MPSoC Module with Xilinx Zynq UltraScale+ ZU2EG-1E, 2 GByte DDR4, 4 x 5 cm, LP
Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 8 GByte e.MMC
From 185.40 € (220.63 € gross)
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TE0820-03-2BE21FL
In Stock: 0
MPSoC Module with Xilinx Zynq UltraScale+ ZU3EG-1E, 2 GByte DDR4, 4 x 5 cm, LP
Low profile connectors (2.5 mm), Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 4 GByte e.MMC, size: 4 x 5 cm
From 221.40 € (263.47 € gross)
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TE0820-03-3BE21FL
In Stock: 0
MPSoC Module with Xilinx Zynq UltraScale+ ZU3EG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm
Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 4 GByte e.MMC, size: 4 x 5 cm
From 221.40 € (263.47 € gross)
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TE0820-03-03EG-1EA
In Stock: 0
MPSoC Module with Xilinx Zynq UltraScale+ ZU2EG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm
Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 4 GByte e.MMC, size: 4 x 5 cm
From 179.40 € (213.49 € gross)
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TE0820-03-02EG-1EA
In Stock: 40
MPSoC-Module with Xilinx Zynq UltraScale+ ZU3CG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm
Xilinx Zynq UltraScale+ XCZU3CG-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 4 GByte e.MMC, size: 4 x 5 cm
From 191.40 € (227.77 € gross)
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TE0820-03-03CG-1EA
In Stock: 4
MPSoC Module with Xilinx Zynq UltraScale+ ZU2CG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm
Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 4 GByte e.MMC, size: 4 x 5 cm
From 161.40 € (192.07 € gross)
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TE0820-03-02CG-1EA
In Stock: 0
MPSoC Module with Xilinx Zynq UltraScale+ ZU4CG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm
Xilinx Zynq UltraScale+ XCZU4CG-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 4 GByte e.MMC, size: 4 x 5 cm
From 329.40 € (391.99 € gross)
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TE0820-03-04CG-1EA
In Stock: 0
MPSoC Module with Xilinx Zynq UltraScale+ ZU4EV-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm
Xilinx Zynq UltraScale+XCZU4EV-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 4 GByte e.MMC, size: 4 x 5 cm
From 401.40 € (477.67 € gross)
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TE0820-03-04EV-1EA
In Stock: 0
Heatsink for Trenz Electronic Module TE0820/TE0841
The BGA-STD-045 is a 23 x 23 x 18 mm standard Heat Sink with thermal tape. This heat sink is made of aluminium with black anodized finish and vertically mounted fin. This BGA series heat sink is suitable for use with ball grid array....
From 2.18 € (2.59 € gross)
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28606
In Stock: 6