Model Overview

 ModelForm factorSoCPin
Packages
RAMSPI FlashGraphic
Processing
Unit (GPU)
Video
Codec
Unit (VCU)
Temperature
range
TE0803-02-02CG-1EA 5.2 x 7.6 cm XCZU2CG-1SFVC784E 784 2 GByte DDR4 128 MByte - - extended
TE0803-01-03CG-1EA 5.2 x 7.6 cm XCZU3CG-1SFVC784E 784 2 GByte DDR4 128 MByte - - extended
TE0803-02-04CG-1EB 5.2 x 7.6 cm XCZU4CG-1SFVC784E 784 2 GByte DDR4 256 MByte - - extended
TE0803-02-04CG-1EA 5.2 x 7.6 cm XCZU4CG-1SFVC784E 784 2 GByte DDR4 128 MByte - - extended
TE0803-01-02EG-1EA 5.2 x 7.6 cm XCZU2EG-1SFVC784E 784 2 GByte DDR4 64 MByte x - extended
TE0803-02-03EG-1EA 5.2 x 7.6 cm XCZU3EG-1SFVC784E 784 2 GByte DDR4 128 MByte x - extended
TE0803-02-03EG-1EB 5.2 x 7.6 cm XCZU3EG-1SFVC784E 784 4 GByte DDR4 128 MByte x - extended
TE0803-02-04EG-1EA 5.2 x 7.6 cm XCZU4EG-1SFVC784E 784 2 GByte DDR4 128 MByte x - extended
TE0803-02-04EV-1EA 5.2 x 7.6 cm XCZU4EV-1SFVC784E 784 2 GByte DDR4 128 MByte x x extended
TE0803-02-04EV-1EA1) 5.2 x 7.6 cm XCZU4EV-1SFVC784E 784 4 GByte DDR4 128 MByte x x extended
TE0803-02-05EV-1EA 5.2 x 7.6 cm XCZU5EV-1SFVC784E 784 2 GByte DDR4 128 MByte x x extended
TE0807-02-07EV-1E 5.2 x 7.6 cm XCZU7EV-1FBVB900E 900 4 GByte DDR4 128 MByte x x extended
TE0808-04-06EG-1EE 5.2 x 7.6 cm XCZU6EG-1FFVC900E 900 4 GByte DDR4 128 MByte x - extended
TE0808-04-09EG-1EE 5.2 x 7.6 cm XCZU9EG-1FFVC900E 900 4 GByte DDR4 128 MByte x - extended
TE0808-04-09EG-1EL 1) 5.2 x 7.6 cm XCZU9EG-1FFVC900E 900 4 GByte DDR4 128 MByte x - extended
TE0808-04-09EG-2IE 5.2 x 7.6 cm XCZU9EG-2FFVC900I 900 4 GByte DDR4 128 MByte x - industrial
TE0808-04-15EG-1EE
5.2 x 7.6 cm XCZU15EG-1FFVC900E 900 4 GByte DDR4 128 MByte x - extended
TE0820-03-02CG-1ED 4 x 5 cm XCZU2CG-1SFVC784E 784 2 GByte DDR4 128 MByte - - extended
TE0820-03-03CG-1ED 4 x 5 cm XCZU3CG-1SFVC784E 784 2 GByte DDR4 128 MByte - - extended
TE0820-02-04CG-1ED 4 x 5 cm XCZU4CG-1SFVC784E 784 1 GByte DDR4 128 MByte - - extended
TE0820-03-02EG-1ED 4 x 5 cm XCZU2EG-1SFVC784E 784 2 GByte DDR4 128 MByte x - extended
TE0820-03-02EG-1EL 2) 4 x 5 cm XCZU3EG-1SFVC784E 784 2 GByte DDR4 128 MByte x - extended
TE0820-03-03EG-1ED 4 x 5 cm XCZU3EG-1SFVC784E 784 2 GByte DDR4 128 MByte x - extended
TE0820-03-03EG-1EL 2)
4 x 5 cm XCZU3EG-1SFVC784E 784 1 GByte DDR4 128 MByte x - extended
TE0820-03-04EV-1EA 4 x 5 cm XCZU4EV-1SFVC784E 784 2 GByte DDR4 128 MByte x x extended

1) Identical to variant TE0808-xx-09EG-1EB/TE0803-xx-04EV-1EA, except the 1 mm Samtec connectors.

