Flash, 512 MBit DDR RAM up to 666 MByte/s bandwidth, 3 on-board DC-DC converters for high efficieny, 104 I/Os + 6 Inputs available on B2B connectors, industrial and commercial temperature range, carrier board available. Overview available models		4.05 x 4.75
TE0140 Module with Xilinx Spartan-3, USB 2.0 transceiver, 16 KBit EEPROM, 120 available I/O's on B2B connectors, one LED, 1 push button, commercial temperature range, carrier board available. Overview available models		5.07 x 4.36

The micromodules designed by Trenz Electronic feature modern FPGA's. With small size and high-density connectors, they can be used nearly everywhere. Gigabit Ethernet and integrated USB... read more »

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Trenz Electronic FPGA and SoC Modules

The micromodules designed by Trenz Electronic feature modern FPGA's. With small size and high-density connectors, they can be used nearly everywhere.

Gigabit Ethernet and integrated USB guarantees high data transfer rates to a host PC.

Other assembly options for cost or performance optimization plus high volume prices available on request.

The following tables are for guidance only. Trenz Electronic generally manufactures its own modules as long as chip manufacturers supply the respective chips.

Trenz Electronic Module and Carrier Board Life Cycles
Carrier boards are no longer produced if all suitable modules go EOL.

Estimated EOL dates are indicative only and may be delayed.

Products with integrated Xilinx FPGA

Series	Device Familiy	Carrier Board	Launch Year	Expected EOL	Expected Life Cycle
TE0140	Spartan-3	TE0143	2004	2021 (EOL confirmed)	17
TE0300	Spartan-3E		2005	2022	17
TE0320	Spartan-3A	TE0323	2005	2022	17
TE0600	Spartan-6 Ethernet	TE0603	2010	2027	17
TE0630	Spartan-6 USB	TE0303	2011	2027	16
TE07xx	Zynq-7000 Artix-7 Kintex-7	TEBA07xx, TEBB07xx, TEB07xx, TEBT07xx, TE070x	2013	2028	15
TE08xx	Zynq UltraScale+ Kintex UltraScale	TEBA08xx, TEBF08xx, TEBT08xx	2016	2031	15

Products with integrated Intel FPGA

Series	Device Family	Carrier Board	Launch Year	Expected EOL	Expected Life Cycle
TEI0001	MAX 10 FPGA	-	2014	2029	15
TEI0003	Cyclone 10	-	2017	2032	15
TEI0006	Cyclone 10	TEIB0006	2017	2032	15
TEI0009	Cyclone 10	-	2017	2032	15
TEI0010	MAX 10 FPGA	-	2014	2029	15
TEI0180	AGILEX	-	2019	2034	15

