Trenz Electronic FPGA boards

The micromodules designed by Trenz Electronic feature modern FPGA's. With small size and high-density connectors, they can be used nearly everywhere.

Gigabit Ethernet and integrated USB guarantees high data transfer rates to a host PC.

Other assembly options for cost or performance optimization plus high volume prices available on request.

Trenz Electronic Module Life Cycles

Series	Launch Year	Expected EOL	Expected Life Cycle
TE0140	2004	2019	15
TE0300	2005	2020	15
TE0320	2005	2020	15
TE0600	2010	2027	17
TE0630	2011	2027	16
TE07xx	2013	2028	15
TE08xx	2016	2031	15

Modules	Photo	Form factor (cm)
TEM0001 "SMF2000" FPGA modul with Microsemi SmartFusion2 and 8 MByte Flash. SmartFusion2 combines a 166 MHz Cortex-M3 MCU including 256 KByte Flash and 80 KByte SRAM, as well as 12 kLUT FPGA Core Logic. The TEM0001 is ideal for evaluation and rapid prototying. It's compatible to the Arduino MKR standard. Overview available models		2.5 x 6.15
TEI0003 "CYC1000" FPGA module with an integrated Intel Cyclone 10 LP FPGA, 8 MByte SDRAM, 2 MByte Flash and a LIS3DH 3-axis sensor. It's compatible to the Arduino MKR standard. Overview available models		2.5 x 6.15
TEL0001 "LXO2000" FPGA module integrating a Lattice XO2-4000 and on-board USB/JTAG. It's compatible to the Arduino MKR standard. Overview available models		2.5 x 6.15
TEI0001 "MAX1000" FPGA IoT Maker Board that has been designed for end-to-end application development and optimised for cost. The Arrow MAX1000 board can be installed directly into a custom application or integrated on to a completely separate board. At the heart of the maker board is a compact (11x11mm) Intel MAX10 FPGA with 8000 logic elements. This single chip includes integrated flash memory, a 1Msps 12bit ADC for analogue signals and a 3.3V power supply. Other features include embedded SRAM, DSP blocks, instant-on within milliseconds, and the ability to implement Intel’s NIOS II soft core embedded processor to perform microcontroller tasks. Overview available models		2.5 x 6.15
TE0807 UltraSOM+ MPSoC module with Xilinx Zynq UltraScale+ ZU07EV, 4 GByte DDR4 SDRAM, 128 MByte SPI Boot Flash (dual parallel), plug-on module with 4 x 160-pin connectors, serial transceivers: GTR 4 (all) + GTH 16 (all), Graphic Processing Unit (GPU) + Video codec unit (VCU), extended temperature range, carrier board and individual cooling solution available. Overview available models		5.2 x 7.6
TEF1001 PCIe FMC Carrier integrating a Xilinx Kintex-7 FPGA (K160T, K325T or K410T), 32 MByte SPI Flash, a 4 lane PCIe, a Vita 57.1 FMC HPC Slot and a DDR3 SODIMM Socket. Overview available models		-
TE0713 FPGA module with Xilinx Zynq Artix-7, USB 3.0 to FIFO bridge, 1 GByte of DDR3L SDRAM, 32 MByte Flash memory, Plug-on module with 2 x 100-pin and 1 x 60-pin high-speed hermaphroditic strips, carrier board available. Overview available models		4 x 5
TE0803 MPSoC module with Xilinx Zynq UltraScale+, 4 x 512 MByte (2 GByte) 64-Bit DDR4 SDRAM (up to 8 GByte max), 2 x 256 MBit (2 x 32 MByte) SPI Boot Flash dual parallel (up to 512 MByte max), plug-on module with 4 x 160 pin B2B connectors, carrier board, cooling solution and starter kit available. Overview available models		5.2 x 7.6
TE0820 MPSoC module with Xilinx Zynq UltraScale+, 1 GByte (2 x 512 MByte) DDR4 SDRAM with 32-Bit width, 2 x 32 MByte Flash memory, B2B connectors: 2 x 100 pin and 1 x 60 pin, carrier board available. Overview available models		4 x 5
TE0714 FPGA module with Xilinx Artix-7 35T or 50T, 16 MByte QSPI Flash, smallest module with tranceivers, industrial temperature range, carrier board available. Overview available models		4 x 3
TE0745 SoC module with Xilinx Zynq-7030 or Zynq-7045, 1 GByte DDR3 SDRAM, 32 MByte SPI Flash, 1 GBit Ethernet, 8 x GTX (7030: 4 GT), RTC, industrial temperature range, carrier board available. Overview available models		5.2 x 7.6
TE0841 FPGA module with Xilinx Kintex UltraScale KU35/KU40, 2 GByte DDR4, 64 MByte SPI Boot Flash, 3.2 mm mounting holes for skyline heat spreader, serial transceiver: GTH 8 Lanes (all), industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0808 UltraSOM+ MPSoC module with Xilinx Zynq UltraScale+, 4 x 512 MByte (2 GByte) 64-Bit DDR4 memory, 2 x 256 MBit (2 x 32 MByte) SPI Boot Flash (dual parallel), B2B connectors: 4 x 160 pin, serial transceiver: GTR 4 (all) + GTH 16 (all), industrial temperature range, carrier board and starter kit available. Overview available models		5.2 x 7.6
TE0725LP FPGA module with Xilinx Artix-7 100T, 32 MByte Flash, optional HyperRAM or HyperFlash, 2 x 50 pin with 2,54 mm pitch, VIN 3,3V or 1,8V, commercial temperature range available (industrial temperature range on request). Overview available models		7.3 x 3.5
TE0725 FPGA module with Xilinx Artix-7 15T, 35T or 100T, 32 MByte Flash, from revision 03 64 MBit HyperRAM, 2 x 50 Pin with 2.54 mm pitch, optional Fiber Optic Module (125/250 or 1000 MBit/s), commercial temperature range available (industrial temperature range on request). Overview available models		7.3 x 3.5