2) Identical to variant TE0820-xx-02EG-1EL/TE0820-xx-03EG-1EA except the 2.5 mm Samtec connectors.

 Model Form factor SoC Pin Packages RAM SPI Flash Graphic Processing Unit (GPU) Video Codec Unit (VCU) Temperature range TE0803-02-02CG-1EA 5.2 x 7.6 cm XC ZU2CG... read more »
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Model Overview
 ModelForm factorSoCPin
Packages
RAMSPI FlashGraphic
Processing
Unit (GPU)
Video
Codec
Unit (VCU)
Temperature
range
TE0803-02-02CG-1EA 5.2 x 7.6 cm XCZU2CG-1SFVC784E 784 2 GByte DDR4 128 MByte - - extended
TE0803-01-03CG-1EA 5.2 x 7.6 cm XCZU3CG-1SFVC784E 784 2 GByte DDR4 128 MByte - - extended
TE0803-02-04CG-1EB 5.2 x 7.6 cm XCZU4CG-1SFVC784E 784 2 GByte DDR4 256 MByte - - extended
TE0803-02-04CG-1EA 5.2 x 7.6 cm XCZU4CG-1SFVC784E 784 2 GByte DDR4 128 MByte - - extended
TE0803-01-02EG-1EA 5.2 x 7.6 cm XCZU2EG-1SFVC784E 784 2 GByte DDR4 64 MByte x - extended
TE0803-02-03EG-1EA 5.2 x 7.6 cm XCZU3EG-1SFVC784E 784 2 GByte DDR4 128 MByte x - extended
TE0803-02-03EG-1EB 5.2 x 7.6 cm XCZU3EG-1SFVC784E 784 4 GByte DDR4 128 MByte x - extended
TE0803-02-04EG-1EA 5.2 x 7.6 cm XCZU4EG-1SFVC784E 784 2 GByte DDR4 128 MByte x - extended
TE0803-02-04EV-1EA 5.2 x 7.6 cm XCZU4EV-1SFVC784E 784 2 GByte DDR4 128 MByte x x extended
TE0803-02-04EV-1EA1) 5.2 x 7.6 cm XCZU4EV-1SFVC784E 784 4 GByte DDR4 128 MByte x x extended
TE0803-02-05EV-1EA 5.2 x 7.6 cm XCZU5EV-1SFVC784E 784 2 GByte DDR4 128 MByte x x extended
TE0807-02-07EV-1E 5.2 x 7.6 cm XCZU7EV-1FBVB900E 900 4 GByte DDR4 128 MByte x x extended
TE0808-04-06EG-1EE 5.2 x 7.6 cm XCZU6EG-1FFVC900E 900 4 GByte DDR4 128 MByte x - extended
TE0808-04-09EG-1EE 5.2 x 7.6 cm XCZU9EG-1FFVC900E 900 4 GByte DDR4 128 MByte x - extended
TE0808-04-09EG-1EL 1) 5.2 x 7.6 cm XCZU9EG-1FFVC900E 900 4 GByte DDR4 128 MByte x - extended
TE0808-04-09EG-2IE 5.2 x 7.6 cm XCZU9EG-2FFVC900I 900 4 GByte DDR4 128 MByte x - industrial
TE0808-04-15EG-1EE
5.2 x 7.6 cm XCZU15EG-1FFVC900E 900 4 GByte DDR4 128 MByte x - extended
TE0820-03-02CG-1ED 4 x 5 cm XCZU2CG-1SFVC784E 784 2 GByte DDR4 128 MByte - - extended
TE0820-03-03CG-1ED 4 x 5 cm XCZU3CG-1SFVC784E 784 2 GByte DDR4 128 MByte - - extended
TE0820-02-04CG-1ED 4 x 5 cm XCZU4CG-1SFVC784E 784 1 GByte DDR4 128 MByte - - extended
TE0820-03-02EG-1ED 4 x 5 cm XCZU2EG-1SFVC784E 784 2 GByte DDR4 128 MByte x - extended
TE0820-03-02EG-1EL 2) 4 x 5 cm XCZU3EG-1SFVC784E 784 2 GByte DDR4 128 MByte x - extended
TE0820-03-03EG-1ED 4 x 5 cm XCZU3EG-1SFVC784E 784 2 GByte DDR4 128 MByte x - extended
TE0820-03-03EG-1EL 2)
4 x 5 cm XCZU3EG-1SFVC784E 784 1 GByte DDR4 128 MByte x - extended
TE0820-03-04EV-1EA 4 x 5 cm XCZU4EV-1SFVC784E 784 2 GByte DDR4 128 MByte x x extended

