Heat Sink for Trenz Electronic FPGA Modules TE0741 Revision 04 und 05
Microchip PolarFire® SoC FPGA 95T-1I, 1 GByte LPDDR4 SDRAM, 4 x 5 cm
Microchip PolarFire® SoC FPGA 25T-1I, 1 GByte LPDDR4 SDRAM, 4 x 5 cm
Microchip PolarFire® SoC FPGA 25T-FE, 1 GByte LPDDR4 SDRAM, 4 x 5 cm
MCC USB-DIO24/37: Digital I/O device with 24 channels
USB-DIO24/37 from Measurement Computing provides 24 logic level digital I/O lines for each USB port.
141.90 € (168.86 € gross)
33109
In Stock: 0
MCC USB-1608G: 250 kS/s High-Speed Multifunction USB DAQ Device
Heat Sink for Trenz Electronic Modules TE0820/TE0821, spring-loaded embedded
MCC USB-1408FS-Plus: 14-bit, 48 kS/s Multifunction USB DAQ Device
CYC1000 with Intel® Cyclone® 10 LP 10CL025-C8, 8 MByte SDRAM, 8 MByte Flash,
MAX1000 - IoT Maker Board, 8kLE, 8 MByte SDRAM, 8 MByte Flash, 6.15 x 2.5 cm
MAX1000 - IoT Maker Board, 16kLE, 32 MByte RAM, 8 MByte Flash, 6.15 x 2.5 cm
Ettus BasicRX for USRP N210: Daughterboard
The BasicRX daughterboard is a low-cost daughterboard that provides direct access to the ADC inputs.
151.43 € (180.20 € gross)
33055
In Stock: 0
MCC USB-1604HS-2AO: High-Speed, Simultaneous USB DAQ Device