TE0726 "ZynqBerry" SoC module with Xilinx Zynq-7010 with Raspberry Pi form factor, 512 MByte (128 MByte) DDR3L, 16 MByte SPI Flash, Micro SD socket, 4 USB with power switches, 100 MBit Ethernet, DSI and CSI-2 Connector (display and camera), HAT header with 26 I/O's, commercial temperature range. Overview available models		like Raspberry Pi Model 2
TE0729 SoC module with Xilinx Zynq-7020, 512 MByte DDR3, 32 MByte QSPI-Flash, 1 x 10/100/1000 Mbps Ethernet transceiver PHY, 2 x 10/100 Mbps Ethernet transceiver PHYs, RTC, equipped with sulfur resistant resistors, industrial temperature range, carrier board and starter kit available. Overview available models		5.2 x 7.6
TE0723 "ArduZynq" SoC module with Xilinx Zynq-7010 with Arduino Shield form factor, 128 MByte DDR3L; version M: 512 MByte DDR3L, 16 MByte SPI Flash, Hi-Speed USB2.0 ULPI Transceiver, 23 FPGA I/O's on B2B connectors available, commercial temperature range. Overview available models		Arduino shield
TE0782 SoC module with Xilinx Zynq-7035, Zynq-7045 or Zynq-7100, 1 GByte DDR3, 32 MByte QSPI Flash, 4 GByte eMMC (optional up to 64 GByte), 2 x Gigabit Ethernet Tranceiver, RTC, optional 2 x 8 MByte HyperRAM (max. 2 x 32 MByte), 16 GTX high-performance Tranceiver Lanes, industrial temperature range, test fixture available. Overview available models		8.5 x 8.5
TE0722 "DIPFORTy1 Soft Propeller" Propeller compatible DIP40 pinout module with Xilinx Zynq-7010, 16 MByte SPI Flash (primary boot), 33.333 MHz Clock (MEMS Oscillator), Total user accessible PL I/O: 46 (+3 Input only), MicroSD Card socket, commercial temperature range. Overview available models		1.8 x 5.1
TE0728 SoC module with Xilinx automotive Zynq-7020, 512 MByte DDR3, 16 MByte QSPI Flash, 2 x 100 MBit Ethernet Transceiver (PHY), 76 single ended I/O, 24 LVDS pairs (48 I/O) and 42 MIO available on B2B connectors, CAN Transceiver (PHY), automotive temperature range, carrier board available. Overview available models		6 x 6
TE0715 SoC module with Xilinx Zynq-7015 or Zynq-7030, 1 GByte DDR3, 32 MByte QSPI Flash, 1 GBit Ethernet, 4 GTP/GTX Tranceivers, Programmable Clock Generator: Transceiver Clock (default 125 MHz), industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0712 FPGA module with Xilinx Artix-7 100T or 200T, 1 GByte DDDR3, 32 MByte Quad-SPI Flash, 100 MBit Ethernet, 4 Multi Gigabit transceivers, industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0711 FPGA module with Xilinx Artix-7 35T or 100T, 32 MByte QSPI Flash, 100 MHz MEMS oscillator, 178 FPGA I/O's (84 differential pairs), 3 User LED's, industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0710 FPGA module with Xilinx Artix-7 35T or 100T, 512 MByte DDR3, 32 MByte QSPI Flash, 2 x 100 MBit Ethernet, industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0720 SoC module with Xilinx Zynq-7020, 256 MByte/512 MByte DDR3L/1 GByte DDR3 (depending on version), 32 MByte SPI Flash, 4 GByte e-NAND (up to 32 GByte), 152 FPGA I/O's available on B2B connectors, RTC, 3 User LED's, automotive, industrial and commercial temperature range, carrier board and starter kit available. Overview available models		4 x 5
TE0741 FPGA module with Xilinx Kintex-7 70T, 160T, 325T or 410T, 32 MByte Quad-SPI Flash, max. GTX transceiver data rate 10,3125 Gb/s (default 6,6 Gb/s), 8 Multi Gigabit Transceivers, 2 User LED, 1 DONE PFGA pin LED, industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0630 FPGA module with Xilinx Spartan-6 LX45, LX75 oder LX150, 128 MByte DDR3, 8 MByte SPI Flash, up to 40 different and up to 109 single end FPGA I/O pins available on B2B connectors, 1.2 V, 1.5 V, 2.5 V = VCCAUX and 3.3 V power rails, 4 User LED, 1 User Push-Button, 2 User DIP Switches, industrial temperature range, carrier board available. Overview available models		4 x 5
TE0600 GigaBee module with Xilinx Spartan-6 LX45, LX100 or LX150, two independent 128 MByte DDR SDRAM banks (optional 2 x 512 MByte DDR SDRAM), 16 MByte SPI Flash, 10/100/1000 tri-speed GBit Ethernet transceiver (PHY), JTAG Port, industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0320 Module with Xilinx Spartan-3A, 1 GBit DDR RAM up to 1333 MByte/s bandwidth, 32 MBit SPI Flash, 109 I/Os (+ 10 dual-purpose pins) available on B2B connectors, 4 LED, 2 Push Buttons, 8 DIP Switches, industrial and commercial temperature range, carrier board available. Overview available models		6.8 x 4.8
TE0300 FPGA module with Xilinx Spartan-3E, 32 MBit SPI Flash, 512 MBit DDR RAM up to 666 MByte/s bandwidth, 3 on-board DC-DC converters for high efficieny, 104 I/Os + 6 Inputs available on B2B connectors, industrial and commercial temperature range, carrier board available. Overview available models		4.05 x 4.75
TE0140 Module with Xilinx Spartan-3, USB 2.0 transceiver, 16 KBit EEPROM, 120 available I/O's on B2B connectors, one LED, 1 push button, commercial temperature range, carrier board available. Overview available models		5.07 x 4.36