1) Identical to variant TE0808-xx-09EG-1EB/TE0803-xx-04EV-1EA, except the 1 mm Samtec connectors.

2) Identical to variant TE0820-xx-02EG-1EL/TE0820-xx-03EG-1EA except the 2.5 mm Samtec connectors.

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UltraSOM+ MPSoC Module with Zynq UltraScale+ ZU6EG and mounted Heat Spreader
UltraSOM+ MPSoC Module with Zynq UltraScale+ ZU6EG and mounted Heat Spreader
MPSoC with integrated Xilinx Zynq UltraScale+ XCZU6EG-1FFVC900E and mounted heat spreader; 4 GByte DDR4 SDRAM; size: 5,2 x 7,6 cm
From 654.50 € (778.86 € gross) *
TE0808-04-06EG-1EK
In Stock: 0
UltraSOM+ MPSoC Module with Zynq UltraScale+ ZU9EG and mounted Heat Spreader
UltraSOM+ MPSoC Module with Zynq UltraScale+ ZU9EG and mounted Heat Spreader
Xilinx Zynq UltraScale+ XCZU09EG-1FFVC900E, 52 x 76 mm form factor, 4 GByte DDR4 SDRAM, 128 MByte SPI Boot Flash, 20 x serial transceiver
From 724.50 € (862.16 € gross) *
TE0808-04-09EG-1EK
In Stock: 0
TE0808-04-15-1EE-S Starter Kit with Zynq UltraScale+ FPGA Module
TE0808-04-15-1EE-S Starter Kit with Zynq UltraScale+ FPGA Module
MPSoC module TE0808 ZU15EG with pre-assembled heatsink on a TEBF0808 baseboard in a Core V1 Mini-ITX enclosure + accessories
2,222.00 € (2,644.18 € gross) *
TE0808-04-15-1EE-S
In Stock: 1
MPSoC Module with Xilinx Zynq UltraScale+ ZU3EG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm
MPSoC Module with Xilinx Zynq UltraScale+ ZU3EG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm
Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 4 GByte e.MMC
From 221.40 € (263.47 € gross) *
TE0820-03-03EG-1ED
In Stock: 0
MPSoC Module with Xilinx Zynq UltraScale+ ZU2EG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm
MPSoC Module with Xilinx Zynq UltraScale+ ZU2EG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm
Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 4 GByte e.MMC
From 179.40 € (213.49 € gross) *
TE0820-03-02EG-1ED
In Stock: 0
MPSoC Module with Xilinx Zynq UltraScale+ ZU2CG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm
MPSoC Module with Xilinx Zynq UltraScale+ ZU2CG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm
Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 4 GByte e.MMC
From 161.40 € (192.07 € gross) *
TE0820-03-02CG-1ED
In Stock: 0
MPSoC Module with Xilinx Zynq UltraScale+ ZU3CG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm
MPSoC Module with Xilinx Zynq UltraScale+ ZU3CG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm
Xilinx Zynq UltraScale+ XCZU3CG-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 4 GByte e.MMC
From 191.40 € (227.77 € gross) *