Modules (sorted by publication date)	Photo	Form factor (cm)
CR00040 Arrow Electronics and Trenz Electronic developed a very small and comprehensive module for qualified CO₂ measurements to support customers in their development and end products. The small CRUVI module includes Sensirion's new miniature CO₂ sensor. The SCD4x family has also an integrated humidity sensor and temperature sensor. SMD compatibility and extremely compact dimensions enable cost-efficient and space-saving integration of customer designs. The CRUVI module is available with and without CO₂ sensor. Overview available models		3.2 x 1.8
TEI0022 SoC board based on Intel Cyclone V FPGA, an Ethernet PHY, one GByte DDR3 SDRAM per HPS and FPGA and one 32 MByte Quad SPI Flash memory for configuration and operation per HPS and FPGA, and powerful switching-mode power supplies for all on-board voltages. Overview available models		13 x 16
TE0716 SoM (System on Module) based on Xilinx Zynq-7000 SoC with 1 GByte SDRAM, 32 MByte of SPI Flash memory, 10 x 12-Bit Low Power SAR ADCs, 512 Kb serial EEPROM, Gigabit Ethernet PHY transceiver, an USB PHY transceiver, a single chip USB2.0 to UART/JTAG interface (Xilinx license included), and powerful switching-mode power supplies for all on-board voltages, commercial temperature range. Overview available models		4.5 x 6.5
TE0835 The Trenz Electronic TE0835 is based on the Xilinx Zynq UltraScale+ RFSoC. The module is equipped with 4 x 1 GByte DDR4 SDRAM memory, 2 x 64 MByte SPI Flash memory, USB2.0, Ethernet transceiver and 2 x Samtec Razor Beam Board to Board (B2B) connectors. Extended temperature range. Carrier board available. Overview available models		6.5 x 9
TEF0010 FMC-Modul FMC module with Xilinx Artix-7 FPGA and 4 x 16-bit GMSL serializers. Overview available models		6.9 x 8.4
TEC810 The Trenz Electronic TEC0810 is a CompactPCI Serial Card (3U form factor) that can be used as a base for Trenz Electronic modules with a form factor of 5.2 x 7.6 cm. For configuration and service, JTAG and UART are available via USB bridge and one Gigabit Ethernet on the front panel. 48 differential signals are available on the backplane. Overview available models		-
TE0727 The ZynqBerryZero is a SoC module with integrated Xilinx Zynq-7010 FPGA and the form factor of the Raspberry Pi Zero. Furthermore, the small board is equipped with 512 MByte DDR3L SDRAM, 16 MByte Flash and various connectors, such as two microUSB connectors, a micro SD card slot, a mini HDMI and a CSI-2 connector (camera). Extended temperature range. Overview available models		3 x 6.5
TE0823 MPSoC module with a low-power Xilinx Zynq UltraScale+ ZU3, 1 GByte LPDDR4 with low power consumption, 128 MByte QSPI Boot Flash, 8 GByte e.MMC memory, Gigabit Ethernet transceiver PHY, high speed USB2-ULPI transceiver OTG, 132 x HP PL I/Os, 4 GTR (for USB3, SATA, PCIe, DP) and 14 x PS MIOs. Industrial temperature range. Carrier board available. Overview available models		4 x 5
TE0802 MPSoC Development Board with Xilinx Zynq UltraScale+ ZU2, 1 GByte LPDDR4, 32 MByte SPI Flash, USB 3.0 Host (type A connector) and DisplayPort. Other assembly options for the FPGA and the memory chips are available. Extended temperature range. Overview available models		10 x 10
TE0821 MPSoC module integrating a Xilinx Zynq UltraScale+ ZU3EG, 2 GByte DDR4 SDRAM, 128 MByte QSPI-Boot Flash, 4 high-speed interfaces for serial I/Os (HSSIO), 34 x High Performance and 96 x High Density PL I/Os, 14 x PS MIOs, 4 x serial PS GTR transceiver, Graphic Processor Unit (GPU), extended and industrial temperature range. This module is pin compatible with TE0820 MPSoC modules. Carrier board available. Overview available models		4 x 5
TEI0006 An industrial grade module based on Intel Cyclone 10 GX. Intel Cyclone 10 GX device family delivers higher core, transceiver and I/O performance than the previous generation of low cost FPGAs. Carrierboard available. Overview available models		6 x 8
TE0890 "S7 Mini" FPGA module integrating a Xilinx Spartan-7, 64 MBit HyperRAM DRAM, 64 MBit Config PROM for dual-boot and/or SW code storage and dual-pinout DIP-40 or 50mil 80 pin connectors for 32 or 64 FPGA 3.3V I/Os. The module is footprint compatible with 7S6, 7S15, 7S50 FTGB-196 devices. Overview available models		2.7 x 5.2
TEC0117 "GOWIN LittleBee" Low cost FPGA module integrating a GOWIN LittleBee 1NR9 FPGA with 8 MByte internal SDRAM and 8 MByte SPI Flash for user applications. It's compatible to the Arduino MKR standard. Overview available models		2.5 x 6.15
TEC0089 DesignWare ARC EM Software Development Plattform The DesignWare® ARC® EM Software Development Platform is a flexible platform for rapid software development on ARC EM processors and subsystems. It is intended to accelerate software development and debug of ARC EM processor-based systems for a wide range of ultra-low power embedded applications such as IoT, sensor fusion, and voice applications. It includes an FPGA-based hardware board with commonly used peripherals and interfaces for extensibility. Downloadable platform packages containing different hardware configurations enable the board to be programmed with different ARC EM processors and subsystems. Overview available models		-
