Starter Kit with AMD Zynq™ UltraScale+™ ZU9EG-1E MPSoC module

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  • TE0818-02-9BE81-AS
  • 3
  • Full production
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This product is not always in stock, but will be produced on customer order (on demand).... more
Product information "Starter Kit with AMD Zynq™ UltraScale+™ ZU9EG-1E MPSoC module"

This product is not always in stock, but will be produced on customer order (on demand).
Please ask for any minimum quantities.

 

The Trenz Electronic Starter Kit TE0818-02-9BE81-AS consists of a TE0818-02-9BE81-A module with ZU9 on a TEBF0818-02 base board including a pre-assembled heatsink, in a black Core V1 Mini-ITX Enclosure. Supplied with a Be Quiet! 400 W power supply for the enclosure, two mounted XMOD FTDI JTAG Adapter, an 32 GB micro SD card, an USB cable, a power cable and screws.

The Module: TE0818-02-9BE81-A

The Trenz Electronic TE0818-02-9BE81-A is a MPSoC module integrating a AMD/Xilinx Zynq™ UltraScale+™ ZU9EG, 4 GByte DDR4 SDRAM, 128 MByte Flash memory for configuration and operation, 20 x high speed serial transceivers, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections.

Key Features

  • SoC / FPGA
    • Device: AMD/Xilinx Zynq™ UltraScale+™ XCZU9EG-1FFVC900E
    • Speedgrade: -1
    • Temperature range: Extended
    • Package: FFVC900
    • Grafikprozessor-Unit (GPU)
  • RAM / Storage
    • 4 GByte DDR4 SDRAM
    • 128 MByte SPI Boot Flash (dual parallel)
    • 2 Kbit serial EEPROM with EUI-48 Node Identity
  • On Board
    • Oscillator
    • Programmable 10-channel PLL clock generator
  • Interface
    • Plug-on module with 4 x 240 pin B2B connectors (ADM6)
      • 204 PL IO
        • HP: 156
        • HD: 48
      • 65 PS MIO

      • 4 PS GTR
      • 16 PL GTH
      • I2C, JTAG
    • 2 Transceiver clocks
    • PLL Clock Generator
    • LP, FP, PL separately controlled power domains
  • Power
    • 14 on-board DC/DC regulators and 13 LDOs, Single Supply
  • Dimension
    • 5.2 x 7.6 cm

The Base Board: TEBF0818-02

The Trenz Electronic TEBF0818 UltraITX+ base board has been developed individually for the TE081x MPSoC series.

Key Features

  • Mini-ITX form factor, PC enclosure compatible
  • ATX-24 power supply connector
  • Optional 12V standard power plug
  • Headers
    • Intel 10-pin HDA audio
    • Intel 9-pin power/reset button, Power-/HD-LED
    • PC-BEEPER
  • On-board power-/reset-switches
  • 2 x configuration 4-bit DIP switches
  • 2 x optional 4-wire PWM fan connectors
  • PCIe slot - one PCIe lane (16 lane connector)
  • CAN FD transceiver (10 Pin IDC connector and 6-pin header)
  • 4 x On-board configuration EEPROMs (1 x Microchip 24LC128-I/ST, 3 x Microchip 24AA025E48T-I/OT)
  • Dual SFP+ connector (2x1 Cage)
  • 1 x DisplayPort (single lane)
  • 1 x SATA connector
  • 2 x USB 3.0 A connector (Superspeed Host Port (Highspeed at USB 2.0))
  • 1 x USB 3.0 on-board connector with two ports
  • FMC HPC slot (FMC_VADJ max. VCCIO)
  • FMC fan
  • Gigabit Ethernet RGMII PHY with RJ45 MagJack
  • All carrier board peripherals' I²C interfaces muxed to MPSoC's I²C interface
  • Quad programmable PLL clock generator
  • 2 x SMA coaxial connectors for clock signals
  • MicroSD/MMC card socket (bootable)
  • 64 GBit (8 GByte) on-board eMMC Flash
  • 2 x System controller CPLDs Lattice MachXO2 1200 HC
  • 1 x Samtec FireFly (4 GT lanes bidirectional)
  • 1 x Samtec FireFly connector for reverse loopback
  • 20-pin ARM JTAG connector (PS JTAG0)
  • 3 x Pmod connector (GPIO's and I²C interface to SC CPLDs and MPSoC module)
  • On-board DC-DC PowerSoCs
  • Size: 170 mm × 170 mm. Please download the assembly diagram for exact details.
  • Mating height with standard connectors: 5 mm

PC Enclosure Accessible I/O

  • PCIe
  • FMC
  • Dual SFP+
  • RJ45 Gigabit Ethernet
  • 2 x USB3 Host
  • Displayport
  • microSD
  • Two LEDs
  • CAN FD (using DB9 to IDC10 Cable)

Core V1 Mini-ITX Enclosure - Technical Features

  • Dimensions: 260 x 276 x 316 mm (B x H x T)
  • Material: Steel
  • Colour: Black
  • Drive Slots: 2 x 3.5 inch (intern, 3.5 inch) and 2 x 2.5 inch (intern, 2.5 inch)
  • Expansion slots: 2
  • I/O-Panel: 2 x USB 3.0 and 1 x Audio In/Out each
  • Maximum graphic card lenght: 255 mm (inner enclosure)
  • Maximum graphic card lenght: 285 mm (outer enclosure)
  • Maximum CPU cooler height: 140 mm
  • Maximum lenght power supply: 200 mm

Scope of Delivery - Starter Kit

  • 1 x Core V1 Mini-ITX Enclosure- black with viewing window and removable sled walls
  • 1 x Power supply Be quiet! BN292 Be Quiet! Pure Power 11, 400W, 80 PLUS (with fan)
  • 1 x TE0818-02-9BE81-A MPSoC module with AMD/Xilinx Zynq™ UltraScale+™ ZU9
  • 1 x TEBF0818-02 base board
  • 1 x Heatsink SuperGrip ATS-X50310P-C1-R0 31 x 31 x 17,5 mm
  • 1 x TE0790-03 XMOD FTDI JTAG adapter (compatible with AMD-Tools), pre-assembled on the carrier board
  • 1 x TE0790-03L XMOD FTDI JTAG adapter (independent from AMD-Tools), pre-assembled on the carrier board
  • 1 x 32 GB Class 10 UHS1 microSDHC incl. adapter
  • 1 x USB cable, Type A to Type B Mini, 2 meter length
  • 1 x power cable Schuko 1.8m black
  • 4 x Phillips screws, M3 x 6, pan head, zinc coated

Additional Information

All modules produced by Trenz Electronic are developed and manufactured in Germany.

The online pictures of this product are not a legally binding offer, but are symbol pictures for illustration and presentation only.

Related links to "Starter Kit with AMD Zynq™ UltraScale+™ ZU9EG-1E MPSoC module"
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Trenz_Electronic - Documents and Design files for Trenz Electronic Products