TE0820-03-03CG-1ED
In Stock: 0
MPSoC Module with Xilinx Zynq UltraScale+ ZU4CG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm
MPSoC Module with Xilinx Zynq UltraScale+ ZU4CG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm
Xilinx Zynq UltraScale+ XCZU4CG-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 4 GByte e.MMC
From 329.40 € (391.99 € gross) *
TE0820-03-04CG-1ED
In Stock: 0
MPSoC Module with Xilinx Zynq UltraScale+ ZU3EG-1E, 2 GByte DDR4, 4 x 5 cm, LP
MPSoC Module with Xilinx Zynq UltraScale+ ZU3EG-1E, 2 GByte DDR4, 4 x 5 cm, LP
Low Profile, Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 4 GByte e.MMC
From 221.40 € (263.47 € gross) *
TE0820-03-03EG-1EL
In Stock: 0
TE0803-02-03-1EA-S Starter Kit with Zynq UltraScale+ FPGA Module
TE0803-02-03-1EA-S Starter Kit with Zynq UltraScale+ FPGA Module
MPSoC module TE0803 ZU03EG with pre-assembled heatsink on a TEBF0808 baseboard in a Core V1 Mini-ITX enclosure + accessories
From 769.30 € (915.47 € gross) *
TE0803-02-03-1EA-S
In Stock: 0
MPSoC Module with Xilinx Zynq UltraScale+ ZU3EG-1E, 2 GByte DDR4, 5,2 x 7,6 cm
MPSoC Module with Xilinx Zynq UltraScale+ ZU3EG-1E, 2 GByte DDR4, 5,2 x 7,6 cm
Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E, 2 GByte DDR4, 128 MByte QSPI Boot Flash, Größe: 5,2 x 7,6 cm
From 257.40 € (306.31 € gross) *
TE0803-02-03EG-1EA
In Stock: 0
UltraSOM+ MPSoC Module with Zynq UltraScale+ ZU15EG and mounted Heat Spreader
UltraSOM+ MPSoC Module with Zynq UltraScale+ ZU15EG and mounted Heat Spreader
Xilinx Zynq UltraScale+ XCZU15EG-1FFVC900E, 52 x 76 mm form factor, 4 GByte DDR4 SDRAM, 128 MByte SPI Boot Flash, 20 x serial transceiver
From 834.00 € (992.46 € gross) *
TE0808-04-15EG-1EK
In Stock: 0
MPSoC Module with Xilinx Zynq UltraScale+ ZU4CG-1E, 2 GByte DDR4, 5,2 x 7,6 cm
MPSoC Module with Xilinx Zynq UltraScale+ ZU4CG-1E, 2 GByte DDR4, 5,2 x 7,6 cm
Xilinx Zynq UltraScale+ XCZU4CG-1SFVC784E, 2 GByte DDR4, 128 MByte QSPI Boot Flash, Size: 5,2 x 7,6 cm
From 329.40 € (391.99 € gross) *
TE0803-02-04CG-1EA
In Stock: 0
MPSoC Module with Xilinx Zynq UltraScale+ ZU2EG-1E, 2 GByte DDR4, 4 x 5 cm, LP
MPSoC Module with Xilinx Zynq UltraScale+ ZU2EG-1E, 2 GByte DDR4, 4 x 5 cm, LP
Low Profile, Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 4 GByte e.MMC
From 185.40 € (220.63 € gross) *
TE0820-03-02EG-1EL
In Stock: 0
MPSoC Module with Xilinx Zynq UltraScale+ ZU4EG-1E, 2 GByte DDR4, 5,2 x 7,6 cm
MPSoC Module with Xilinx Zynq UltraScale+ ZU4EG-1E, 2 GByte DDR4, 5,2 x 7,6 cm
Xilinx Zynq UltraScale+ XCZU4EG-1SFVC784E, 2 GByte DDR4, 128 MByte QSPI Boot Flash, Size: 5,2 x 7,6 cm
From 353.40 € (420.55 € gross) *
TE0803-02-04EG-1EA