TEC0850 CompactPCI Serial Card CompactPCI Serial card integrating a Xilinx Zynq UltraScale+ MPSoC, one DDR4 SDRAM SODIMM socket with 64bit wide data bus, max. dual 512 MByte Flash memory for configuration and operation, 24 Gigabit transceivers on PL side and 4 on PS side, powerful switch-mode power supplies for all onboard voltages, USB2 and USB3 FIFO bridges and a large number of configurable I/Os available on the CompactPCI Serial backplane connectors. Overview available models		10 x 16
TEF0008 FMC Card FPGA to Mezzanine Card (FMC) based on VITA 57.1 FMC HPC Standard, with four SFP+ 10 GBit ports for fiber optical SFP modules. It is inteded for use on a FMC HPC carrier and can not be used stand-alone. Overview available models		6.9 x 8.4
TE0783 A high-performance, industrial-grade SoM (System on Module) based on Xilinx Zynq-7000 SoC with 1 GByte RAM (32bit wide DDR3) connected to PS, 2 GByte RAM (64bit wide DDR3) connected to PL, 4 GByte eMMC, 16 GTX high-performance transceiver lanes, 32 MByte QSPI Flash memory for conﬁguration and operation, and powerful switch-mode power supplies for all on-board voltages. Overview available models		8.5 x 8.5
TEF0007 FMC Card DisplayPort 1.2 compatible FMC card with data rates up to 5.4 Gbps and sink and source DP connector. Overview available models		6.9 x 8.4
TEM0001 "SMF2000" FPGA modul with Microsemi SmartFusion2 and 8 MByte Flash. SmartFusion2 combines a 166 MHz Cortex-M3 MCU including 256 KByte Flash and 80 KByte SRAM, as well as 12 kLUT FPGA Core Logic. The TEM0001 is ideal for evaluation and rapid prototying. It's compatible to the Arduino MKR standard. Overview available models		2.5 x 6.15
TEI0003 "CYC1000" FPGA module with an integrated Intel Cyclone 10 LP FPGA, 8 MByte SDRAM, 2 MByte Flash and a LIS3DH 3-axis sensor. It's compatible to the Arduino MKR standard. Overview available models		2.5 x 6.15
TEL0001 "LXO2000" FPGA module integrating a Lattice XO2-4000 and on-board USB/JTAG. It's compatible to the Arduino MKR standard. Overview available models		2.5 x 6.15
TEI0001 "MAX1000" FPGA IoT Maker Board that has been designed for end-to-end application development and optimised for cost. The Arrow MAX1000 board can be installed directly into a custom application or integrated on to a completely separate board. At the heart of the maker board is a compact (11x11mm) Intel MAX10 FPGA with 8000 logic elements. This single chip includes integrated flash memory, a 1Msps 12bit ADC for analogue signals and a 3.3V power supply. Other features include embedded SRAM, DSP blocks, instant-on within milliseconds, and the ability to implement Intel’s NIOS II soft core embedded processor to perform microcontroller tasks. Overview available models		2.5 x 6.15
TE0724 SoC module with Xilinx Zynq XC7Z010 or XC7Z020, dual-core ARM Cortex-A9 MPCore, 1 GByte DDR3L SDRAM, 32 MByte QSPI Flash memory, 1 GBit Ethernet PHY, I/O PL:80/PS:20, MAC-Adress EEPROM, 128 KBit EEProm, CAN transceiver, on-board DC/DC controller, industrial temperature range, carrier board available. Overview available models		4 x 6
TE0807 UltraSOM+ MPSoC module with Xilinx Zynq UltraScale+ ZU07EV, 4 GByte DDR4 SDRAM, 128 MByte SPI Boot Flash (dual parallel), plug-on module with 4 x 160-pin connectors, serial transceivers: GTR 4 (all) + GTH 16 (all), Graphic Processing Unit (GPU) + Video codec unit (VCU), extended temperature range, carrier board and individual cooling solution available. Overview available models		5.2 x 7.6
TEF1001 PCIe FMC Carrier integrating a Xilinx Kintex-7 FPGA (K160T, K325T or K410T), 32 MByte SPI Flash, a 4 lane PCIe, a Vita 57.1 FMC HPC Slot and a DDR3 SODIMM Socket. Overview available models		-
TE0713 FPGA module with Xilinx Zynq Artix-7, USB 3.0 to FIFO bridge, 1 GByte of DDR3L SDRAM, 32 MByte Flash memory, Plug-on module with 2 x 100-pin and 1 x 60-pin high-speed hermaphroditic strips, carrier board available. Overview available models		4 x 5
TE0803 MPSoC module with Xilinx Zynq UltraScale+, 4 x 512 MByte (2 GByte) 64-Bit DDR4 SDRAM (up to 8 GByte max), 2 x 256 MBit (2 x 32 MByte) SPI Boot Flash dual parallel (up to 512 MByte max), plug-on module with 4 x 160 pin B2B connectors, carrier board, cooling solution and starter kit available. Overview available models		5.2 x 7.6
TE0820 MPSoC module with Xilinx Zynq UltraScale+, 1 GByte (2 x 512 MByte) DDR4 SDRAM with 32-Bit width, 2 x 32 MByte Flash memory, B2B connectors: 2 x 100 pin and 1 x 60 pin, carrier board available. Overview available models		4 x 5
TE0714 FPGA module with Xilinx Artix-7 35T or 50T, 16 MByte QSPI Flash, smallest module with tranceivers, industrial temperature range, carrier board available. Overview available models		4 x 3
TE0745 SoC module with Xilinx Zynq-7030 or Zynq-7045, 1 GByte DDR3 SDRAM, 32 MByte SPI Flash, 1 GBit Ethernet, 8 x GTX (7030: 4 GT), RTC, industrial temperature range, carrier board available. Overview available models		5.2 x 7.6
TE0841 FPGA module with Xilinx Kintex UltraScale KU35/KU40, 2 GByte DDR4, 64 MByte SPI Boot Flash, 3.2 mm mounting holes for skyline heat spreader, serial transceiver: GTH 8 Lanes (all), industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0808 UltraSOM+ MPSoC module with Xilinx Zynq UltraScale+, 4 x 512 MByte (2 GByte) 64-Bit DDR4 memory, 2 x 256 MBit (2 x 32 MByte) SPI Boot Flash (dual parallel), B2B connectors: 4 x 160 pin, serial transceiver: GTR 4 (all) + GTH 16 (all), industrial temperature range, carrier board and starter kit available. Overview available models		5.2 x 7.6
