MPSoC Module with AMD Zynq™ UltraScale+™ ZU3CG-1E, 2 GByte DDR4, 5.2 x 7.6 cm

€369.00 (439.11 € gross) *

Prices plus VAT plus shipping costs

expected to be available on 12-Feb-2025

  • TE0803-04-3AE11-A
  • 0
  • 20
  • Full production
Quantity Unit price
To 9 €369.00 (439.11 € gross) *
From 10 €332.10 (395.20 € gross) *
From 25 €332.10 (395.20 € gross) *
From 50 €295.20 (351.29 € gross) *
From 100 €276.75 (329.33 € gross) *
From 250 €276.75 (329.33 € gross) *
From 500 €247.23 (294.20 € gross) *
From 1000 €247.23 (294.20 € gross) *
Description Downloads Resources
The predecessor of this article is TE0803-03-3AE11-A . All changes are in the Product... more
Product information "MPSoC Module with AMD Zynq™ UltraScale+™ ZU3CG-1E, 2 GByte DDR4, 5.2 x 7.6 cm"

The predecessor of this article is TE0803-03-3AE11-A. All changes are in the Product Change Notification (PCN).

Note: Product modification for modules with a serial number greater than 732326. Product Change Notification (PCN).

This module will not be discontinued, but we recommend the TE0813 module series with an improved connector for new projects.

The Trenz Electronic TE0803-04-3AE11-A is an industrial-grade MPSoC module integrating a AMD/Xilinx Zynq™ UltraScale+™ with ZU3CG, 2 GByte DDR4 SDRAM, 128 MByte Flash memory for configuration and operation, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections.

All this on a tiny footprint of 5.2 x 7.6 cm at the most competitive price. These high-density integrated modules are smaller than a credit card and available in several variants.

All parts are at least extended temperature range of 0°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

Key Features

  • AMD/Xilinx Zynq™ UltraScale+™ XCZU3CG-1SFVC784E
  • ZU3CG, 784 Pin Packages
  • Dimensions: 5.2 x 7.6 cm
  • Plug-on module with 4 x 160 pin B2B connectors
  • Rugged for shock and high vibration
  • 3 mm mounting holes for skyline heat spreader
  • 2 GByte (64-bit) DDR4 SDRAM
  • 128 MByte QSPI Boot Flash dual parallel
  • 2 Kbit Serial EEPROM for MAC Address
  • 48 High-density (HD) I/O's (2 banks)
  • User I/O
    • 65 x multi-use I/O's (MIO)
    • 156 high-performance (HP) I/O's (3 banks)
    • Serial transceiver: 4 x PS-GTR
    • Programmable 4-channel PLL clock generator
  • All power supplies on board, single 3.3V power source required
  • Evenly spread supply pins for good signal integrity

Other assembly options for cost or performance optimization plus high volume prices available on request.

Recommended Software

Vivado ML Standard Edition (free version)

The Vivado ML Standard Edition is the FREE version of the Vivado design suite. Vivado ML Standard delivers instant access to some basic Vivado features and functionality at no cost.

Overview of all editions of Vivado ML

Development Support

There is a base board available for this module.

Latest documentation, design support files and reference designs with source files are available for download free of charge.

Scope of Delivery

  • 1 x TE0803-04-3AE11-A Trenz Electronic MPSoC module with AMD/Xilinx Zynq™ UltraScale+™ ZU3CG

Additional Information

All modules produced by Trenz Electronic are developed and manufactured in Germany.

The online pictures of this product are not a legally binding offer, but are symbol pictures for illustration and presentation only.

Related links to "MPSoC Module with AMD Zynq™ UltraScale+™ ZU3CG-1E, 2 GByte DDR4, 5.2 x 7.6 cm"
Downloads
Digilent
OHO-Elektronik
Sundance
Trenz_Electronic - Documents and Design files for Trenz Electronic Products
inrevium
reference