TEB0911 UltraRack+ MPSoC Board with Xilinx Zynq UltraScale+ ZU9,6 FMC Connectors

€3,274.00 (3,896.06 € gross) *

Prices plus VAT plus shipping costs

expected to be available on 24-Feb-2023

  • TEB0911-04-9BEX1MA
  • 0
  • Full production
Quantity Unit price
To 9 €3,274.00 (3,896.06 € gross) *
From 10 €2,946.60 (3,506.45 € gross) *
From 25 €2,782.90 (3,311.65 € gross) *
From 50 €2,619.20 (3,116.85 € gross) *
From 100 €2,455.50 (2,922.05 € gross) *
From 250 €2,291.80 (2,727.24 € gross) *
From 500 €2,128.10 (2,532.44 € gross) *
From 1000 €1,964.40 (2,337.64 € gross) *
Description Downloads Resources
The predecessor of this article is TEB0911-04-9BEX1FA . All changes are in the Product... more
Product information "TEB0911 UltraRack+ MPSoC Board with Xilinx Zynq UltraScale+ ZU9,6 FMC Connectors"

The predecessor of this article is TEB0911-04-9BEX1FA. All changes are in the Product Change Notification (PCN).

The Trenz Electronic TEB0911 UltraRack+ board is integrating a Xilinx Zynq UltraScale+ ZU9EG MPSoC with 2 x 64 MByte Flash memory for configuration and operation, 8 GByte DDR4-SDRAM SO-DIMM socket with 64-bit wide data bus, 22 MGT lanes and powerful switch-mode power supplies for all on-board voltages. The TEB0911 board exposes the pins of the Zynq MPSoC to accessible connectors and provides a whole range of on-board components to test and evaluate the Zynq UltraScale+ MPSoC and for developing purposes. The board is capable to be fitted to a enclosure, whereby on the enclosure's rear and front panel, I/O's, LVDS-pairs and MGT lanes are accessible through 6 on-board FMC connectors and other standard high-speed interfaces, namely USB3, SFP+, SSD, GbE, etc.

All parts are at least extended temperature range of 0°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

Key Features

  • Zynq UltraScale+ MPSoC XCZU9EG-1FFVB1156E
    • 1156 Pin Package
  • 8 GByte 64-Bit DDR4 SO-DIMM (PS connected)
  • Active heat sink (serial number 638088 and above)
  • M2 PCIe SSD (1-Lane)
  • 8 GByte e.MMC (bootable)
  • 2 x 64 MByte Dual QSPI Flash (bootable)
  • System Controller(LCMXO2-7000HC)
    • Power Sequencing
    • IO Expander
  • Configurable PLLs
  • GTH/GTP Reference CLKs

Front Panel

  • 4 x FMC
    • 4 GTH per FMC
    • 68 ZynqMP PL IO per FMC
  • DisplayPort (2-Lanes)
  • RJ34 ETH + Dual USB3 Combo
  • Dual Stack SFP+
  • SD (bootable)
  • Status LEDs

Back Panel

  • 2 x FMC
    • 4/2 GTH
    • 12 ZynqMP PL IO per FMC
  • 56 SC IO per FMC
  • CAN FD (DB9 Connector)
  • SMA (external CLK)
  • 5-pin 24 V power connector

Board size

  • 406 mm × 234.30 mm, please download the assembly diagram for exact details

Other assembly options for cost or performance optimization plus high volume prices available on request.

Development Support

Latest documentation, design support files and reference designs with source files are available for download free of charge.

Scope of Delivery

  • 1 x TEB0911-04-9BEX1MA Trenz Electronic UltraRack+ MPSoC board with Xilinx Zynq UltraScale+ ZU9EG
  • 1 x active heat sink, pre-assembled

Additional Information

All modules produced by Trenz Electronic are developed and manufactured in Germany.

Related links to "TEB0911 UltraRack+ MPSoC Board with Xilinx Zynq UltraScale+ ZU9,6 FMC Connectors"
Trenz_Electronic - Documents and Design files for Trenz Electronic Products