TE0725LP FPGA module with Xilinx Artix-7 100T, 32 MByte Flash, optional HyperRAM or HyperFlash, 2 x 50 pin with 2,54 mm pitch, VIN 3,3V or 1,8V, commercial temperature range available (industrial temperature range on request). Overview available models		7.3 x 3.5
TE0725 FPGA module with Xilinx Artix-7 15T, 35T or 100T, 32 MByte Flash, from revision 03 64 MBit HyperRAM, 2 x 50 Pin with 2.54 mm pitch, optional Fiber Optic Module (125/250 or 1000 MBit/s), commercial temperature range available (industrial temperature range on request). Overview available models		7.3 x 3.5
TE0726 "ZynqBerry" SoC module with Xilinx Zynq-7010 with Raspberry Pi form factor, 512 MByte (128 MByte) DDR3L, 16 MByte SPI Flash, Micro SD socket, 4 USB with power switches, 100 MBit Ethernet, DSI and CSI-2 Connector (display and camera), HAT header with 26 I/O's, commercial temperature range. Overview available models		like Raspberry Pi Model 2
TE0729 SoC module with Xilinx Zynq-7020, 512 MByte DDR3, 32 MByte QSPI-Flash, 1 x 10/100/1000 Mbps Ethernet transceiver PHY, 2 x 10/100 Mbps Ethernet transceiver PHYs, RTC, equipped with sulfur resistant resistors, industrial temperature range, carrier board and starter kit available. Overview available models		5.2 x 7.6
TE0723 "ArduZynq" SoC module with Xilinx Zynq-7010 with Arduino Shield form factor, 128 MByte DDR3L; version M: 512 MByte DDR3L, 16 MByte SPI Flash, Hi-Speed USB2.0 ULPI Transceiver, 23 FPGA I/O's on B2B connectors available, commercial temperature range. Overview available models		Arduino shield
TE0782 SoC module with Xilinx Zynq-7035, Zynq-7045 or Zynq-7100, 1 GByte DDR3, 32 MByte QSPI Flash, 4 GByte eMMC (optional up to 64 GByte), 2 x Gigabit Ethernet Tranceiver, RTC, optional 2 x 8 MByte HyperRAM (max. 2 x 32 MByte), 16 GTX high-performance Tranceiver Lanes, industrial temperature range, test fixture available. Overview available models		8.5 x 8.5
TE0722 "DIPFORTy1 Soft Propeller" Propeller compatible DIP40 pinout module with Xilinx Zynq-7010, 16 MByte SPI Flash (primary boot), 33.333 MHz Clock (MEMS Oscillator), Total user accessible PL I/O: 46 (+3 Input only), MicroSD Card socket, commercial temperature range. Overview available models		1.8 x 5.1
TE0728 SoC module with Xilinx automotive Zynq-7020, 512 MByte DDR3, 16 MByte QSPI Flash, 2 x 100 MBit Ethernet Transceiver (PHY), 76 single ended I/O, 24 LVDS pairs (48 I/O) and 42 MIO available on B2B connectors, CAN Transceiver (PHY), automotive temperature range, carrier board available. Overview available models		6 x 6
TE0715 SoC module with Xilinx Zynq-7015 or Zynq-7030, 1 GByte DDR3, 32 MByte QSPI Flash, 1 GBit Ethernet, 4 GTP/GTX Tranceivers, Programmable Clock Generator: Transceiver Clock (default 125 MHz), industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0712 FPGA module with Xilinx Artix-7 100T or 200T, 1 GByte DDDR3, 32 MByte Quad-SPI Flash, 100 MBit Ethernet, 4 Multi Gigabit transceivers, industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0711 FPGA module with Xilinx Artix-7 35T or 100T, 32 MByte QSPI Flash, 100 MHz MEMS oscillator, 178 FPGA I/O's (84 differential pairs), 3 User LED's, industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0710 FPGA module with Xilinx Artix-7 35T or 100T, 512 MByte DDR3, 32 MByte QSPI Flash, 2 x 100 MBit Ethernet, industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0720 SoC module with Xilinx Zynq-7020, 256 MByte/512 MByte DDR3L/1 GByte DDR3 (depending on version), 32 MByte SPI Flash, 4 GByte e-NAND (up to 32 GByte), 152 FPGA I/O's available on B2B connectors, RTC, 3 User LED's, automotive, industrial and commercial temperature range, carrier board and starter kit available. Overview available models		4 x 5
TE0741 FPGA module with Xilinx Kintex-7 70T, 160T, 325T or 410T, 32 MByte Quad-SPI Flash, max. GTX transceiver data rate 10,3125 Gb/s (default 6,6 Gb/s), 8 Multi Gigabit Transceivers, 2 User LED, 1 DONE PFGA pin LED, industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0630 FPGA module with Xilinx Spartan-6 LX45, LX75 oder LX150, 128 MByte DDR3, 8 MByte SPI Flash, up to 40 different and up to 109 single end FPGA I/O pins available on B2B connectors, 1.2 V, 1.5 V, 2.5 V = VCCAUX and 3.3 V power rails, 4 User LED, 1 User Push-Button, 2 User DIP Switches, industrial temperature range, carrier board available. Overview available models		4 x 5
TE0600 GigaBee module with Xilinx Spartan-6 LX45, LX100 or LX150, two independent 128 MByte DDR SDRAM banks (optional 2 x 512 MByte DDR SDRAM), 16 MByte SPI Flash, 10/100/1000 tri-speed GBit Ethernet transceiver (PHY), JTAG Port, industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0320 Module with Xilinx Spartan-3A, 1 GBit DDR RAM up to 1333 MByte/s bandwidth, 32 MBit SPI Flash, 109 I/Os (+ 10 dual-purpose pins) available on B2B connectors, 4 LED, 2 Push Buttons, 8 DIP Switches, industrial and commercial temperature range, carrier board available. Overview available models		6.8 x 4.8
TE0300 FPGA module with Xilinx Spartan-3E, 32 MBit SPI Flash, 512 MBit DDR RAM up to 666 MByte/s bandwidth, 3 on-board DC-DC converters for high efficieny, 104 I/Os + 6 Inputs available on B2B connectors, industrial and commercial temperature range, carrier board available. Overview available models		4.05 x 4.75
TE0140 Module with Xilinx Spartan-3, USB 2.0 transceiver, 16 KBit EEPROM, 120 available I/O's on B2B connectors, one LED, 1 push button, commercial temperature range, carrier board available. Overview available models		5.07 x 4.36