The micromodules designed by Trenz Electronic feature modern FPGA's. With small size and high-density connectors, they can be used nearly everywhere. Gigabit Ethernet and integrated USB... read more »

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Trenz Electronic FPGA boards

The micromodules designed by Trenz Electronic feature modern FPGA's. With small size and high-density connectors, they can be used nearly everywhere.

Gigabit Ethernet and integrated USB guarantees high data transfer rates to a host PC.

Other assembly options for cost or performance optimization plus high volume prices available on request.

Trenz Electronic Module Life Cycles

Series	Launch Year	Expected EOL	Expected Life Cycle
TE0140	2004	2019	15
TE0300	2005	2020	15
TE0320	2005	2020	15
TE0600	2010	2027	17
TE0630	2011	2027	16
TE07xx	2013	2028	15
TE08xx	2016	2031	15

Modules	Photo	Form factor (cm)
TEM0001 "SMF2000" FPGA modul with Microsemi SmartFusion2 and 8 MByte Flash. SmartFusion2 combines a 166 MHz Cortex-M3 MCU including 256 KByte Flash and 80 KByte SRAM, as well as 12 kLUT FPGA Core Logic. The TEM0001 is ideal for evaluation and rapid prototying. It's compatible to the Arduino MKR standard. Overview available models		2.5 x 6.15
TEI0003 "CYC1000" FPGA module with an integrated Intel Cyclone 10 LP FPGA, 8 MByte SDRAM, 2 MByte Flash and a LIS3DH 3-axis sensor. It's compatible to the Arduino MKR standard. Overview available models		2.5 x 6.15
TEL0001 "LXO2000" FPGA module integrating a Lattice XO2-4000 and on-board USB/JTAG. It's compatible to the Arduino MKR standard. Overview available models		2.5 x 6.15
TEI0001 "MAX1000" FPGA IoT Maker Board that has been designed for end-to-end application development and optimised for cost. The Arrow MAX1000 board can be installed directly into a custom application or integrated on to a completely separate board. At the heart of the maker board is a compact (11x11mm) Intel MAX10 FPGA with 8000 logic elements. This single chip includes integrated flash memory, a 1Msps 12bit ADC for analogue signals and a 3.3V power supply. Other features include embedded SRAM, DSP blocks, instant-on within milliseconds, and the ability to implement Intel’s NIOS II soft core embedded processor to perform microcontroller tasks. Overview available models		2.5 x 6.15
TE0807 UltraSOM+ MPSoC module with Xilinx Zynq UltraScale+ ZU07EV, 4 GByte DDR4 SDRAM, 128 MByte SPI Boot Flash (dual parallel), plug-on module with 4 x 160-pin connectors, serial transceivers: GTR 4 (all) + GTH 16 (all), Graphic Processing Unit (GPU) + Video codec unit (VCU), extended temperature range, carrier board and individual cooling solution available. Overview available models		5.2 x 7.6
TEF1001 PCIe FMC Carrier integrating a Xilinx Kintex-7 FPGA (K160T, K325T or K410T), 32 MByte SPI Flash, a 4 lane PCIe, a Vita 57.1 FMC HPC Slot and a DDR3 SODIMM Socket. Overview available models		-
TE0713 FPGA module with Xilinx Zynq Artix-7, USB 3.0 to FIFO bridge, 1 GByte of DDR3L SDRAM, 32 MByte Flash memory, Plug-on module with 2 x 100-pin and 1 x 60-pin high-speed hermaphroditic strips, carrier board available. Overview available models		4 x 5
TE0803 MPSoC module with Xilinx Zynq UltraScale+, 4 x 512 MByte (2 GByte) 64-Bit DDR4 SDRAM (up to 8 GByte max), 2 x 256 MBit (2 x 32 MByte) SPI Boot Flash dual parallel (up to 512 MByte max), plug-on module with 4 x 160 pin B2B connectors, carrier board, cooling solution and starter kit available. Overview available models		5.2 x 7.6
TE0820 MPSoC module with Xilinx Zynq UltraScale+, 1 GByte (2 x 512 MByte) DDR4 SDRAM with 32-Bit width, 2 x 32 MByte Flash memory, B2B connectors: 2 x 100 pin and 1 x 60 pin, carrier board available. Overview available models		4 x 5
TE0714 FPGA module with Xilinx Artix-7 35T or 50T, 16 MByte QSPI Flash, smallest module with tranceivers, industrial temperature range, carrier board available. Overview available models		4 x 3
TE0745 SoC module with Xilinx Zynq-7030 or Zynq-7045, 1 GByte DDR3 SDRAM, 32 MByte SPI Flash, 1 GBit Ethernet, 8 x GTX (7030: 4 GT), RTC, industrial temperature range, carrier board available. Overview available models		5.2 x 7.6
TE0841 FPGA module with Xilinx Kintex UltraScale KU35/KU40, 2 GByte DDR4, 64 MByte SPI Boot Flash, 3.2 mm mounting holes for skyline heat spreader, serial transceiver: GTH 8 Lanes (all), industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0808 UltraSOM+ MPSoC module with Xilinx Zynq UltraScale+, 4 x 512 MByte (2 GByte) 64-Bit DDR4 memory, 2 x 256 MBit (2 x 32 MByte) SPI Boot Flash (dual parallel), B2B connectors: 4 x 160 pin, serial transceiver: GTR 4 (all) + GTH 16 (all), industrial temperature range, carrier board and starter kit available. Overview available models		5.2 x 7.6
TE0725LP FPGA module with Xilinx Artix-7 100T, 32 MByte Flash, optional HyperRAM or HyperFlash, 2 x 50 pin with 2,54 mm pitch, VIN 3,3V or 1,8V, commercial temperature range available (industrial temperature range on request). Overview available models		7.3 x 3.5