In Stock: 0
MPSoC Module with Xilinx Zynq UltraScale+ ZU3EG-1E, 4 GByte DDR4, 5.2 x 7.6 cm
MPSoC Module with Xilinx Zynq UltraScale+ ZU3EG-1E, 4 GByte DDR4, 5.2 x 7.6 cm
MPSoC with Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E; 4 GByte DDR4; 128 MByte QSPI Boot Flash; Dimension: 5.2 x 7.6 cm
From 328.30 € (390.68 € gross) *
TE0803-02-03EG-1EB
In Stock: 0
MPSoC Module with Xilinx Zynq UltraScale+ ZU2CG-1E, 2 GByte DDR4, 5.2 x 7.6 cm
MPSoC Module with Xilinx Zynq UltraScale+ ZU2CG-1E, 2 GByte DDR4, 5.2 x 7.6 cm
Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E, 2 GByte DDR4, 128 MByte QSPI Boot Flash, Size: 5.2 x 7.6 cm
From 197.40 € (234.91 € gross) *
TE0803-02-02CG-1EA
In Stock: 0
MPSoC Module with Xilinx Zynq UltraScale+ ZU4CG-1E, 2 GB DDR4, 256 MByte Flash
MPSoC Module with Xilinx Zynq UltraScale+ ZU4CG-1E, 2 GB DDR4, 256 MByte Flash
Xilinx Zynq UltraScale+ XCZU4CG-1SFVC784E, 2 x 128 MByte Flash, 2 GByte DDR4 SDRAM, Size: 5.2 x 7.6 cm
From 345.00 € (410.55 € gross) *
TE0803-02-04CG-1EB
In Stock: 3
MPSoC Module with Xilinx Zynq UltraScale+ ZU5EV-1E, 2 GByte DDR4, 5,2 x 7,6 cm
MPSoC Module with Xilinx Zynq UltraScale+ ZU5EV-1E, 2 GByte DDR4, 5,2 x 7,6 cm
Xilinx Zynq UltraScale+ XCZU5EV-1SFVC784E, 2 GByte DDR4, 128 MByte QSPI Boot Flash, Size: 5.2 x 7.6 cm
From 599.40 € (713.29 € gross) *
TE0803-02-05EV-1EA
In Stock: 0
MPSoC Module with Xilinx Zynq UltraScale+ ZU4EV-1E, 2 GByte DDR4, 5.2 x 7.6 cm
MPSoC Module with Xilinx Zynq UltraScale+ ZU4EV-1E, 2 GByte DDR4, 5.2 x 7.6 cm
Xilinx Zynq UltraScale+ XCZU4EV-1SFVC784E, 2 GByte DDR4, 128 MByte QSPI Boot Flash, Size: 5.2 x 7.6 cm
From 389.40 € (463.39 € gross) *
TE0803-02-04EV-1EA
In Stock: 0
MPSoC Module with Xilinx Zynq UltraScale+ ZU4EV-1E, 4 GByte DDR4, 5.2x7.6 cm, LP
MPSoC Module with Xilinx Zynq UltraScale+ ZU4EV-1E, 4 GByte DDR4, 5.2x7.6 cm, LP
Low Profile, Xilinx Zynq UltraScale+ XCZU4EV-1SFVC784E, 4 GByte DDR4, 128 MByte QSPI Boot Flash, Size: 5.2 x 7.6 cm
From 407.40 € (484.81 € gross) *
TE0803-02-04EV-1E3
In Stock: 0
MPSoC Module with Xilinx Zynq UltraScale+ ZU7EV, 4 GByte DDR4
MPSoC Module with Xilinx Zynq UltraScale+ ZU7EV, 4 GByte DDR4
Xilinx Zynq UltraScale+ XCZU7EV-1FBVB900E; 4 GByte DDR4; 128 MByte QSPI Boot Flash; Dimension: 5,2 x 7,6 cm
From 840.00 € (999.60 € gross) *
TE0807-02-07EV-1E
In Stock: 0
Heatsink maxiGRIP 23 x 23 x 19.5 mm for TE0803
Heatsink maxiGRIP 23 x 23 x 19.5 mm for TE0803
BGA Heat Sink - High Performance, maxiFLOW/maxiGRIP-Low Profile Heat Sink Type: maxiFLOW Heat Sink Attachment: maxiGRIP The heat sink maxiGRIP has been specially modified for the TE0803 module. Features maxiFLOW™ design features a low...
