SoC Module with Intel® Stratix®10 SX 1SX040, 1 GByte DDR4, 6 x 8 cm

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  • TEI1000-01-A1I11-A
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Product information "SoC Module with Intel® Stratix®10 SX 1SX040, 1 GByte DDR4, 6 x 8 cm"

This product is not always in stock, but will be produced on customer order (on demand).
Please ask for any minimum quantities.

 

The Trenz Electronic TEI1000-01-A1I11-A is an industrial SoC module based on Intel® Stratix® 10 SX.

The Intel® Stratix® 10 FPGA devices offer higher core performance, up to 7 x transceiver bandwidth and higher I/O performance than the previous generation. To meet the challenges of next-generation systems, Intel® Stratix® 10 FPGAs and SoCs feature the new Intel Hyperflex™ FPGA architecture, which offers twice the clock frequency performance and up to 70% lower power consumption compared to previous generation high-end FPGAs.

Intel® Stratix® 10 SoC FPGA combines a quad-core ARM Cortex–A53 MPCore hard processor system with the revolutionary Intel® Hyperflex™ FPGA Architecture to deliver the embedded performance, power efficiency, density, and system integration necessary for embedded applications.

Intel® Stratix® 10 FPGA devices address the design challenges in next-generation, high-performance systems in wireline and wireless communications, computing, storage, military, broadcast, medical and test and measurement end markets.

Key Features

  • Intel® Stratix® 10 SX SoC-FPGA (1SX040HH3F35I3VG)
    • Size: 378kLE
    • DSP Blocks: 648
    • Embedded memory: up to 32 Mbit
    • Temperature: -40°C to 100°C
    • Multipliers: 1,296
  • Quad-core 64-bit ARM Cortex-A53 up to 1.5GHz
    • co-processor: ARM Neon media processing engine
    • on-chip memory: 256 KB on-chip RAM
    • DMA controller: 8 channels
    • up to 3 x Gbit EMAC for Ethernet (with external PHY)
    • up to 2 x USB OTG (with external PHY)
  • 1 GByte DDR4 SDRAM, 32 Bit Data Width
  • 64 MByte QSPI Boot Flash
  • Intel MAX 10 as System Controller
  • 3 x 240-Pin BGA connectors
  • I/O-Interfaces:
    • High Performance IOs: 144 (72 LVDS pairs)
    • High Voltage IOs: 48
    • General purpose IOs: 56
    • HPS/CPU IOs: 48
  • 18 x 17.4 Gbps Gigabit Transeivers (PCIe Gen3 x 16 capable)
  • Status and user LEDs
  • size: 6 x 8 cm

Other assembly options for cost or performance optimization plus high volume prices available on request.

Development Support

Latest documentation, design support files and reference designs with source files are available for download free of charge.

Scope of Delivery

  • 1 x TEI1000-01-A1I11-A Trenz Electronic SoC Module with Intel® Stratix® 10 SX

Additional Information

All modules produced by Trenz Electronic are developed and manufactured in Germany.

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