TE0725 FPGA module with Xilinx Artix-7 15T, 35T or 100T, 32 MByte Flash, from revision 03 64 MBit HyperRAM, 2 x 50 Pin with 2.54 mm pitch, optional Fiber Optic Module (125/250 or 1000 MBit/s), commercial temperature range available (industrial temperature range on request). Overview available models		7.3 x 3.5
TE0726 "ZynqBerry" SoC module with Xilinx Zynq-7010 with Raspberry Pi form factor, 512 MByte (128 MByte) DDR3L, 16 MByte SPI Flash, Micro SD socket, 4 USB with power switches, 100 MBit Ethernet, DSI and CSI-2 Connector (display and camera), HAT header with 26 I/O's, commercial temperature range. Overview available models		like Raspberry Pi Model 2
TE0729 SoC module with Xilinx Zynq-7020, 512 MByte DDR3, 32 MByte QSPI-Flash, 1 x 10/100/1000 Mbps Ethernet transceiver PHY, 2 x 10/100 Mbps Ethernet transceiver PHYs, RTC, equipped with sulfur resistant resistors, industrial temperature range, carrier board and starter kit available. Overview available models		5.2 x 7.6
TE0723 "ArduZynq" SoC module with Xilinx Zynq-7010 with Arduino Shield form factor, 128 MByte DDR3L; version M: 512 MByte DDR3L, 16 MByte SPI Flash, Hi-Speed USB2.0 ULPI Transceiver, 23 FPGA I/O's on B2B connectors available, commercial temperature range. Overview available models		Arduino shield
TE0782 SoC module with Xilinx Zynq-7035, Zynq-7045 or Zynq-7100, 1 GByte DDR3, 32 MByte QSPI Flash, 4 GByte eMMC (optional up to 64 GByte), 2 x Gigabit Ethernet Tranceiver, RTC, optional 2 x 8 MByte HyperRAM (max. 2 x 32 MByte), 16 GTX high-performance Tranceiver Lanes, industrial temperature range, test fixture available. Overview available models		8.5 x 8.5
TE0722 "DIPFORTy1 Soft Propeller" Propeller compatible DIP40 pinout module with Xilinx Zynq-7010, 16 MByte SPI Flash (primary boot), 33.333 MHz Clock (MEMS Oscillator), Total user accessible PL I/O: 46 (+3 Input only), MicroSD Card socket, commercial temperature range. Overview available models		1.8 x 5.1
TE0728 SoC module with Xilinx automotive Zynq-7020, 512 MByte DDR3, 16 MByte QSPI Flash, 2 x 100 MBit Ethernet Transceiver (PHY), 76 single ended I/O, 24 LVDS pairs (48 I/O) and 42 MIO available on B2B connectors, CAN Transceiver (PHY), automotive temperature range, carrier board available. Overview available models		6 x 6
TE0715 SoC module with Xilinx Zynq-7015 or Zynq-7030, 1 GByte DDR3, 32 MByte QSPI Flash, 1 GBit Ethernet, 4 GTP/GTX Tranceivers, Programmable Clock Generator: Transceiver Clock (default 125 MHz), industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0712 FPGA module with Xilinx Artix-7 100T or 200T, 1 GByte DDDR3, 32 MByte Quad-SPI Flash, 100 MBit Ethernet, 4 Multi Gigabit transceivers, industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0711 FPGA module with Xilinx Artix-7 35T or 100T, 32 MByte QSPI Flash, 100 MHz MEMS oscillator, 178 FPGA I/O's (84 differential pairs), 3 User LED's, industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0710 FPGA module with Xilinx Artix-7 35T or 100T, 512 MByte DDR3, 32 MByte QSPI Flash, 2 x 100 MBit Ethernet, industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0720 SoC module with Xilinx Zynq-7020, 256 MByte/512 MByte DDR3L/1 GByte DDR3 (depending on version), 32 MByte SPI Flash, 4 GByte e-NAND (up to 32 GByte), 152 FPGA I/O's available on B2B connectors, RTC, 3 User LED's, automotive, industrial and commercial temperature range, carrier board and starter kit available. Overview available models		4 x 5
TE0741 FPGA module with Xilinx Kintex-7 70T, 160T, 325T or 410T, 32 MByte Quad-SPI Flash, max. GTX transceiver data rate 10,3125 Gb/s (default 6,6 Gb/s), 8 Multi Gigabit Transceivers, 2 User LED, 1 DONE PFGA pin LED, industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0630 FPGA module with Xilinx Spartan-6 LX45, LX75 oder LX150, 128 MByte DDR3, 8 MByte SPI Flash, up to 40 different and up to 109 single end FPGA I/O pins available on B2B connectors, 1.2 V, 1.5 V, 2.5 V = VCCAUX and 3.3 V power rails, 4 User LED, 1 User Push-Button, 2 User DIP Switches, industrial temperature range, carrier board available. Overview available models		4 x 5
TE0600 GigaBee module with Xilinx Spartan-6 LX45, LX100 or LX150, two independent 128 MByte DDR SDRAM banks (optional 2 x 512 MByte DDR SDRAM), 16 MByte SPI Flash, 10/100/1000 tri-speed GBit Ethernet transceiver (PHY), JTAG Port, industrial and commercial temperature range, carrier board available. Overview available models		4 x 5
TE0320 Module with Xilinx Spartan-3A, 1 GBit DDR RAM up to 1333 MByte/s bandwidth, 32 MBit SPI Flash, 109 I/Os (+ 10 dual-purpose pins) available on B2B connectors, 4 LED, 2 Push Buttons, 8 DIP Switches, industrial and commercial temperature range, carrier board available. Overview available models		6.8 x 4.8
TE0300 FPGA module with Xilinx Spartan-3E, 32 MBit SPI Flash, 512 MBit DDR RAM up to 666 MByte/s bandwidth, 3 on-board DC-DC converters for high efficieny, 104 I/Os + 6 Inputs available on B2B connectors, industrial and commercial temperature range, carrier board available. Overview available models		4.05 x 4.75
TE0140 Module with Xilinx Spartan-3, USB 2.0 transceiver, 16 KBit EEPROM, 120 available I/O's on B2B connectors, one LED, 1 push button, commercial temperature range, carrier board available. Overview available models		5.07 x 4.36

