SoM with AMD Zynq™ 7035-2I, 1 GByte DDR3L, 5.2 x 7.6 cm
SoM with AMD Zynq™ 7045-1C, 1 GByte DDR3L, 5.2 x 7.6 cm
SoM with AMD Zynq™ 7035-1C, 1 GByte DDR3L, 5.2 x 7.6 cm
SoM with AMD Zynq™ 7045-2I, 1 GByte DDR3L, 5.2 x 7.6 cm
SoM with AMD Zynq™ 7030-2I, 1 GByte DDR3L, 5.2 x 7.6 cm
Microchip PolarFire® SoC FPGA 95T-1I, 1 GByte LPDDR4 SDRAM, 4 x 5 cm
Microchip PolarFire® SoC FPGA 25T-1I, 1 GByte LPDDR4 SDRAM, 4 x 5 cm
Microchip PolarFire® SoC FPGA 25T-FE, 1 GByte LPDDR4 SDRAM, 4 x 5 cm
MPSoC Development Board with AMD Zynq™ UltraScale+™ ZU1EG and 1 GB LPDDR4
Heat Spreader for Trenz Electronic Modules TE0818
UltraSOM+ MPSoC Module with AMD Zynq™ UltraScale+™ ZU9EG-1E, 4 GByte DDR4, LP
SMF2000 FPGA Module with Microchip SmartFusion® 2, 8 MByte SDRAM
MPSoC Module with AMD Zynq™ UltraScale+™ ZU3EG-1E, 2 GByte DDR4, 4 x 5 cm, LP
MPSoC Module with AMD Zynq™ UltraScale+™ ZU7EV-1I, 4 GByte DDR4, 5.2 x 7.6 cm
MCC USB-DIO24/37: Digital I/O device with 24 channels
USB-DIO24/37 from Measurement Computing provides 24 logic level digital I/O lines for each USB port.
139.25 € (165.71 € gross)
33109
In Stock: 0
MCC USB-1608G: 250 kS/s High-Speed Multifunction USB DAQ Device
FPGA Module with Intel® Cyclone® 10 GX 10CX105-E5, 128 MByte DDR3L, 6 x 8 cm
FPGA Module with Intel® Cyclone® 10 GX 10CX220-I5, 2 GByte DDR3L, 6 x 8 cm
MPSoC Module with AMD Zynq™ UltraScale+™ ZU7EV-1E, 4 GByte DDR4, 5.2 x 7.6 cm
Heat Sink for Trenz Electronic Modules TE0720, spring-loaded embedded
Heat Sink for Trenz Electronic Modules TE0820/TE0821, spring-loaded embedded
MCC USB-1408FS-Plus: 14-bit, 48 kS/s Multifunction USB DAQ Device
MCC USB-1208LS: 12-bit, 1.2 kS/s Multifunction USB DAQ Device
CYC1000 with Intel® Cyclone® 10 LP 10CL025-C8, 8 MByte SDRAM, 8 MByte Flash,
FPGA Module with AMD Artix™ 7 50T-2I, 16 MByte Flash, 1.8V Config., 3 x 4 cm