Model Overview

 ModelForm factorSoCPin
Packages
RAMSPI FlashGraphic
Processing
Unit (GPU)
Video
Codec
Unit (VCU)
Temperature
range
TE0820-02-02CG-1EA 4 x 5 cm XCZU2CG-1SFVC784E 784 1 GByte DDR4 128 MByte - - extended
TE0820-02-03CG-1EA 4 x 5 cm XCZU3CG-1SFVC784E 784 1 GByte DDR4 128 MByte - - extended
TE0820-02-04CG-1EA 4 x 5 cm XCZU4CG-1SFVC784E 784 1 GByte DDR4 128 MByte - - extended
TE0820-02-02EG-1EA 4 x 5 cm XCZU2EG-1SFVC784E 784 1 GByte DDR4 128 MByte x - extended
TE0820-02-02EG-1EL 1) 4 x 5 cm XCZU2EG-1SFVC784E 784 1 GByte DDR4 128 MByte x - extended
TE0820-02-03EG-1EA 4 x 5 cm XCZU3EG-1SFVC784E 784 1 GByte DDR4 128 MByte x - extended
TE0820-02-03EG-1EL 2)
4 x 5 cm XCZU3EG-1SFVC784E 784 1 GByte DDR4 128 MByte x - extended
TE0820-03-04EV-1EA 4 x 5 cm XCZU4EV-1SFVC784E 784 1 GByte DDR4 128 MByte x x extended

1) Identical to variant TE0820-xx-02EG-1EA, except the 2.5 mm Samtec connectors.

2) Identical to variant TE0820-xx-03EG-1EA, except the 2.5 mm Samtec connectors.

 Model Form factor SoC Pin Packages RAM SPI Flash Graphic Processing Unit (GPU) Video Codec Unit (VCU) Temperature range TE0820-02-02CG-1EA 4 x 5 cm XC ZU2CG... read more »
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Model Overview
 ModelForm factorSoCPin
Packages
RAMSPI FlashGraphic
Processing
Unit (GPU)
Video
Codec
Unit (VCU)
Temperature
range
TE0820-02-02CG-1EA 4 x 5 cm XCZU2CG-1SFVC784E 784 1 GByte DDR4 128 MByte - - extended
TE0820-02-03CG-1EA 4 x 5 cm XCZU3CG-1SFVC784E 784 1 GByte DDR4 128 MByte - - extended
TE0820-02-04CG-1EA 4 x 5 cm XCZU4CG-1SFVC784E 784 1 GByte DDR4 128 MByte - - extended
TE0820-02-02EG-1EA 4 x 5 cm XCZU2EG-1SFVC784E 784 1 GByte DDR4 128 MByte x - extended
TE0820-02-02EG-1EL 1) 4 x 5 cm XCZU2EG-1SFVC784E 784 1 GByte DDR4 128 MByte x - extended
TE0820-02-03EG-1EA 4 x 5 cm XCZU3EG-1SFVC784E 784 1 GByte DDR4 128 MByte x - extended
TE0820-02-03EG-1EL 2)
4 x 5 cm XCZU3EG-1SFVC784E 784 1 GByte DDR4 128 MByte x - extended
TE0820-03-04EV-1EA 4 x 5 cm XCZU4EV-1SFVC784E 784 1 GByte DDR4 128 MByte x x extended

1) Identical to variant TE0820-xx-02EG-1EA, except the 2.5 mm Samtec connectors.

2) Identical to variant TE0820-xx-03EG-1EA, except the 2.5 mm Samtec connectors.