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UltraITX+ Baseboard for Trenz Electronic TE080X UltraSOM+

The Trenz Electronic TEBF0808 carrier board is a baseboard for the Xilinx Zynq Ultrascale+ MPSoC modules TE0803, TE0807 und TE0808

From 479.40 € (570.49 € gross) *

TEBF0808-04A

In Stock: 0

TEB0911 UltraRack+ MPSoC Board with Xilinx Zynq UltraScale+ ZU9,6 FMC connectors

MPSoC Board with Xilinx Zynq UltraScale+ XCZU9EG-1FFVB1156E, 64bit DDR4 SODIMM (PS connected), M2 PCIe SSD (1-Lane), eMMC (bootable), Dual QSPI Flash (bootable)

From 1,860.00 € (2,213.40 € gross) *

TEB0911-04-9BEX1FA

In Stock: 0

TE0706 - Carrierboard for Trenz Electronic Modules with 4 x 5 cm Form Factor

Simple carrier board for Trenz Electronic 4 x 5 modules. It is mainly for the use with TE0720 and TE0715 modules.

From 89.40 € (106.39 € gross) *

TE0706-03

In Stock: 2

MPSoC Module with Xilinx Zynq UltraScale+ ZU3EG-1E, 2 GByte DDR4, 5.2 x 7.6 cm

Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E, 2 GByte DDR4, 128 MByte QSPI Boot Flash, size: 5.2 x 7.6 cm

From 239.40 € (284.89 € gross) *

TE0803-03-3BE11-A

In Stock: 0

MPSoC Module with Xilinx Zynq UltraScale+ ZU3EG-1E, 2 GByte DDR4, 4 x 5 cm, LP

Low profile connectors (2.5 mm), Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 4 GByte e.MMC, size: 4 x 5 cm

From 221.40 € (263.47 € gross) *

TE0820-03-3BE21FL

In Stock: 0

MPSoC Module with Xilinx Zynq UltraScale+ ZU4CG-1E, 2 GByte DDR4, 5.2 x 7.6 cm

Xilinx Zynq UltraScale+ XCZU4CG-1SFVC784E, 2 GByte DDR4, 128 MByte QSPI Boot Flash, size: 5.2 x 7.6 cm

From 317.40 € (377.71 € gross) *

TE0803-03-4AE11-A

In Stock: 0

MPSoC Module with Xilinx Zynq UltraScale+ ZU2CG-1E, 2 GByte DDR4, 5.2 x 7.6 cm

Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E, 2 GByte DDR4, 128 MByte QSPI Boot Flash, size: 5.2 x 7.6 cm

