UltraSOM+ MPSoC Module with AMD Zynq™ UltraScale+™ ZU15EG-1E, 4 GByte DDR4

€1,469.00 (1,748.11 € gross) *

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  • TE0808-05-BBE21-A
  • 2
  • 22
  • Full production
Quantity Unit price
To 9 €1,469.00 (1,748.11 € gross) *
From 10 €1,322.10 (1,573.30 € gross) *
From 25 €1,322.10 (1,573.30 € gross) *
From 50 €1,175.20 (1,398.49 € gross) *
From 100 €1,101.75 (1,311.08 € gross) *
From 250 €1,101.75 (1,311.08 € gross) *
From 500 €984.23 (1,171.23 € gross) *
From 1000 €984.23 (1,171.23 € gross) *
Description Downloads Resources
The predecessor of this article is TE0808-04-BBE21-A . All changes are in the Product... more
Product information "UltraSOM+ MPSoC Module with AMD Zynq™ UltraScale+™ ZU15EG-1E, 4 GByte DDR4"

The predecessor of this article is TE0808-04-BBE21-A. All changes are in the Product Change Notification (PCN).

The successor of this article is TE0808-05-BBE21-E. All changes are in the Product Change Notification (PCN).

Note: Due to the new revision the height profile of the module has changed.
Using TE0808-05 board as a replacement or in system(s) designed for TE0808-04, a review and adaption of mechanics e.g. cooling solutions must be implemented.

This module will not be discontinued, but we recommend the TE0818 module series with an improved connector for new projects.

The Trenz Electronic TE0808-05-BBE21-A is a MPSoC module integrating a AMD/Xilinx Zynq™ UltraScale+™ ZU15EG, 4 GByte DDR4 SDRAM, 128 MByte Flash memory for configuration and operation, 20 x high speed serial transceivers, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections.

All this on a tiny footprint of 5.2 x 7.6 cm at the most competitive price. These high-density integrated modules are smaller than a credit card and available in several variants.

All parts are at least extended temperature range of 0°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

Key Features

  • AMD/Xilinx Zynq™ UltraScale+™ XCZU15EG-1FFVC900E
  • ZU15EG 900 Pin Packages
  • 3 mm mounting holes for skyline heat spreader
  • Size: 52 x 76 mm
  • B2B Connectors: 4 x 160 pin
  • Rugged for shock and high vibration
  • 4 GByte 64-Bit DDR4 SDRAM
  • 128 MByte SPI Boot Flash (dual parallel)
  • User I/Os
    • 65 x PS MIOs, 48 x PL HD GPIOs, 156 x PL HP GIPIOs (3 banks)
    • Serial transceivers: 4 x PS-GTR, 16 x PL-GTH
    • Transceiver clocks inputs and outputs
    • PLL clock generator inputs and outputs
  • All power supplies on board, single 3.3V Power required
    • 14 on-board DC/DC regulators and 13 LDOs
    • LP, FP, PL separately controlled power domains
  • Support for all boot modes (except NAND) and scenarios
  • Support for any combination of PS connected peripherals
  • Evenly spread supply pins for good signal integrity

Other assembly options for cost or performance optimization plus high volume prices available on request.

Development Support

There is a base board available for this module.

Latest documentation, design support files and reference designs with source files are available for download free of charge.

Scope of Delivery

  • 1 x TE0808-05-BBE21-A Trenz Electronic MPSoC module with AMD/Xilinx Zynq™ UltraScale+™ ZU15EG

Additional Information

All modules produced by Trenz Electronic are developed and manufactured in Germany.

Related links to "UltraSOM+ MPSoC Module with AMD Zynq™ UltraScale+™ ZU15EG-1E, 4 GByte DDR4"
Trenz_Electronic - Documents and Design files for Trenz Electronic Products