11.18 € (13.30 € gross) *
28174
In Stock: 2
MPSoC Module with Xilinx Zynq UltraScale+ ZU4EV-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm
MPSoC Module with Xilinx Zynq UltraScale+ ZU4EV-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm
Xilinx Zynq UltraScale+XCZU4EV-1SFVC784E, 2 GByte DDR4, 128 MByte SPI Boot Flash, 4 GByte e.MMC
From 401.40 € (477.67 € gross) *
TE0820-03-04EV-1EA
In Stock: 0
UltraSOM+ MPSoC Module with Zynq UltraScale+ XCZU6EG-1FFVC900E, 4 GB DDR4
UltraSOM+ MPSoC Module with Zynq UltraScale+ XCZU6EG-1FFVC900E, 4 GB DDR4
MPSoC with integrated Xilinx Zynq UltraScale+ XCZU6EG-1FFVC900E; 4 GByte DDR4 SDRAM; 128 MByte Flash memory; 52 x 76 mm form factor; 20 x serial transceiver
From 629.30 € (748.87 € gross) *
TE0808-04-06EG-1EE
In Stock: 3
MPSoC Module with Xilinx Zynq UltraScale+ ZU2EG-1E, 2 GByte DDR4, 5.2 x 7.6 cm
MPSoC Module with Xilinx Zynq UltraScale+ ZU2EG-1E, 2 GByte DDR4, 5.2 x 7.6 cm
Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E, 2 GByte DDR4, 128 MByte QSPI Boot Flash, Dimension: 5.2 x 7.6 cm
From 221.40 € (263.47 € gross) *
TE0803-01-02EG-1EA
In Stock: 3
UltraSOM+ MPSoC Module with Zynq UltraScale+ XCZU15EG-1FFVC900E, 4 GB DDR4
UltraSOM+ MPSoC Module with Zynq UltraScale+ XCZU15EG-1FFVC900E, 4 GB DDR4
Xilinx Zynq UltraScale+ XCZU15EG-1FFVC900E, 52 x 76 mm form factor, 4 GByte DDR4 SDRAM, 128 MByte SPI Boot Flash, 20 x serial transceiver
From 809.40 € (963.19 € gross) *
TE0808-04-15EG-1EE
In Stock: 0
TE0808-04-09-2IE-S Starter Kit
TE0808-04-09-2IE-S Starter Kit
MPSoC module TE0808 ZU9EG with pre-assembled heatsink on a TEBF0808 baseboard in a Core V1 Mini-ITX enclosure plus accesssories.