From 179.40 € (213.49 € gross) *

TE0803-03-2AE11-A

In Stock: 0

MPSoC-Module with Xilinx Zynq UltraScale+ ZU2EG-1E, 2 GByte DDR4, 5.2 x 7.6 cm

Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E, 2 GByte DDR4, 128 MByte QSPI Boot Flash, size: 5.2 x 7.6 cm

From 203.40 € (242.05 € gross) *

TE0803-03-2BE11-A

In Stock: 0

FPGA-Modul with Xilinx Artix-7 100T (Variante 72C), 2 x 50 Pin, 3,3V supply

Xilinx Artix-7 XC7A100T-2CSG324C, 64 MByte Flash, optional HyperRAM or -Flash, 3,3V single supply

From 89.25 € (106.21 € gross) *

TE0725LP-01-72C-1

In Stock: 0

TE0803-03-3BE11-AS Starter Kit with Zynq UltraScale+ FPGA Module

MPSoC module TE0803 ZU03EG with pre-assembled heatsink on a TEBF0808 baseboard in a Core V1 Mini-ITX enclosure + accessories

From 769.30 € (915.47 € gross) *

TE0803-03-3BE11-AS

In Stock: 0

MPSoC Module with Xilinx Zynq UltraScale+ ZU4EV-1E, 4 GByte DDR4, 5.2x7.6 cm, LP

Samtec Razor Beam low profile (1 mm) slim socket strips, Xilinx Zynq UltraScale+ XCZU4EV-1SFVC784E, 4 GByte DDR4, 128 MByte QSPI Boot Flash, size: 5.2 x 7.6 cm

From 407.40 € (484.81 € gross) *

TE0803-03-4DE21-L

In Stock: 0

MPSoC Module with Xilinx Zynq UltraScale+ ZU4EV-1E, 2 GByte DDR4, 5.2 x 7.6 cm

Xilinx Zynq UltraScale+ XCZU4EV-1SFVC784E, 2 GByte DDR4, 128 MByte QSPI Boot Flash, size: 5.2 x 7.6 cm

From 389.40 € (463.39 € gross) *

TE0803-03-4DE11-A

In Stock: 0

MPSoC Module with Xilinx Zynq UltraScale+ ZU4EG-1E, 2 GByte DDR4, 5.2 x 7.6 cm

Xilinx Zynq UltraScale+ XCZU4EG-1SFVC784E, 2 GByte DDR4, 128 MByte QSPI Boot Flash, size: 5.2 x 7.6 cm

From 341.40 € (406.27 € gross) *

TE0803-03-4BE11-A

In Stock: 0

MPSoC Module with Xilinx Zynq UltraScale+ ZU3EG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm

Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 4 GByte e.MMC, size: 4 x 5 cm

From 221.40 € (263.47 € gross) *

TE0820-03-03EG-1EA

In Stock: 0

MPSoC Module with Xilinx Zynq UltraScale+ ZU2EG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm

Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 4 GByte e.MMC, size: 4 x 5 cm

From 179.40 € (213.49 € gross) *

TE0820-03-02EG-1EA

In Stock: 0

MPSoC-Module with Xilinx Zynq UltraScale+ ZU3CG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm

Xilinx Zynq UltraScale+ XCZU3CG-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 4 GByte e.MMC, size: 4 x 5 cm

From 191.40 € (227.77 € gross) *

TE0820-03-03CG-1EA

In Stock: 0

MPSoC Module with Xilinx Zynq UltraScale+ ZU2CG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm

Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 4 GByte e.MMC, size: 4 x 5 cm

From 161.40 € (192.07 € gross) *

TE0820-03-02CG-1EA

In Stock: 0

Trenz Electronic TE0820-03-04CG-1EA, MPSoC-Modul mit Xilinx Zynq UltraScale+ ZU4CG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm

MPSoC Module with Xilinx Zynq UltraScale+ ZU4CG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm

Xilinx Zynq UltraScale+ XCZU4CG-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 4 GByte e.MMC, size: 4 x 5 cm

From 329.40 € (391.99 € gross) *

TE0820-03-04CG-1EA

In Stock: 0

TE0703 - Trägerboard für Trenz Electronic Module mit 4 x 5 cm Formfaktor

TE0703 - Carrier board for Trenz Electronic modules with 4 x 5 cm form factor

Carrier Board for 4 x 5 cm Trenz Electronic SoC's with 3 x Samtec LSHM Series Connectors

From 69.30 € (82.47 € gross) *

TE0703-06

In Stock: 0

Trenz Electronic TE0724-03-20-1I, SoC-Modul mit Xilinx Zynq XC7Z020-1CLG400I

SoC Module with Xilinx Zynq XC7Z020-1CLG400I, 1 GByte DDR3L, 6 x 4 cm

Xilinx Zynq XC7Z020-1CLG400I; 1 GByte DDR3L SDRAM; 32 MByte QSPI Flash memory; 1 GBit Ethernet PHY

From 119.40 € (142.09 € gross) *

TE0724-03-20-1I

In Stock: 0

Trenz Electronic TE0890-01-25-1C, S7 Mini - Fully Open-Source Modul mit Xilinx Spartan-7 7S25

S7 Mini - Fully Open-Source Module with Xilinx Spartan-7 7S25 + 64 MBit HyperRAM

Fully Open-Source Spartan-7 Module, 64 MBit Config PROM, 64 MBit HyperRAM DRAM, 5V supply input

