Starter Kit with AMD Zynq™ UltraScale+™ ZU3EG-1E MPSoC module

€1,019.00 (1,212.61 € gross) *

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  • TE0813-02-3BE81-AS
  • 0
  • Full production
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This product is not always in stock, but will be produced on customer order (on demand).... more
Product information "Starter Kit with AMD Zynq™ UltraScale+™ ZU3EG-1E MPSoC module"

This product is not always in stock, but will be produced on customer order (on demand).
Please ask for any minimum quantities.

 

The Trenz Electronic Starter Kit TE0813-02-3BE81-AS consists of a TE0813-02-3BE81-A module with ZU3 on a TEBF0818-02 base board including a pre-assembled heatsink, in a black Core V1 Mini-ITX Enclosure. Supplied with a Be Quiet! 400 W power supply for the enclosure, two mounted XMOD FTDI JTAG Adapter, an 32 GB micro SD card, an USB cable, a power cable and screws.

The Module: TE0813-02-3BE81-A

The Trenz Electronic TE0813-02-3BE81-A is an industrial-grade MPSoC module integrating a AMD/Xilinx Zynq™ UltraScale+™ with ZU3EG, 4 GByte DDR4 SDRAM, 128 MByte Flash memory for configuration and operation, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections.

Key Features

  • FPGA
    • Device: AMD/Xilinx Zynq™ UltraScale+™ XCZU3EG-1SFVC784E
    • Speedgrade: -1
    • Temperature range: Extended
    • Package: SFVC784
    • Grafikprozessor-Unit (GPU)
  • RAM / Storage
    • 4 GByte DDR4 SDRAM
    • 128 MByte QSPI Boot Flash
    • 2 Kbit serial EEPROM with EUI-48 Node Identity
  • On Board
    • Oscillator
    • Programmable 4-channel PLL clock generator
  • Interface
    • Plug-on module with 4 x 240 pin B2B connectors (ADM6)
      • 204 PL IO
        • HP: 156
        • HD: 48
      • 65 PS MIO

      • 4 PS GTR
      • I2C, JTAG
  • Power
    • 3.3V power supply required
  • Dimension
    • 5.2 x 7.6 cm

Recommended Software

Vivado ML Standard Edition (free version)

The Vivado ML Standard Edition is the FREE version of the Vivado design suite. Vivado ML Standard delivers instant access to some basic Vivado features and functionality at no cost.

Overview of all editions of Vivado ML

The Base Board: TEBF0818-02

The Trenz Electronic TEBF0818 UltraITX+ base board has been developed individually for the TE081x MPSoC series.

Key Features

  • Mini-ITX form factor, PC enclosure compatible
  • ATX-24 power supply connector
  • Optional 12V standard power plug
  • Headers
    • Intel 10-pin HDA audio
    • Intel 9-pin power/reset button, Power-/HD-LED
    • PC-BEEPER
  • On-board power-/reset-switches
  • 2 x configuration 4-bit DIP switches
  • 2 x optional 4-wire PWM fan connectors
  • PCIe slot - one PCIe lane (16 lane connector)
  • CAN FD transceiver (10 Pin IDC connector and 6-pin header)
  • 4 x On-board configuration EEPROMs (1 x Microchip 24LC128-I/ST, 3 x Microchip 24AA025E48T-I/OT)
  • Dual SFP+ connector (2x1 Cage)
  • 1 x DisplayPort (single lane)
  • 1 x SATA connector
  • 2 x USB 3.0 A connector (Superspeed Host Port (Highspeed at USB 2.0))
  • 1 x USB 3.0 on-board connector with two ports
  • FMC HPC slot (FMC_VADJ max. VCCIO)
  • FMC fan
  • Gigabit Ethernet RGMII PHY with RJ45 MagJack
  • All carrier board peripherals' I²C interfaces muxed to MPSoC's I²C interface
  • Quad programmable PLL clock generator
  • 2 x SMA coaxial connectors for clock signals
  • MicroSD/MMC card socket (bootable)
  • 64 GBit (8 GByte) on-board eMMC Flash
  • 2 x System controller CPLDs Lattice MachXO2 1200 HC
  • 1 x Samtec FireFly (4 GT lanes bidirectional)
  • 1 x Samtec FireFly connector for reverse loopback
  • 20-pin ARM JTAG connector (PS JTAG0)
  • 3 x Pmod connector (GPIO's and I²C interface to SC CPLDs and MPSoC module)
  • On-board DC-DC PowerSoCs
  • Size: 170 mm × 170 mm. Please download the assembly diagram for exact details.
  • Mating height with standard connectors: 5 mm

PC Enclosure Accessible I/O

  • PCIe
  • FMC
  • Dual SFP+
  • RJ45 Gigabit Ethernet
  • 2 x USB3 Host
  • Displayport
  • microSD
  • Two LEDs
  • CAN FD (using DB9 to IDC10 Cable)

Core V1 Mini-ITX Enclosure - Technical Features

  • Dimensions: 260 x 276 x 316 mm (B x H x T)
  • Material: Steel
  • Colour: Black
  • Drive Slots: 2 x 3.5 inch (intern, 3.5 inch) and 2 x 2.5 inch (intern, 2.5 inch)
  • Expansion slots: 2
  • I/O-Panel: 2 x USB 3.0 and 1 x Audio In/Out each
  • Maximum graphic card lenght: 255 mm (inner enclosure)
  • Maximum graphic card lenght: 285 mm (outer enclosure)
  • Maximum CPU cooler height: 140 mm
  • Maximum lenght power supply: 200 mm

Scope of Delivery - Starter Kit

  • 1 x Core V1 Mini-ITX Enclosure- black with viewing window and removable sled walls
  • 1 x Power supply Be quiet! BN292 Be Quiet! Pure Power 11, 400W, 80 PLUS (with fan)
  • 1 x TE0813-02-3BE81-A MPSoC module with AMD/Xilinx Zynq™ UltraScale+™ ZU3
  • 1 x TEBF0818-02 base board
  • 1 x Heatsink SuperGrip ATS-X50230B-C1-R0 23 x 23 x 7,5 mm
  • 1 x TE0790-03 XMOD FTDI JTAG adapter (compatible with AMD-Tools), pre-assembled on the carrier board
  • 1 x TE0790-03L XMOD FTDI JTAG adapter (independent from AMD-Tools), pre-assembled on the carrier board
  • 1 x 32 GB Class 10 UHS1 microSDHC incl. adapter
  • 1 x USB cable, Type A to Type B Mini, 2 meter length
  • 1 x power cable Schuko 1.8m black
  • 4 x Phillips screws, M3 x 6, pan head, zinc coated

Additional Information

All modules produced by Trenz Electronic are developed and manufactured in Germany.

The online pictures of this product are not a legally binding offer, but are symbol pictures for illustration and presentation only.

Related links to "Starter Kit with AMD Zynq™ UltraScale+™ ZU3EG-1E MPSoC module"
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Trenz_Electronic - Documents and Design files for Trenz Electronic Products