UltraSOM+ MPSoC-Module with AMD Zynq™ UltraScale+™ ZU9EG-2I incl. Heat Spreader

€1,499.00 (1,783.81 € gross) *

Prices plus VAT plus shipping costs

Possible to order, delivery time on request.

  • TE0818-02-9GI81-AK
  • 0
  • Full production
Quantity Unit price
To 9 €1,499.00 (1,783.81 € gross) *
From 10 €1,349.10 (1,605.43 € gross) *
From 25 €1,349.10 (1,605.43 € gross) *
From 50 €1,199.20 (1,427.05 € gross) *
From 100 €1,124.25 (1,337.86 € gross) *
From 250 €1,124.25 (1,337.86 € gross) *
From 500 €1,004.33 (1,195.15 € gross) *
From 1000 €1,004.33 (1,195.15 € gross) *
Description Downloads Resources
This product is not always in stock, but will be produced on customer order (on demand).... more
Product information "UltraSOM+ MPSoC-Module with AMD Zynq™ UltraScale+™ ZU9EG-2I incl. Heat Spreader"

This product is not always in stock, but will be produced on customer order (on demand).
Please ask for any minimum quantities.


The predecessor of this article is TE0818-01-9GI21-AK. All changes are in the Product Change Notification (PCN).

This module is a TE0818-02-9GI81-A with mounted heat spreader.

The TE0818 is largely identical in construction to the TE0808. The essential difference are new Samtec BGA connectors, which guarantees a reliable contact. The dimensions are identical.

The Trenz Electronic TE0818-01-9GI21-A is a MPSoC module integrating a AMD/Xilinx Zynq™ UltraScale+™ ZU9EG, 4 GByte DDR4 SDRAM, 128 MByte Flash memory for configuration and operation, 20 x serial high speed transceivers, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections. 

All this on a tiny footprint of 5.2 x 7.6 cm at the most competitive price. These high-density integrated modules are smaller than a credit card and available in several variants.

All parts are at least industrial temperature range of -40°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

Key Features

  • SoC / FPGA
    • Device: AMD/Xilinx Zynq™ UltraScale+™ XCZU9EG-2FFVC900I
    • Speedgrade: -2
    • Temperature range: Industrial
    • Package: FFVC900
    • Grafikprozessor-Unit (GPU)
  • RAM / Storage
    • 4 GByte DDR4 SDRAM
    • 128 MByte SPI Boot Flash (dual parallel)
    • 2 Kbit serial EEPROM with EUI-48 Node Identity
  • On Board
    • Oscillator
    • Programmable 10-channel PLL clock generator
  • Interface
    • Plug-on module with 4 x 240 pin B2B connectors (ADM6)
      • 204 PL IO
        • HP: 156
        • HD: 48
      • 65 PS MIO

      • 4 PS GTR
      • 16 PL GTH
      • I2C, JTAG
    • 2 Transceiver clocks
    • PLL Clock Generator
    • LP, FP, PL separately controlled power domains
  • Power
    • 14 on-board DC/DC regulators and 13 LDOs, Single Supply
  • Dimension
    • 5.2 x 7.6 cm

Other assembly options for cost or performance optimization plus high volume prices available on request.

Development Support

There is a base board available for this module.

Latest documentation, design support files and reference designs with source files are available for download free of charge.

Scope of Delivery

  • 1 x TE0818-02-9GI81-A Trenz Electronic MPSoC module with AMD/Xilinx Zynq™ UltraScale+™ ZU9EG (industrial temperature range)
  • 1 x mounted heat spreader for TE0818-01

Additional Information

All modules produced by Trenz Electronic are developed and manufactured in Germany.

The online pictures of this product are not a legally binding offer, but are symbol pictures for illustration and presentation only.

Related links to "UltraSOM+ MPSoC-Module with AMD Zynq™ UltraScale+™ ZU9EG-2I incl. Heat Spreader"
Trenz_Electronic - Documents and Design files for Trenz Electronic Products