34.00 € (40.46 € gross) *

TE0890-01-25-1C

In Stock: 0

TE0714-02-50-2IAC6 Trenz Electronic FPGA module

FPGA Module with Xilinx Artix-7 XC7A50T-2CSG325I, 1.8 V configuration, 4 x 3 cm

Xilinx Artix-7 XC7A50T-2CSG325I, special 1.8V configuration, 16 MByte Flash memory, size: 3 x 4 cm

From 71.40 € (84.97 € gross) *

TE0714-02-50-2IAC6

In Stock: 2

Trenz Electronic TEC0089 - DesignWare ARC EM Software Development Plattform

DesignWare ARC EM Software Development Platform

Integrating a Xilinx Kintex-7 XC7K325T-2FBG676C FPGA, 32 MByte Flash for FPGA boot, configuration and operation, 32 MByte User accessible Flash, USB-JTAG bridge, Micro SDcard Socket

699.00 € (831.81 € gross) *

TEC0089-02-325-2CC

In Stock: 0

UltraSOM+ MPSoC Module with Zynq UltraScale+ ZU6EG and mounted Heat Spreader

MPSoC with integrated Xilinx Zynq UltraScale+ XCZU6EG-1FFVC900E and mounted heat spreader; 4 GByte DDR4 SDRAM; size: 5,2 x 7,6 cm

From 654.50 € (778.86 € gross) *

TE0808-04-06EG-1EK

In Stock: 0

UltraSOM+ MPSoC Module with Zynq UltraScale+ ZU9EG and mounted Heat Spreader

Xilinx Zynq UltraScale+ XCZU09EG-1FFVC900E, 52 x 76 mm form factor, 4 GByte DDR4 SDRAM, 128 MByte SPI Boot Flash, 20 x high speed serial transceiver

From 724.50 € (862.16 € gross) *

TE0808-04-09EG-1EK

In Stock: 0

MAX1000 - IoT Maker Board, 8KLE, 8 MByte RAM

The MAX10 provides for a complete solution all necessary features, like single supply, integrated ADC, 2-16kLE, internal Flash, PLL and memory interface.

22.00 € (26.18 € gross) *

TEI0001-03-08-C8

In Stock: 1024

UltraSOM+ MPSoC Module with Zynq UltraScale+ ZU15EG and mounted Heat Spreader

Xilinx Zynq UltraScale+ XCZU15EG-1FFVC900E, 52 x 76 mm form factor, 4 GByte DDR4 SDRAM, 128 MByte SPI Boot Flash, 20 x serial transceiver

From 834.00 € (992.46 € gross) *

TE0808-04-15EG-1EK

In Stock: 0

FMC Card with DisplayPort input and output

DisplayPort 1.2 compatible FMC card with data rates up to 5.4 Gbps

599.00 € (712.81 € gross) *

TEF0007-02A

In Stock: 2

Trenz Electronic TEF1001 - PCIe FMC Carrier with Xilinx Kintex-7 160T, 4 Lane PCIe GEN2

PCIe FMC Carrier mit Xilinx Kintex-7 160T, 4 Lane PCIe GEN2, DDR3 SODIMM ECC

Xilinx Kintex-7 XC7K160T-2FBG676I, Vita 57.1 FMC HPC Slot, 4 lane PCIe Gen 2, DDR3 SODIMM Socket, 32 MByte SPI Flash

From 418.80 € (498.37 € gross) *

TEF1001-02-160-2I

In Stock: 0

Trenz Electronic TE0745-02-30-1IA-K - SoM with Xilinx Zynq-7030 and Heat Spreader

SoM with Xilinx Zynq-7030 and heat spreader,1 GByte DDR3 SDRAM, 5,2 x 7,6 cm

Xilinx Zynq-7030 SoC XC7Z030-1FBG676I; 32-Bit-wide 1 GByte DDR3 SDRAM; 64 MByte SPI Flash memory; USB 2.0 OTG; 250 I/O's

From 327.00 € (389.13 € gross) *

TE0745-02-30-1IA-K

In Stock: 0

SoM with Xilinx Zynq XC7Z030-1FBG676I, 1 GByte DDR3 SDRAM, 5.2 x 7.6 cm

Xilinx Zynq-7030 SoC XC7Z030-1FBG676I; 32-Bit-wide 1 GByte DDR3 SDRAM; 64 MByte SPI Flash memory; USB 2.0 OTG; 250 I/O's

From 399.20 € (475.05 € gross) *

TE0745-02-30-1IA

In Stock: 0

FPGA Module with Xilinx Artix-7 XC7A100T-2FGG484C, 4 x 5 cm, 1 GByte DDR3L

Xilinx Artix-7 XC7A100T-2FGG484C; 1 GByte DDR3L Memory; 32 MByte QSPI Flash memory; USB 3.0 to FIFO interface bridge; size: 4 x 5 cm

From 160.30 € (190.76 € gross) *

TE0713-02-100-2C

In Stock: 54

Trenz Electronic TE0713-02-200-2C - FPGA module 4 x5 cm with Xilinx Artix-7 XC7A100T-2FGG484C

FPGA Module with Xilinx Artix-7 XC7A200T-2FBG484C, 4 x 5 cm, 1 GByte DDR3L

Xilinx Artix-7 XC7A200T-2FBG484C; 1 GByte DDR3L; 32 MByte QSPI Flash; USB 3.0 to FIFO interface bridge; size: 4 x 5 cm