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TEB0911 UltraRack+ MPSoC Board with Xilinx Zynq UltraScale+ ZU9,6 FMC Connectors

MPSoC Board with Xilinx Zynq UltraScale+ XCZU9EG-1FFVB1156E, 8 GByte 64-Bit DDR4 SO-DIMM (PS connected), M2 PCIe SSD (1-Lane), eMMC (bootable), Dual QSPI Flash (bootable)

1,961.40 € (2,334.07 € gross)

TEB0911-04-9BEX1MA

In Stock: 0

Testboard for the Trenz Electronic MPSoC module TE0865

Testboard for the Trenz Electronic MPSoC module TE0865, equipped with a USB A, Ethernet RJ45, Firefly, SD Card holder, Samtec AcceleRate HD B2B. size: 14.5 x 18 cm

403.20 € (479.81 € gross)

TEBT0865-01

In Stock: 1

Evaluationboard with Xilinx Zynq UltraScale+ ZU6EG-1I, 4 GB DDR4 ECC, 9 x 9 cm

Xilinx Zynq UltraScale+ XCZU6EG-1FFVC900I, 4 GByte DDR4 ECC, 2 x 32 Gbyte e.MMC, 2 x 64 MByte Flash, 2 x 4 Mbit MRAM, Vorago VA41630, 2 x B2B Connector APM6, Debug Connector LSHM, size: 9 x 9 cm

8,423.28 € (10,023.70 € gross)

TE0812-02-EM2

In Stock: 0

Space-grade MPSoC Module with Xilinx Zynq UltraScale+ ZU6EG-1I, 4 GByte DDR4 ECC

Space-grade MPSoC Module with integrated Xilinx Zynq UltraScale+ XCZU6EG-1FFVC900I, 4 GByte DDR4 SDRAM ECC, 2 x 32 Gbyte eMMC, 2 x 128 MByte Flash, 2 x 4 Mbit MRAM, Vorago VA41630, 2 x B2B Connector APM6, Debug Connector LSHM, size: 9 x...

21,527.28 € (25,617.46 € gross)

TE0812-02-EIVEFM2

In Stock: 0

RFSoC Module with Xilinx Zynq UltraScale+ RFSoC ZU47DR-2E, 4 GB DDR4, 6.5 x 9 cm

Xilinx Zynq UltraScale+ RFSoC XCZU47DR-1FFVE1156E Gen3, 4 GByte DDR4, 128 MByte SPI Boot Flash, 8 RFADCs with 5 GSPS, 8 RFDACs with 9.85 GSPS

Price on Application

TE0835-02-TXE21-A

In Stock: 0

RFSoC Module with Xilinx Zynq UltraScale+ RFSoC ZU25DR-1, 4 GB DDR4, 6.5 x 9 cm

Xilinx Zynq UltraScale+ RFSoC XCZU25DR-1FFVE1156E Gen2, 4 GByte DDR4, 128 MByte SPI Boot Flash, 8 RFADCs with 4.096 GSPS, 8 RFDACs with 6.554 GSPS

Price on Application

TE0835-02-MXE21-A

In Stock: 0

SoC Module with Xilinx Zynq 7020-2I, 3xEthernet, incl. mounted Heat Spreader

Including pre-assembled heat spreader KK0729-02TE, Xilinx Zynq XC7Z020-2CLG484I, 1 x Gbit ETH, 2 x 100 Mbit Ethernet, 512 MByte DDR3L SDRAM, 32 MByte QSPI Flash, 8 GByte e.MMC, size: 5.2 x 7.6 cm

164.40 € (195.64 € gross)

TE0729-02-62I63MAK

In Stock: 0

SoC Module with Xilinx Zynq-7020, 512 MByte DDR3L SDRAM, 3 x Ethernet

Xilinx Zynq XC7Z020-2CLG484I, 1 x Gb ETH, 2 x 100 Mbit Ethernet, 512 MByte DDR3L SDRAM, 32 MByte QSPI Flash, 8 GByte e.MMC, USB 2.0, size: 5.2 x 7.6 cm

143.40 € (170.65 € gross)

TE0729-02-62I63MA

In Stock: 0

TE0729-02-62I63FAS Starter Kit

TE0729 SoC module with mounted heat spreader on a TEB0729 carrier board, two connectors, USB cable, 16 GByte SD card and power supply with US and UK adapters.

