FPGA Module with AMD Spartan™ 6 LX75-3I, 128 MB DDR3L, Mini-USB 2.0, 4 x 5 cm

€265.00 (315.35 € gross) *

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  • TE0630-03-63I12-A
  • 4
  • Full production
Quantity Unit price
To 9 €265.00 (315.35 € gross) *
From 10 €238.50 (283.82 € gross) *
From 25 €225.25 (268.05 € gross) *
From 50 €212.00 (252.28 € gross) *
From 100 €198.75 (236.51 € gross) *
From 250 €185.50 (220.75 € gross) *
From 500 €172.25 (204.98 € gross) *
From 1000 €159.00 (189.21 € gross) *
Description Downloads Resources
The predecessor of this article is TE0630-02IBF . All changes are in the Product Change... more
Product information "FPGA Module with AMD Spartan™ 6 LX75-3I, 128 MB DDR3L, Mini-USB 2.0, 4 x 5 cm"

The predecessor of this article is TE0630-02IBF. All changes are in the Product Change Notification (PCN).

Trenz Electronic TE0630 series are industrial-grade FPGA micro-modules integrating a leading-edge AMD/Xilinx Spartan™ 6 FPGA, a mini-USB 2.0 device port, 1 GBit (128-MByte) DDR3L SDRAM with 16-Bit width, 8 MByte Flash memory for configuration and operation, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/Os are provided via rugged high-speed stacking connectors. TE0630 is fully mechanically and largely electrically backward compatible with Trenz Electronic TE0300 AMD/Xilinx Spartan™ 3E FPGA micro-modules.

All this on a tiny footprint, smaller than a credit card, at the most competitive price. Modules in 4 x 5 cm form factor are fully mechanically and largely electrically compatible among each other.

All parts are at least industrial temperature range of -40°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

Key Features

  • SoC / FPGA
    • Device: AMD/Xilinx Spartan™ 6 XC6SLX75-3CSG484I
    • Speedgrade: -3
    • Temperature range: Industrial-grade
    • Package: CSG484
  • RAM / Storage
    • 16-Bit breiter 1 GBit (128 MByte) DDR3L SDRAM
    • 64 Mbit (8 Mbyte) QSPI Flash memory (for configuration and operation) accessible through:
      • FPGA
      • JTAG port (SPI indirekt)
      • USB
  • On Board
    • 24 MHz and 100 MHz reference clock signals
    • eFUSE bit-stream encryption (LX75 or larger)
    • 4 user LEDs
    • 1 user push-button
    • 2 user DIP switches
  • Interface
    • Plug-on module with 2 × 80 pin stacking connectors
    • Up to 40 differential and up to 109 single-ended FPGA I/O's pins available on B2B connectors
    • FPGA configuration through:
      • B2B connector
      • JTAG port
      • SPI Flash memory
  • Power
    • 1.2 V, 1.5 V, 2.5 V = VCCAUX and 3.3 V power rails
  • Dimension
    • 4 x 5 cm

Product specification

  • AMD/Xilinx Spartan™ 6 LX FPGA: XC6SLX75-3CSG484I = 74 k logic cells, industrial grade
  • Cypress CY7C68013A-56LFXC EZ-USB FX2LP: USB microcontroller, high speed USB peripheral controller
  • 16-bit-wide (data-bus) 1 Gigabit (128 Megabyte) DDR3L SDRAM
  • 64 Megabit (8 Megabyte) serial Flash memory with dual/quad QSPI interface
  • 2 x fine-pitch (0.5 mm) 80-pin board-to-board connectors Hirose DF17 series
  • Up to 40 differential FPGA input/output pins available on B2B connectors
  • Up to 109 single-ended FPGA input/output pins available on B2B connectors
  • USB and JTAG pins available on B2B connectors
  • 4.0 A high-efficiency DC-DC switching regulator for power rail 1.2 V
  • 3.0 A high-efficiency DC-DC switching regulator for power rail 1.5 V
  • 0.8 A DC-DC linear regulator for power rails 2.5 V and VCCAUX
  • 3.0 A high-efficiency DC-DC switching regulator for power rail 3.3 V
  • Power supervisory circuits with power-fail
  • Power supply voltage range: 4.0 to 5.5 V
  • Power supply source: USB port, board-to-board interconnect (e.g. carrier board)
  • Dimensions: 47.5 × 40.5 mm (19.2 cm2)
  • Minimum height: TBD (without connectors)
  • Minimum height on carrier board: TBD
  • Weight: 14.0 to 14.5 g
  • Temperature grades
    • commercial (C-type FPGA device)
    • industrial (I-type FPGA device)

Other assembly options for cost or performance optimization plus high volume prices available on request.

Recommended Software

for Trenz Electronic modules with Spartan™ 3A, -3E and Spartan™ 6 LX45/LX75

ISE Design Suite: WebPACK Edition

ISE WebPACK delivers a complete, front-to-back design flow providing instant access to the ISE features and functionality at no cost.

https://www.xilinx.com/products/design-tools/ise-design-suite/ise-webpack.html

Development Support

There is a base board available for this module.

Latest documentation, design support files and reference designs with source files are available for download free of charge.

Scope of Delivery

  •  1 x TE0630-03-63I12-A Trenz Electronic FPGA module with AMD/Xilinx Spartan™ 6 LX75 FPGA

Additional Information

All modules produced by Trenz Electronic are developed and manufactured in Germany.

The online pictures of this product are not a legally binding offer, but are symbol pictures for illustration and presentation only.

Related links to "FPGA Module with AMD Spartan™ 6 LX75-3I, 128 MB DDR3L, Mini-USB 2.0, 4 x 5 cm"
Downloads
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Trenz_Electronic - Documents and Design files for Trenz Electronic Products