UltraSOM+ MPSoC Module with Zynq UltraScale+ XCZU9EG-1FFVC900E, 4 GByte DDR4
The Trenz Electronic TE0808-04-9BE21-A is a MPSoC module integrating a Xilinx Zynq UltraScale+ ZU9EG, 4 GByte DDR4 SDRAM with 64-Bit width, 128 MByte Flash memory for configuration and operation, 20 high speed serial transceivers, and...
From 699.30 € (832.17 € gross)
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TE0808-04-9BE21-A
In Stock: 0
MPSoC Module with Xilinx Zynq UltraScale+ ZU3EG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm
Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 8 GByte e.MMC, size: 4 x 5 cm
From 221.40 € (263.47 € gross)
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TE0820-03-3BE21FA
In Stock: 0
MPSoC Module with Xilinx Zynq UltraScale+ ZU5EV-1E, 2 GByte DDR4, 5.2 x 7.6 cm
Xilinx Zynq UltraScale+ XCZU5EV-1SFVC784E, 2 GByte DDR4, 128 MByte QSPI Boot Flash, size: 5.2 x 7.6 cm
From 599.40 € (713.29 € gross)
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TE0803-03-5DE11-A
In Stock: 0
MPSoC Module with Xilinx Zynq UltraScale+ ZU2EG-1E, 2 GByte DDR4, 4 x 5 cm, LP
Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 8 GByte e.MMC
From 185.40 € (220.63 € gross)
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TE0820-03-2BE21FL
In Stock: 0
Heat Spreader for Trenz Electronic MPSoC TE0807
Cooling solution especially desgined for Trenz Electronic MPSoC TE0807 (from REV02). Important note: This heatsink requires a so-called gapfiller to be installed to the module.
29.00 € (34.51 € gross)
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KK0807-02
In Stock: 0
UltraITX+ Baseboard for Trenz Electronic TE080X UltraSOM+
The Trenz Electronic TEBF0808 carrier board is a baseboard for the Xilinx Zynq Ultrascale+ MPSoC modules TE0803, TE0807 und TE0808
From 479.40 € (570.49 € gross)
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TEBF0808-04A
In Stock: 0
MPSoC Module with Xilinx Zynq UltraScale+ ZU3EG-1E, 2 GByte DDR4, 5.2 x 7.6 cm
Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E, 2 GByte DDR4, 128 MByte QSPI Boot Flash, size: 5.2 x 7.6 cm
From 239.40 € (284.89 € gross)
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TE0803-03-3BE11-A
In Stock: 0
MPSoC Module with Xilinx Zynq UltraScale+ ZU3EG-1E, 2 GByte DDR4, 4 x 5 cm, LP
Low profile connectors (2.5 mm), Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 8 GByte e.MMC, size: 4 x 5 cm
From 221.40 € (263.47 € gross)
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TE0820-03-3BE21FL
In Stock: 0
MPSoC Module with Xilinx Zynq UltraScale+ ZU2CG-1E, 2 GByte DDR4, 5.2 x 7.6 cm
Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E, 2 GByte DDR4, 128 MByte QSPI Boot Flash, size: 5.2 x 7.6 cm
From 179.40 € (213.49 € gross)
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TE0803-03-2AE11-A
In Stock: 0
MPSoC-Module with Xilinx Zynq UltraScale+ ZU2EG-1E, 2 GByte DDR4, 5.2 x 7.6 cm
Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E, 2 GByte DDR4, 128 MByte QSPI Boot Flash, size: 5.2 x 7.6 cm
From 203.40 € (242.05 € gross)
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TE0803-03-2BE11-A
In Stock: 0
TE0803-03-3BE11-AS Starter Kit with Zynq UltraScale+ FPGA Module
MPSoC module TE0803 ZU03EG with pre-assembled heatsink on a TEBF0808 baseboard in a Core V1 Mini-ITX enclosure + accessories
From 769.30 € (915.47 € gross)
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TE0803-03-3BE11-AS
In Stock: 0
MPSoC Module with Xilinx Zynq UltraScale+ ZU4EV-1E, 4 GByte DDR4, 5.2x7.6 cm, LP
Samtec Razor Beam low profile (1 mm) slim socket strips, Xilinx Zynq UltraScale+ XCZU4EV-1SFVC784E, 4 GByte DDR4, 128 MByte QSPI Boot Flash, size: 5.2 x 7.6 cm
From 407.40 € (484.81 € gross)
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TE0803-03-4DE21-L
