UltraSOM+ MPSoC Module with Zynq UltraScale+ XCZU15EG-1FFVC900E, 4 GB DDR4

€1,639.00 (1,950.41 € gross) *

Prices plus VAT plus shipping costs

Possible to order, delivery time on request.

  • TE0808-05-BBE21-A
  • 0
  • Full production
Quantity Unit price
To 9 €1,639.00 (1,950.41 € gross) *
From 10 €1,475.10 (1,755.37 € gross) *
From 25 €1,475.10 (1,755.37 € gross) *
From 50 €1,229.25 (1,462.81 € gross) *
From 100 €1,229.25 (1,462.81 € gross) *
From 250 €1,147.30 (1,365.29 € gross) *
From 500 €1,048.96 (1,248.26 € gross) *
From 1000 €1,048.96 (1,248.26 € gross) *
Description Downloads Resources
The predecessor of this article is TE0808-04-BBE21-A . All changes are in the Product... more
Product information "UltraSOM+ MPSoC Module with Zynq UltraScale+ XCZU15EG-1FFVC900E, 4 GB DDR4"

The predecessor of this article is TE0808-04-BBE21-A. All changes are in the Product Change Notification (PCN).

Note: Due to the new revision the height profile of the module has changed.
Using TE0808-05 board as a replacement or in system(s) designed for TE0808-04, a review and adaption of mechanics e.g. cooling solutions must be implemented.

This module is not recommended for new designs. Please use the TE0818 module series instead.

The Trenz Electronic TE0808-05-BBE21-A is a MPSoC module integrating a Xilinx Zynq UltraScale+ ZU15EG, 4 GByte DDR4 SDRAM, 128 MByte Flash memory for configuration and operation, 20 x high speed serial transceivers, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections.

All this on a tiny footprint of 5.2 x 7.6 cm at the most competitive price. These high-density integrated modules are smaller than a credit card and available in several variants.

All parts are at least extended temperature range of 0°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

Key Features

  • Xilinx Zynq UltraScale+ XCZU15EG-1FFVC900E
  • ZU15EG 900 Pin Packages
  • 3 mm mounting holes for skyline heat spreader
  • Size: 52 x 76 mm
  • B2B Connectors: 4 x 160 pin
  • Rugged for shock and high vibration
  • 4 GByte 64-Bit DDR4 SDRAM
  • 128 MByte SPI Boot Flash (dual parallel)
  • User I/Os
    • 65 x PS MIOs, 48 x PL HD GPIOs, 156 x PL HP GIPIOs (3 banks)
    • Serial transceivers: 4 x PS-GTR, 16 x PL-GTH
    • Transceiver clocks inputs and outputs
    • PLL clock generator inputs and outputs
  • All power supplies on board, single 3.3V Power required
    • 14 on-board DC/DC regulators and 13 LDOs
    • LP, FP, PL separately controlled power domains
  • Support for all boot modes (except NAND) and scenarios
  • Support for any combination of PS connected peripherals
  • Evenly spread supply pins for good signal integrity

Other assembly options for cost or performance optimization plus high volume prices available on request.

Development Support

There is a base board available for this module.

Latest documentation, design support files and reference designs with source files are available for download free of charge.

Scope of Delivery

  • 1 x TE0808-05-BBE21-A Trenz Electronic MPSoC module with Xilinx Zynq UltraScale+ ZU15EG

Additional Information

All modules produced by Trenz Electronic are developed and manufactured in Germany.

Related links to "UltraSOM+ MPSoC Module with Zynq UltraScale+ XCZU15EG-1FFVC900E, 4 GB DDR4"
Trenz_Electronic - Documents and Design files for Trenz Electronic Products