Trenz Electronic TE0823 MPSoC Modules with Xilinx Zynq UltraScale+

 ModelForm factorSoCPin
Packages
RAMQSPI
Flash
Temperature
range
TE0823-01-3PIU1MA 4 x 5 cm XCZU3CG-L1SFVC784 784 1 GB LPDDR4 128 MB industrial
TE0823-01-3PIU1ML 1) 4 x 5 cm XCZU3CG-L1SFVC784 784 1 GB LPDDR4 128 MB industrial

1) This module is identical with TE0823-01-3PIU1MA except the lower Samtec connectors.

 Model Form factor SoC Pin Packages RAM QSPI Flash Temperature range TE0823-01-3PIU1MA 4 x 5 cm XC ZU3CG -L1SFVC784 784 1 GB LPDDR4 128 MB industrial... read more »
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Trenz Electronic TE0823 MPSoC Modules with Xilinx Zynq UltraScale+
 ModelForm factorSoCPin
Packages
RAMQSPI
Flash
Temperature
range
TE0823-01-3PIU1MA 4 x 5 cm XCZU3CG-L1SFVC784 784 1 GB LPDDR4 128 MB industrial
TE0823-01-3PIU1ML 1) 4 x 5 cm XCZU3CG-L1SFVC784 784 1 GB LPDDR4 128 MB industrial

1) This module is identical with TE0823-01-3PIU1MA except the lower Samtec connectors.

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MPSoC Module with Xilinx Zynq UltraScale+ 3CG-L1I, 1 GByte LPDDR4, 4 x 5 cm, LP
MPSoC Module with Xilinx Zynq UltraScale+ 3CG-L1I, 1 GByte LPDDR4, 4 x 5 cm, LP
Low Profile connectors (2.5 mm), Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I, 1 GByte LPDDR4, 128 MByte Flash, 8 GByte e.MMC, size: 4 x 5 cm
384.58 € (457.65 € gross)
TE0823-01-3PIU1ML
In Stock: 0
MPSoC Module with Xilinx Zynq UltraScale+ 3CG-L1I, 1 GByte LPDDR4, 4 x 5 cm
MPSoC Module with Xilinx Zynq UltraScale+ 3CG-L1I, 1 GByte LPDDR4, 4 x 5 cm
With low power FPGA Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I, 1 GByte LPDDR4 SDRAM, 128 MByte QSPI Boot Flash, 8 GByte e.MMC, size: 4 x 5 cm
384.58 € (457.65 € gross)
TE0823-01-3PIU1MA
In Stock: 0
Heat Sink for Trenz Electronic Modules TE082x/TE0841
Heat Sink for Trenz Electronic Modules TE082x/TE0841
Standard heat sink for TE0820, TE0821, TE0823 and TE0841 with thermopad made of black anodised aluminium with vertically mounted lamella.
2.90 € (3.45 € gross)
28606
In Stock: 118