From 167.40 € (199.21 € gross) *

TE0713-02-200-2C

In Stock: 4

MPSoC Module with Xilinx Zynq UltraScale+ ZU2EG-1E, 2 GByte DDR4, 4 x 5 cm, LP

Low Profile connectors (2.5 mm), Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 4 GByte e.MMC, size: 4 x 5 cm

From 185.40 € (220.63 € gross) *

TE0820-03-02EG-1EL

In Stock: 0

Trenz Electronic TEC0850-03-15EG1E - CompactPCI Serial Card

CompactPCI Serial Card with Xilinx Zynq UltraScale+ ZU15, 3U form factor

CompactPCI Serial card, Xilinx Zynq UltraScale+ MPSoC, DDR4 SDRAM SODIMM socket, dual 512 MByte Flash memory, 24 Gigabit transceivers on PL side and 4 on PS side, USB2 and USB3 FIFO bridges

From 2,097.00 € (2,495.43 € gross) *

TEC0850-03-15EG1E

In Stock: 0

AnalogMAX - ADI Sensor Hub

AnalogMAX is part of the ultra low-cost MAX1000 series.

59.00 € (70.21 € gross) *

TEI0010-02-08-C8

In Stock: 3

SoC Micromodule with Xilinx Automotive Zynq-7020, 512 MByte DDR3L, 6 x 6 cm

Xilinx Zynq Xilinx XA7Z020-1CLG484Q; 512 MByte DDR3L SDRAM; 16 MByte SPI Flash; 2 x 100 MBit Ethernet

From 299.40 € (356.29 € gross) *

TE0728-04-1Q

In Stock: 17

FMC card based on VITA 57.1 FMC HPC standard plus four SFP+ 10 GBit ports

For use on a FMC HPC carrier and not to be used stand-alone

From 149.40 € (177.79 € gross) *

TEF0008-02

In Stock: 4

MPSoC Module with Xilinx Zynq UltraScale+ ZU5EV-1E, 2 GByte DDR4, 5,2 x 7,6 cm

Xilinx Zynq UltraScale+ XCZU5EV-1SFVC784E, 2 GByte DDR4, 128 MByte QSPI Boot Flash, Size: 5.2 x 7.6 cm

From 599.40 € (713.29 € gross) *

TE0803-02-05EV-1EA

In Stock: 1

High-performance SoM with Xilinx Zynq Z-7100, Memory on both PS and PL

Xilinx Zynq SoC XC7Z100, 1 GByte RAM (32bit wide DDR3) connected to PS, 2 GByte RAM (64bit wide DDR3) connected to PL, 32 MByte QSPI Flash

From 1,236.00 € (1,470.84 € gross) *

TE0783-02-100-2I

In Stock: 0

High-Performance SoM with Xilinx Zynq Z-7045, Memory on both PS and PL

Xilinx Zynq SoC XC7Z045, 1 GByte RAM (32bit wide DDR3) connected to PS, 2 GByte RAM (64bit wide DDR3) connected to PL, 32 MByte QSPI Flash

1,490.00 € (1,773.10 € gross) *

TE0783-01-045-2I

In Stock: 5

Micromodule with Xilinx Kintex UltraScale KU40, 2 GByte DDR4, low profile

Low Profile Terminal/Socket Strips (2.5 mm), Xilinx Kintex UltraScale XCKU040-1SFVA784I, 2 GByte DDR4, 64 MByte SPI Boot Flash, Serial transceiver: GTH 8 lanes

From 930.00 € (1,106.70 € gross) *

TE0841-02-040-1IL

In Stock: 0

PCIe FMC Carrier with Xilinx Kintex-7 410T, 4 Lane PCIe GEN2, DDR3 SODIMM ECC

Xilinx Kintex-7 XC7K410T-2FBG676I, Vita 57.1 FMC HPC Slot, 4-Spur PCIe Gen 2, DDR3 SODIMM with ECC Socket, 32 MByte SPI Flash

From 822.50 € (978.78 € gross) *

TEF1001-02-410-2I

In Stock: 0

SoC Module with Xilinx Zynq-Z020 (Automotive), 1 GByte DDR3 SDRAM, low profile

Low Profile connectors (2.5 mm), Xilinx Zynq XA7Z020-1CLG484Q (Automotive), 1 GByte DDR3 SDRAM, 32 MByte QSPI Flash memory, 4 GByte e.MMC. size: 4 x 5 cm

From 179.40 € (213.49 € gross) *

TE0720-03-1QFL

In Stock: 0

MPSoC Module with Xilinx Zynq UltraScale+ ZU7EV, 4 GByte DDR4

Xilinx Zynq UltraScale+ XCZU7EV-1FBVB900E; 4 GByte DDR4; 128 MByte QSPI Boot Flash; Dimension: 5,2 x 7,6 cm

From 840.00 € (999.60 € gross) *

TE0807-02-07EV-1E

In Stock: 0

Heatsink maxiGRIP 23 x 23 x 19.5 mm for TE0803

BGA Heat Sink - High Performance, maxiFLOW/maxiGRIP-Low Profile Heat Sink Type: maxiFLOW Heat Sink Attachment: maxiGRIP The heat sink maxiGRIP has been specially modified for the TE0803 module. Features maxiFLOW™ design features a low...

11.18 € (13.30 € gross) *

28174

In Stock: 0