In Stock: 21
MPSoC Module with Xilinx Zynq UltraScale+ ZU4EV-1E, 2 GByte DDR4, 5.2 x 7.6 cm
Xilinx Zynq UltraScale+ XCZU4EV-1SFVC784E, 2 GByte DDR4, 128 MByte QSPI Boot Flash, size: 5.2 x 7.6 cm
From 389.40 € (463.39 € gross)
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TE0803-03-4DE11-A
In Stock: 0
MPSoC Module with Xilinx Zynq UltraScale+ ZU4EG-1E, 2 GByte DDR4, 5.2 x 7.6 cm
Xilinx Zynq UltraScale+ XCZU4EG-1SFVC784E, 2 GByte DDR4, 128 MByte QSPI Boot Flash, size: 5.2 x 7.6 cm
From 341.40 € (406.27 € gross)
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TE0803-03-4BE11-A
In Stock: 0
MPSoC-Module with Xilinx Zynq UltraScale+ ZU3CG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm
Xilinx Zynq UltraScale+ XCZU3CG-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 4 GByte e.MMC, size: 4 x 5 cm
From 191.40 € (227.77 € gross)
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TE0820-03-03CG-1EA
In Stock: 1
MPSoC Module with Xilinx Zynq UltraScale+ ZU2EG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm
Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 4 GByte e.MMC, size: 4 x 5 cm
From 179.40 € (213.49 € gross)
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TE0820-03-02EG-1EA
In Stock: 12
MPSoC Module with Xilinx Zynq UltraScale+ ZU2CG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm
Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 4 GByte e.MMC, size: 4 x 5 cm
From 161.40 € (192.07 € gross)
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TE0820-03-02CG-1EA
In Stock: 24
MPSoC Module with Xilinx Zynq UltraScale+ ZU4CG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm
Xilinx Zynq UltraScale+ XCZU4CG-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 4 GByte e.MMC, size: 4 x 5 cm
From 329.40 € (391.99 € gross)
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TE0820-03-04CG-1EA
In Stock: 15
UltraSOM+ MPSoC Module with Zynq UltraScale+ ZU6EG and mounted Heat Spreader
MPSoC with integrated Xilinx Zynq UltraScale+ XCZU6EG-1FFVC900E and mounted heat spreader; 4 GByte DDR4 SDRAM; size: 5,2 x 7,6 cm
From 654.50 € (778.86 € gross)
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TE0808-04-06EG-1EK
In Stock: 0
UltraSOM+ MPSoC Module with Zynq UltraScale+ ZU9EG and mounted Heat Spreader
Xilinx Zynq UltraScale+ XCZU09EG-1FFVC900E, 52 x 76 mm form factor, 4 GByte DDR4 SDRAM, 128 MByte SPI Boot Flash, 20 x high speed serial transceiver
From 724.50 € (862.16 € gross)
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TE0808-04-09EG-1EK
In Stock: 0
UltraSOM+ MPSoC Module with Zynq UltraScale+ ZU15EG and mounted Heat Spreader
Xilinx Zynq UltraScale+ XCZU15EG-1FFVC900E, 52 x 76 mm form factor, 4 GByte DDR4 SDRAM, 128 MByte SPI Boot Flash, 20 x serial transceiver
From 834.00 € (992.46 € gross)
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TE0808-04-15EG-1EK
In Stock: 0
MPSoC Module with Xilinx Zynq UltraScale+ ZU4CG-1E, 2 GByte DDR4, 5.2 x 7.6 cm
Xilinx Zynq UltraScale+ XCZU4CG-1SFVC784E, 2 GByte DDR4, 128 MByte QSPI Boot Flash, Size: 5.2 x 7.6 cm
From 329.40 € (391.99 € gross)
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TE0803-02-04CG-1EA
In Stock: 9
MPSoC Module with Xilinx Zynq UltraScale+ ZU7EV, 4 GByte DDR4
Xilinx Zynq UltraScale+ XCZU7EV-1FBVB900E; 4 GByte DDR4; 128 MByte QSPI Boot Flash; Dimension: 5,2 x 7,6 cm
From 840.00 € (999.60 € gross)
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TE0807-02-07EV-1E
In Stock: 22
Heatsink maxiGRIP 23 x 23 x 19.5 mm for TE0803
BGA Heat Sink - High Performance, maxiFLOW/maxiGRIP-Low Profile Heat Sink Type: maxiFLOW Heat Sink Attachment: maxiGRIP The heat sink maxiGRIP has been specially modified for the TE0803 module. Features maxiFLOW™ design features a low...