260.63 € (310.15 € gross)

TE0729-02-62I63MAS

In Stock: 0

FPGA Module with Intel Cyclone 10 GX 10CX105, 128 MByte DDR3L, 8 x 6 cm

Intel Cyclone 10 GX 10CX105YF780E5G, 128 MByte DDR3L SDRAM, 256 MByte QSPI Boot Flash, 226 I/O's, Gigabit Ethernet, EEPROM, size: 6 x 8 cm

200.33 € (238.39 € gross)

TEI0006-03-ALC13A

In Stock: 0

MPSoC Module with Zynq UltraScale+ ZU19EG-1E, 4 GB DDR4 (PS), 4 GB DDR4 (PL)

Xilinx Zynq UltraScale+ XCZU19EG-1FFVC1760E, 4 GByte DDR4 SDRAM+ECC (PS), 4 GByte DDR4 SDRAM (PL), 256 MByte QSPI Boot Flash, 8 GByte e.MMC, 48 x serielle high-speed transeiver, size: 7,5 x 10 cm

2,746.08 € (3,267.84 € gross)

TE0865-02-FBE23MA

In Stock: 0

MPSoC Module with Zynq UltraScale+ ZU17EG-2E, 4 GB DDR4 (PS), 4 GB DDR4 (PL)

Xilinx Zynq UltraScale+ XCZU17EG-2FFVC1760E, 4 GByte DDR4 SDRAM+ECC (PS), 4 GByte DDR4 SDRAM (PL), 256 MByte QSPI Boot Flash, 8 GByte e.MMC, 48 x serielle high-speed transeiver, size: 7,5 x 10 cm

2,774.88 € (3,302.11 € gross)

TE0865-02-DGE23MA

In Stock: 0

MPSoC Module with Zynq UltraScale+ ZU11EG-1I, 4 GB DDR4 (PS), 4 GB DDR4 (PL)

Xilinx Zynq UltraScale+ XCZU11EG-1FFVC1760I, 4 GByte DDR4 SDRAM+ECC (PS), 4 GByte DDR4 SDRAM (PL), 256 MByte QSPI Boot Flash, 8 GByte e.MMC, 48 x serielle high-speed transeiver, size: 7.5 x 10 cm

2,699.28 € (3,212.14 € gross)

TE0865-02-ABI21MA

In Stock: 0

High-Performance Xilinx Zynq Z-7035 Module, 1 GByte DDR3, 8.5 x 8.5 cm

Xilinx Zynq-7035 SoC XC7Z035-2FFG900I, 1 GByte DDR3, 32 MByte QSPI Flash, 2 x Gigabit Ethernet transceiver PHY, 8 GByte e.MMC, 16 GTX lanes, size: 8.5 x 8.5 cm

987.58 € (1,175.22 € gross)

TE0782-02-82I33MA

In Stock: 0

High-Performance Xilinx Zynq Z-7045-Modul, 1 GByte DDR3, 8.5 x 8.5 cm

Xilinx Zynq-7045 SoC XC7Z045-2FFG900I, 1 GByte DDR3, 32 MByte QSPI Flash, 2 x Gb Ethernet transceiver PHY, 8 GByte e.MMC, 16 GTX lanes, size: 8.5 x 8.5 cm

1,134.98 € (1,350.63 € gross)

TE0782-02-92I33MA

In Stock: 0

High-Performance Xilinx Zynq Z-7100 Module, 1 GByte DDR3, 8.5 x 8.5 cm

Xilinx Zynq-7100 SoC XC7Z100-2FFG900I, 1 GByte DDR3, 32 MByte QSPI Flash, 2 x Gigabit Ethernet transceiver PHY, 8 GByte e.MMC, 16 GTX lanes, size: 8.5 x 8.5 cm

1,332.63 € (1,585.83 € gross)

TE0782-02-A2I33MA

In Stock: 0

High-Performance SoM with Xilinx Zynq Z-7045, Memory on both PS+PL, 8.5 x 8.5

Xilinx Zynq SoC XC7Z045-2FFG900I, 1 GByte DDR3 to PS, 2 GByte DDR3 to PL, 32 MByte Flash, Gigabit Ethernet Transceiver PHY, size: 8.5 x 8.5 cm

1,168.48 € (1,390.49 € gross)

TE0783-02-92I33MA

In Stock: 0

SoC Module with Xilinx Zynq 7030-1I, 1 GByte DDR3L, 4 x 5 cm, low profile

Low Profile connectors (2.5 mm), Xilinx Zynq 7030 SoC XC7Z030-1SBG485I, 1 GByte DDR3L SDRAM, 10/100/1000 tri-speed gigabit Ethernet transceiver (PHY), USB 2.0 transceiver, 32 MByte SPI Flash memory, size: 4 x 5 cm

224.40 € (267.04 € gross)