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MPSoC Module with Xilinx Zynq UltraScale+ ZU4EV-1E, 1 GByte DDR4 SDRAM, 4 x 5 cm
MPSoC Module with Xilinx Zynq UltraScale+ ZU4EV-1E, 1 GByte DDR4 SDRAM, 4 x 5 cm
The Trenz Electronic TE0820-03-04EV-1EA is an industrial-grade MPSoC module integrating a Xilinx Zynq UltraScale+, 1 GByte DDR4 SDRAM with 32-Bit width, 128 MByte Flash memory for configuration and operation, and powerful switch-mode...
From € 401,40 *
TE0820-03-04EV-1EA
In Stock: 0
MPSoC Module with Xilinx Zynq UltraScale+ ZU2EG-1E, 1 GByte DDR4 SDRAM, 4 x 5 cm
MPSoC Module with Xilinx Zynq UltraScale+ ZU2EG-1E, 1 GByte DDR4 SDRAM, 4 x 5 cm
Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E, 1 GByte DDR4, 128 MByte SPI Boot Flash, 4 GByte e.MMC
From € 179,40 *
TE0820-02-02EG-1EA
In Stock: 0
MPSoC Module with Xilinx Zynq UltraScale+ ZU2CG-1E, 1 GByte DDR4 SDRAM, 4 x 5 cm
MPSoC Module with Xilinx Zynq UltraScale+ ZU2CG-1E, 1 GByte DDR4 SDRAM, 4 x 5 cm
Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E, 1 GByte DDR4, 128 MByte SPI Boot Flash, 4 GByte e.MMC
From € 161,40 *
TE0820-02-02CG-1EA
In Stock: 0
MPSoC Module with Xilinx Zynq UltraScale+ ZU4CG-1E, 1 GByte DDR4 SDRAM, 4 x 5 cm
MPSoC Module with Xilinx Zynq UltraScale+ ZU4CG-1E, 1 GByte DDR4 SDRAM, 4 x 5 cm
Xilinx Zynq UltraScale+ XCZU4CG-1SFVC784E, 1 GByte DDR4, 128 MByte SPI Boot Flash, 4 GByte e.MMC
From € 329,40 *
TE0820-02-04CG-1EA
In Stock: 0
MPSoC Module with Xilinx Zynq UltraScale+ ZU3EG-1E, 1 GByte DDR4 SDRAM, 4 x 5 cm
MPSoC Module with Xilinx Zynq UltraScale+ ZU3EG-1E, 1 GByte DDR4 SDRAM, 4 x 5 cm
Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E, 1 GByte DDR4, 128 MByte SPI Boot Flash, 4 GByte e.MMC
From € 221,40 *
TE0820-02-03EG-1EA
In Stock: 0
MPSoC Module with Xilinx Zynq UltraScale+ ZU3CG-1E, 1 GByte DDR4 SDRAM, 4 x 5 cm
MPSoC Module with Xilinx Zynq UltraScale+ ZU3CG-1E, 1 GByte DDR4 SDRAM, 4 x 5 cm
Xilinx Zynq UltraScale+ XCZU3CG-1SFVC784E, 1 GByte DDR4, 128 MByte SPI Boot Flash, 4 GByte e.MMC
From € 191,40 *
TE0820-02-03CG-1EA
In Stock: 0
MPSoC Module with Xilinx Zynq UltraScale+ ZU2EG-1E, 1 GByte DDR4, 4 x 5 cm, LP
MPSoC Module with Xilinx Zynq UltraScale+ ZU2EG-1E, 1 GByte DDR4, 4 x 5 cm, LP
Low Profile, Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E, 1 GByte DDR4, 128 MByte SPI Boot Flash, 4 GByte e.MMC
From € 185,40 *
TE0820-02-02EG-1EL
In Stock: 0
MPSoC Module with Xilinx Zynq UltraScale+ ZU3EG-1E, 1 GByte DDR4, 4 x 5 cm, LP
MPSoC Module with Xilinx Zynq UltraScale+ ZU3EG-1E, 1 GByte DDR4, 4 x 5 cm, LP
Low Profile, Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E, 1 GByte DDR4, 128 MByte SPI Boot Flash, 4 GByte e.MMC
From € 221,40 *
TE0820-02-03EG-1EL
In Stock: 0
Heatsink for Trenz Electronic Module TE0820
Heatsink for Trenz Electronic Module TE0820
The BGA-STD-045 is a 23 x 23 x 18mm standard Heat Sink with thermal tape. This heat sink is made of aluminium with black anodized finish and vertically mounted fin. This BGA series heat sink is suitable for use with ball grid array....
From € 2,18 *
28606
In Stock: 0