From 1,749.30 € (2,081.67 € gross) *
TE0808-04-09-2IE-S
In Stock: 0
UltraSOM+ MPSoC Module with Zynq UltraScale+ XCZU9EG-2FFVC900I, 4 GB DDR4
UltraSOM+ MPSoC Module with Zynq UltraScale+ XCZU9EG-2FFVC900I, 4 GB DDR4
Xilinx Zynq UltraScale+ XCZU9EG-2FFVC900I, 52 x 76 mm form factor, 4 GByte DDR4 SDRAM, 128 MByte SPI Boot Flash, 20 x serial transceiver
From 1,049.30 € (1,248.67 € gross) *
TE0808-04-09EG-2IE
In Stock: 4
UltraSOM+ MPSoC Module with Zynq UltraScale+ XCZU9EG-1FFVC900E, 4 GB DDR4
UltraSOM+ MPSoC Module with Zynq UltraScale+ XCZU9EG-1FFVC900E, 4 GB DDR4
Xilinx Zynq UltraScale+ XCZU9EG-1FFVC900E, 4 GByte DDR4 SDRAM, 128 MByte SPI Boot Flash, 20 x serial transceiver
From 699.30 € (832.17 € gross) *
TE0808-04-09EG-1EE
In Stock: 0
UltraSOM+ MPSoC Module with Zynq UltraScale+ XCZU9EG, 4 GByte DDR4, low profile
UltraSOM+ MPSoC Module with Zynq UltraScale+ XCZU9EG, 4 GByte DDR4, low profile
Low Profile, Xilinx Zynq UltraScale+ XCZU9EG-1FFVC900E, 4 GByte DDR4 SDRAM, 128 MByte SPI Boot Flash, 20 x serial transceiver
From 769.30 € (915.47 € gross) *
TE0808-04-09EG-1EL
In Stock: 13
TE0808-04-09-1EE-S Starter Kit
TE0808-04-09-1EE-S Starter Kit
TE0808 MPSoC module with ZU9EG plus heatsink on a TEBF0808 carrier board in a Core Mini-ITX Enclosure. Accessories included.
From 1,199.40 € (1,427.29 € gross) *
TE0808-04-09-1EE-S
In Stock: 0
MPSoC Module with Xilinx Zynq UltraScale+ ZU3CG-1E, 2 GByte DDR4, 5.2 x 7.6 cm
MPSoC Module with Xilinx Zynq UltraScale+ ZU3CG-1E, 2 GByte DDR4, 5.2 x 7.6 cm
Xilinx Zynq UltraScale+ XCZU3CG-1SFVC784E, 2 GByte DDR4, 128 MByte QSPI Boot Flash, Dimension: 5.2 x 7.6 cm
From 239.40 € (284.89 € gross) *
TE0803-01-03CG-1EA
In Stock: 30
Heatsink for Trenz Electronic Module TE0820/TE0841
Heatsink for Trenz Electronic Module TE0820/TE0841
The BGA-STD-045 is a 23 x 23 x 18 mm standard Heat Sink with thermal tape. This heat sink is made of aluminium with black anodized finish and vertically mounted fin. This BGA series heat sink is suitable for use with ball grid array....
From 2.18 € (2.59 € gross) *
28606
In Stock: 20
Heat Spreader for Trenz Electronic MPSoC TE0808
Heat Spreader for Trenz Electronic MPSoC TE0808
Cooling solution especially desgined for Trenz Electronic module TE0808 from REV03
29.00 € (34.51 € gross) *
KK0808-03
In Stock: 8
Test Board for TE0808 and TE0803
Test Board for TE0808 and TE0803
Testboard for TE0808-02 and -03 plus TE0803-01
From 97.30 € (115.79 € gross) *
TEBT0808-01
In Stock: 0
UltraITX+ Baseboard for Trenz Electronic TE080X UltraSOM+
UltraITX+ Baseboard for Trenz Electronic TE080X UltraSOM+
The Trenz Electronic TEBF0808 carrier board is a baseboard for the Xilinx Zynq Ultrascale+ MPSoC modules TE0803, TE0807 und TE0808
From 479.40 € (570.49 € gross) *
TEBF0808-04
In Stock: 0