TE0715-04-71I33-L

In Stock: 0

SoC Module with Xilinx Zynq 7030-3E, 1 GByte DDR3L, 4 x 5 cm

Xilinx Zynq SoC XC7Z030-3SBG485E, 1 GByte DDR3L, 32 MByte SPI Flash, 10/100/1000 tri-speed Gigabit Ethernet Transceiver (PHY), USB 2.0 Transceiver, size: 4 x 5 cm

353.40 € (420.55 € gross)

TE0715-04-73E33-A

In Stock: 0

MPSoC Module with Xilinx Zynq UltraScale+ ZU4EV-1E, 4 GByte DDR4, low profile

Low Profile connectors (2.5 mm), Xilinx Zynq UltraScale+ XCZU4EV-1SFVC784E, 4 GByte DDR4, 128 MByte SPI Boot Flash, 8 GByte e.MMC, size: 4 x 5 cm, pin compatible with TE0820

361.13 € (429.74 € gross)

TE0821-01-4DE31ML

In Stock: 0

MPSoC Module with Xilinx Zynq UltraScale+ ZU2CG-1E, 4 GByte DDR4, 4 x 5 cm

Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E, 4 GByte DDR4, 128 MByte SPI Boot Flash, 64 GByte e.MMC, size: 4 x 5 cm, pin compatible with TE0820

240.53 € (286.23 € gross)

TE0821-01-2AE31PA

In Stock: 0

MPSoC Module with Xilinx Zynq UltraScale+ ZU3CG-1E, 4 GByte DDR4, 4 x 5 cm

Xilinx Zynq UltraScale+ XCZU3CG-1SFVC784E, 4 GByte DDR4, 128 MByte SPI Boot Flash, 64 GByte e.MMC, size: 4 x 5 cm, pin compatible with TE0820

280.73 € (334.07 € gross)

TE0821-01-3AE31PA

In Stock: 0

MPSoC Module with Xilinx Zynq UltraScale+ ZU3EG-1E, 2 GByte DDR4, 4 x 5 cm

Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 8 GByte e.MMC, size: 4 x 5 cm, pin compatible with TE0820

274.03 € (326.10 € gross)

TE0821-01-3BE21MA

In Stock: 0

MPSoC Module with Xilinx Zynq UltraScale+ ZU3EG-1E, 2 GByte DDR4, low profile

Low Profile connectors (2.5 mm), Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 8 GByte e.MMC, size: 4 x 5 cm, pin compatible with TE0820

267.33 € (318.12 € gross)

TE0821-01-3BE21ML

In Stock: 0

MPSoC Module with Xilinx Zynq UltraScale+ 3CG-L1I, 1 GByte LPDDR4, 4 x 5 cm, LP

Low Profile connectors (2.5 mm), Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I, 1 GByte LPDDR4, 128 MByte Flash, 8 GByte e.MMC, size: 4 x 5 cm

377.88 € (449.68 € gross)

TE0823-01-3PIU1ML

In Stock: 0

MPSoC Module with Xilinx Zynq UltraScale+ 3CG-L1I, 1 GByte LPDDR4, 4 x 5 cm

With low power FPGA Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I, 1 GByte LPDDR4 SDRAM, 128 MByte QSPI Boot Flash, 8 GByte e.MMC, size: 4 x 5 cm

377.88 € (449.68 € gross)

TE0823-01-3PIU1MA

In Stock: 0

Motor Control Development Kit with Xilinx Zynq 7020-1C SoC Module

Motor Control Development Kit with Xilinx Zynq XC7Z020-1CLG484C, additional connectivity, FTDI miniUSB to JTAG/UART, Gigabit Ethernet, SD card, USB host supports motors with up to 4 phases up to 40V

615.73 € (732.72 € gross)

CR00140-02-K1B

In Stock: 0

Motor Control Development Kit with Xilinx Zynq UltraScale+ ZU2CG-1E MPSoC Module

Motor Control Development Kit with Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E, additional connectivity, FTDI miniUSB to JTAG/UART, Gigabit Ethernet, SD card, USB host supports motors with up to 4 phases up to 40V.

665.98 € (792.52 € gross)

CR00140-02-K0B

In Stock: 0

MPSoC Module with Xilinx Zynq UltraScale+ ZU3EG-1I, 2 GByte DDR4, 4 x 5 cm

Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784I, 2 GByte DDR4, 128 MByte SPI Boot Flash, 8 GByte e.MMC, size: 4 x 5 cm, pin compatible with TE0820

317.58 € (377.92 € gross)

TE0821-01-3BI21MA

In Stock: 0

MPSoC Module with Xilinx Zynq UltraScale+ ZU4EV-1E, 4 GB DDR4, low profile

Low Profile connectors (2.5 mm), Xilinx Zynq UltraScale+ XCZU4EV-1SFVC784E, 4 GByte DDR4, 128 MByte SPI Boot Flash, 8 GByte e.MMC, size: 4 x 5 cm, pin compatible with TE0820

361.13 € (429.74 € gross)