11.18 € (13.30 € gross)
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28174
In Stock: 0
MPSoC Module with Xilinx Zynq UltraScale+ ZU4EV-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm
Xilinx Zynq UltraScale+XCZU4EV-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 4 GByte e.MMC, size: 4 x 5 cm
From 401.40 € (477.67 € gross)
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TE0820-03-04EV-1EA
In Stock: 0
UltraSOM+ MPSoC Module with Zynq UltraScale+ XCZU6EG-1FFVC900E, 4 GB DDR4
MPSoC with integrated Xilinx Zynq UltraScale+ XCZU6EG-1FFVC900E; 4 GByte DDR4 SDRAM; 128 MByte Flash memory; 52 x 76 mm form factor; 20 high speed serial transceivers
From 629.30 € (748.87 € gross)
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TE0808-04-06EG-1EE
In Stock: 0
UltraSOM+ MPSoC Module with Zynq UltraScale+ XCZU15EG-1FFVC900E, 4 GB DDR4
Xilinx Zynq UltraScale+ XCZU15EG-1FFVC900E, 52 x 76 mm form factor, 4 GByte DDR4 SDRAM, 128 MByte SPI Boot Flash, 20 x serial transceiver
From 809.40 € (963.19 € gross)
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TE0808-04-15EG-1EE
In Stock: 0
TE0808-04-09-1EE-S Starter Kit
TE0808 MPSoC module with ZU9EG plus heatsink on a TEBF0808 carrier board in a Core Mini-ITX Enclosure. Accessories included.
From 1,199.40 € (1,427.29 € gross)
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TE0808-04-09-1EE-S
In Stock: 0
TE0808-04-09-2IE-S Starter Kit
MPSoC module TE0808 ZU9EG with pre-assembled heatsink on a TEBF0808 baseboard in a Core V1 Mini-ITX enclosure plus accesssories.
From 1,749.30 € (2,081.67 € gross)
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TE0808-04-09-2IE-S
In Stock: 0
UltraSOM+ MPSoC Module with Zynq UltraScale+ XCZU9EG-2FFVC900I, 4 GB DDR4
Xilinx Zynq UltraScale+ XCZU9EG-2FFVC900I, 52 x 76 mm form factor, 4 GByte DDR4 SDRAM, 128 MByte SPI Boot Flash, 20 x high-speed serial transceiver
From 1,049.30 € (1,248.67 € gross)
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TE0808-04-09EG-2IE
In Stock: 0
UltraSOM+ MPSoC Module with Zynq UltraScale+ XCZU9EG, 4 GByte DDR4, low profile
Low Profile Terminal/Socket Strips (1 mm), Xilinx Zynq UltraScale+ XCZU9EG-1FFVC900E, 4 GByte DDR4 SDRAM, 128 MByte SPI Boot Flash, 20 x high speed serial transceiver
From 769.30 € (915.47 € gross)
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TE0808-04-09EG-1EL
In Stock: 2
MPSoC Module with Xilinx Zynq UltraScale+ ZU3CG-1E, 2 GByte DDR4, 5.2 x 7.6 cm
Xilinx Zynq UltraScale+ XCZU3CG-1SFVC784E, 2 GByte DDR4, 128 MByte QSPI Boot Flash, Dimension: 5.2 x 7.6 cm
From 239.40 € (284.89 € gross)
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TE0803-01-03CG-1EA
In Stock: 12
Heatsink for Trenz Electronic Module TE0820/TE0841
The BGA-STD-045 is a 23 x 23 x 18 mm standard Heat Sink with thermal tape. This heat sink is made of aluminium with black anodized finish and vertically mounted fin. This BGA series heat sink is suitable for use with ball grid array....
From 2.18 € (2.59 € gross)
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28606
In Stock: 0
Heat Spreader for Trenz Electronic MPSoC TE0808
Cooling solution especially desgined for Trenz Electronic module TE0808 from REV03
29.00 € (34.51 € gross)
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KK0808-03
In Stock: 0
Test Board for TE0808 and TE0803
Testboard for TE0808-02 and -03 plus TE0803-01
From 97.30 € (115.79 € gross)
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TEBT0808-01
In Stock: 1