Model Overview

 ModelForm factorSoCPin
Packages
RAMQSPI
Flash
Temperature
range
TE0823-01-3PIU1FA 4 x 5 cm XCZU3CG-L1SFVC784 784 1 GB LPDDR4 128 MB industrial
TE0823-01-3PIU1FL 1) 4 x 5 cm XCZU3CG-L1SFVC784 784 1 GB LPDDR4 128 MB industrial

1) This module is identical with TE0823-01-3PIU1FA except the lower Samtec connectors.

 Model Form factor SoC Pin Packages RAM QSPI Flash Temperature range TE0823-01-3PIU1FA 4 x 5 cm XC ZU3CG -L1SFVC784 784 1 GB LPDDR4 128 MB industrial... read more »
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Model Overview
 ModelForm factorSoCPin
Packages
RAMQSPI
Flash
Temperature
range
TE0823-01-3PIU1FA 4 x 5 cm XCZU3CG-L1SFVC784 784 1 GB LPDDR4 128 MB industrial
TE0823-01-3PIU1FL 1) 4 x 5 cm XCZU3CG-L1SFVC784 784 1 GB LPDDR4 128 MB industrial

1) This module is identical with TE0823-01-3PIU1FA except the lower Samtec connectors.

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Trenz Electronic TE0823 - MPSoC Module with Xilinx Zynq UltraScale+ 3CG-L1I, 1 GByte LPDDR4, 4 x 5 cm, Low Profile
MPSoC Module with Xilinx Zynq UltraScale+ 3CG-L1I, 1 GByte LPDDR4, 4 x 5 cm, LP
Low Profile connectors (2.5 mm), Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I, 1 GByte LPDDR4, 128 MByte Flash, 8 GByte e.MMC, size: 4 x 5 cm
From 327.63 € (380.05 € gross) *
TE0823-01-3PIU1FL
In Stock: 0
MPSoC Module with Xilinx Zynq UltraScale+ 3CG-L1I, 1 GByte LPDDR4, 4 x 5 cm
MPSoC Module with Xilinx Zynq UltraScale+ 3CG-L1I, 1 GByte LPDDR4, 4 x 5 cm
With low power FPGA Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I, 1 GByte LPDDR4 SDRAM, 128 MByte QSPI Boot Flash, 8 GByte e.MMC, size: 4 x 5 cm
From 327.63 € (380.05 € gross) *
TE0823-01-3PIU1FA
In Stock: 81
Heat Sink for Trenz Electronic Modules TE082x/TE0841
Heat Sink for Trenz Electronic Modules TE082x/TE0841
Standard heat sink for TE0820, TE0821, TE0823 and TE0841 with thermopad made of black anodised aluminium with vertically mounted lamella.
2.90 € (3.36 € gross) *
28606
In Stock: 12