TE0821-01-4DE31FL

In Stock: 0

MPSoC Module with Xilinx Zynq UltraScale+ ZU4EV-1I, 2 GByte DDR4 SDRAM, 4 x 5 cm

Xilinx Zynq UltraScale+ XCZU4EV-1SFVC784I, 2 GByte DDR4, 128 MByte SPI Boot Flash, 8 GByte e.MMC, size: 4 x 5 cm

542.03 € (645.02 € gross)

TE0820-04-4DI21MA

In Stock: 0

MPSoC Module with Xilinx Zynq UltraScale+ ZU5EV-1I, 2 GByte DDR4 SDRAM, 4 x 5 cm

Xilinx Zynq UltraScale+ XCZU5EV-1SFVC784I, 2 GByte DDR4, 128 MByte SPI Boot Flash, 8 GByte e.MMC, size: 4 x 5 cm

759.78 € (904.14 € gross)

TE0820-04-5DI21MA

In Stock: 0

MPSoC Module with Xilinx Zynq UltraScale+ ZU4CG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm

Xilinx Zynq UltraScale+ XCZU4CG-1SFVC784E, 2 GByte DDR4, 128 MByte QSPI Boot Flash, 8 GByte e.MMC, size: 4 x 5 cm

297.48 € (354.00 € gross)

TE0820-04-4AE21MA

In Stock: 0

MPSoC Module with Xilinx Zynq UltraScale+ ZU4EV-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm

Xilinx Zynq UltraScale+ XCZU4EV-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 8 GByte e.MMC, size: 4 x 5 cm

327.63 € (389.88 € gross)

TE0820-04-4DE21MA

In Stock: 0

MPSoC Module with Xilinx Zynq UltraScale+ ZU3EG-1E, 2 GByte DDR4, 4 x 5 cm, LP

Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 8 GByte e.MMC, size: 4 x 5 cm, low profile (2,5 mm)

274.03 € (326.10 € gross)

TE0820-04-3BE21ML

In Stock: 0

MPSoC Module with Xilinx Zynq UltraScale+ ZU3CG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm

Xilinx Zynq UltraScale+ XCZU3CG-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 8 GByte e.MMC, size: 4 x 5 cm

250.58 € (298.19 € gross)

TE0820-04-3AE21MA

In Stock: 0

MPSoC Module with Xilinx Zynq UltraScale+ ZU3EG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm

Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 8 GByte e.MMC, size: 4 x 5 cm

274.03 € (326.10 € gross)

TE0820-04-3BE21MA

In Stock: 0

MPSoC Module with Xilinx Zynq UltraScale+ ZU2EG-1E, 2 GByte DDR4, 4 x 5 cm, LP

Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E, 2 GByte DDR4, 128 MByte QSPI Boot Flash, 8 GByte e.MMC, size: 4 x 5 cm

230.48 € (274.27 € gross)

TE0820-04-2BE21ML

In Stock: 0

MPSoC Module with Xilinx Zynq UltraScale+ ZU2EG-1I, 2 GByte DDR4 SDRAM, 4 x 5 cm

Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784I, 2 GByte DDR4, 128 MByte QSPI Boot Flash, 8 GByte e.MMC, size: 4 x 5 cm

233.83 € (278.26 € gross)

TE0820-04-2BI21MA

In Stock: 0

MPSoC Module with Xilinx Zynq UltraScale+ ZU2EG-1I, 2 GByte DDR4, 4 x 5 cm, LP

Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784I, 2 GByte DDR4, 128 MByte QSPI Boot Flash, 8 GByte e.MMC, size: 4 x 5 cm

233.83 € (278.26 € gross)

TE0820-04-2BI21ML

In Stock: 0

MPSoC Module with Xilinx Zynq UltraScale+ ZU2EG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm

Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E, 2 GByte DDR4, 128 MByte QSPI Boot Flash, 8 GByte e.MMC, size: 4 x 5 cm

237.18 € (282.24 € gross)

TE0820-04-2BE21MA

In Stock: 0

MPSoC Module with Xilinx Zynq UltraScale+ ZU2CG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm

Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 8 GByte e.MMC, size: 4 x 5 cm

210.38 € (250.35 € gross)

TE0820-04-2AE21MA

In Stock: 0

MPSoC Module with Xilinx Zynq UltraScale+ ZU2CG-1I, 2 GByte DDR4 SDRAM, 4 x 5 cm

Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784I, 2 GByte DDR4, 128 MByte SPI Boot Flash, 8 GByte e.MMC, size: 4 x 5 cm

237.18 € (282.24 € gross)

TE0820-04-2AI21MA

In Stock: 0

MPSoC Module with Xilinx Zynq UltraScale+ ZU2CG-1E, 4 GByte DDR4, 4 x 5.6 cm

Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E, 4 GByte DDR4 SDRAM ECC, 128 MByte QSPI Flash, 1 Gbit Ethernet PHY, 8 GByte e.MMC, 8 MByte HyperFlash, size: 4 x 5.6 cm

Price on Application

AM0010-01-2AE21MA

In Stock: 0

CRUVI MAX 10 Base Board with Intel MAX 10 FPGA, 8 MByte SDRAM, 44.85 x 57.50 mm