Model Overview

 ModelForm factorSoCPin
Packages
RAMSPI FlashGraphic
Processing
Unit (GPU)
Video
Codec
Unit (VCU)
Temperature
range
TE0820-03-02CG-1EA 4 x 5 cm XCZU2CG-1SFVC784E 784 2 GByte DDR4 128 MByte - - extended
TE0820-03-03CG-1EA 4 x 5 cm XCZU3CG-1SFVC784E 784 2 GByte DDR4 128 MByte - - extended
TE0820-03-04CG-1EA 4 x 5 cm XCZU4CG-1SFVC784E 784 2 GByte DDR4 128 MByte - - extended
TE0820-03-02EG-1EA 4 x 5 cm XCZU2EG-1SFVC784E 784 2 GByte DDR4 128 MByte x - extended
TE0820-03-2BE21FL 1) 4 x 5 cm XCZU3EG-1SFVC784E 784 2 GByte DDR4 128 MByte x - extended
TE0820-03-03EG-1EA 4 x 5 cm XCZU3EG-1SFVC784E 784 2 GByte DDR4 128 MByte x - extended
TE0820-03-3BE21FL 1)
4 x 5 cm XCZU3EG-1SFVC784E 784 2 GByte DDR4 128 MByte x - extended
TE0820-03-04EV-1EA 4 x 5 cm XCZU4EV-1SFVC784E 784 2 GByte DDR4 128 MByte x x extended

1) Identical to variant TE0820-xx-02EG-1EA/TE0820-xx-03EG-1EA, except the 2.5 mm Samtec connectors

 Model Form factor SoC Pin Packages RAM SPI Flash Graphic Processing Unit (GPU) Video Codec Unit (VCU) Temperature range TE0820-03-02CG-1EA 4 x 5 cm XC ZU2CG... read more »
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Model Overview
 ModelForm factorSoCPin
Packages
RAMSPI FlashGraphic
Processing
Unit (GPU)
Video
Codec
Unit (VCU)
Temperature
range
TE0820-03-02CG-1EA 4 x 5 cm XCZU2CG-1SFVC784E 784 2 GByte DDR4 128 MByte - - extended
TE0820-03-03CG-1EA 4 x 5 cm XCZU3CG-1SFVC784E 784 2 GByte DDR4 128 MByte - - extended
TE0820-03-04CG-1EA 4 x 5 cm XCZU4CG-1SFVC784E 784 2 GByte DDR4 128 MByte - - extended
TE0820-03-02EG-1EA 4 x 5 cm XCZU2EG-1SFVC784E 784 2 GByte DDR4 128 MByte x - extended
TE0820-03-2BE21FL 1) 4 x 5 cm XCZU3EG-1SFVC784E 784 2 GByte DDR4 128 MByte x - extended
TE0820-03-03EG-1EA 4 x 5 cm XCZU3EG-1SFVC784E 784 2 GByte DDR4 128 MByte x - extended
TE0820-03-3BE21FL 1)
4 x 5 cm XCZU3EG-1SFVC784E 784 2 GByte DDR4 128 MByte x - extended
TE0820-03-04EV-1EA 4 x 5 cm XCZU4EV-1SFVC784E 784 2 GByte DDR4 128 MByte x x extended

1) Identical to variant TE0820-xx-02EG-1EA/TE0820-xx-03EG-1EA, except the 2.5 mm Samtec connectors

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MPSoC Module with Xilinx Zynq UltraScale+ ZU2EG-1E, 2 GByte DDR4, 4 x 5 cm, LP
MPSoC Module with Xilinx Zynq UltraScale+ ZU2EG-1E, 2 GByte DDR4, 4 x 5 cm, LP
Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 8 GByte e.MMC
From 185.40 € (220.63 € gross) *
TE0820-03-2BE21FL
In Stock: 0
MPSoC Module with Xilinx Zynq UltraScale+ ZU3EG-1E, 2 GByte DDR4, 4 x 5 cm, LP
MPSoC Module with Xilinx Zynq UltraScale+ ZU3EG-1E, 2 GByte DDR4, 4 x 5 cm, LP
Low profile connectors (2.5 mm), Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 4 GByte e.MMC, size: 4 x 5 cm
From 221.40 € (263.47 € gross) *
TE0820-03-3BE21FL
In Stock: 0
MPSoC Module with Xilinx Zynq UltraScale+ ZU3EG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm
MPSoC Module with Xilinx Zynq UltraScale+ ZU3EG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm
Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 4 GByte e.MMC, size: 4 x 5 cm
From 221.40 € (263.47 € gross) *
TE0820-03-03EG-1EA
In Stock: 0
MPSoC Module with Xilinx Zynq UltraScale+ ZU2EG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm
MPSoC Module with Xilinx Zynq UltraScale+ ZU2EG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm
Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 4 GByte e.MMC, size: 4 x 5 cm
From 179.40 € (213.49 € gross) *
TE0820-03-02EG-1EA
In Stock: 40
MPSoC-Module with Xilinx Zynq UltraScale+ ZU3CG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm
MPSoC-Module with Xilinx Zynq UltraScale+ ZU3CG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm
Xilinx Zynq UltraScale+ XCZU3CG-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 4 GByte e.MMC, size: 4 x 5 cm
From 191.40 € (227.77 € gross) *
TE0820-03-03CG-1EA
In Stock: 4
MPSoC Module with Xilinx Zynq UltraScale+ ZU2CG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm
MPSoC Module with Xilinx Zynq UltraScale+ ZU2CG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm
Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 4 GByte e.MMC, size: 4 x 5 cm
From 161.40 € (192.07 € gross) *
TE0820-03-02CG-1EA
In Stock: 0
Trenz Electronic TE0820-03-04CG-1EA, MPSoC-Modul mit Xilinx Zynq UltraScale+ ZU4CG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm
MPSoC Module with Xilinx Zynq UltraScale+ ZU4CG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm
Xilinx Zynq UltraScale+ XCZU4CG-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 4 GByte e.MMC, size: 4 x 5 cm
From 329.40 € (391.99 € gross) *
TE0820-03-04CG-1EA
In Stock: 0
MPSoC Module with Xilinx Zynq UltraScale+ ZU4EV-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm
MPSoC Module with Xilinx Zynq UltraScale+ ZU4EV-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm
Xilinx Zynq UltraScale+XCZU4EV-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 4 GByte e.MMC, size: 4 x 5 cm
From 401.40 € (477.67 € gross) *
TE0820-03-04EV-1EA
In Stock: 0
Heatsink for Trenz Electronic Module TE0820/TE0841
Heatsink for Trenz Electronic Module TE0820/TE0841
The BGA-STD-045 is a 23 x 23 x 18 mm standard Heat Sink with thermal tape. This heat sink is made of aluminium with black anodized finish and vertically mounted fin. This BGA series heat sink is suitable for use with ball grid array....
From 2.18 € (2.59 € gross) *
28606
In Stock: 6