UltraSOM+ MPSoC Module with AMD Zynq™ UltraScale+™ ZU9EG-2I, 4 GByte DDR4

€1,469.00 (1,748.11 € gross) *

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  • TE0808-05-9GI21-A
  • 43
  • 22
  • Upgrade available
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To 9 €1,469.00 (1,748.11 € gross) *
From 10 €1,322.10 (1,573.30 € gross) *
From 25 €1,322.10 (1,573.30 € gross) *
From 50 €1,175.20 (1,398.49 € gross) *
From 100 €1,101.75 (1,311.08 € gross) *
From 250 €1,101.75 (1,311.08 € gross) *
From 500 €984.23 (1,171.23 € gross) *
From 1000 €984.23 (1,171.23 € gross) *
Description Downloads Resources
The predecessor of this article is TE0808-04-9GI21-A . All changes are in the Product... more
Product information "UltraSOM+ MPSoC Module with AMD Zynq™ UltraScale+™ ZU9EG-2I, 4 GByte DDR4"

The predecessor of this article is TE0808-04-9GI21-A. All changes are in the Product Change Notification (PCN).

The successor of this article is TE0808-05-9GI81-E. All changes are in the Product Change Notification (PCN).

Note: Due to the new revision the height profile of the module has changed.
Using TE0808-05 board as a replacement or in system(s) designed for TE0808-04, a review and adaption of mechanics e.g. cooling solutions must be implemented.
-------------------------

This module will not be discontinued, but we recommend the TE0818 module series with an improved connector for new projects.

The Trenz Electronic TE0808-05-9GI21-A is a MPSoC module integrating a AMD/Xilinx Zynq™ UltraScale+™ ZU9EG, 4 GByte DDR4 SDRAM, 128 MByte Flash memory for configuration and operation, 20 x high speed serial transceivers, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections. 

All this on a tiny footprint of 5.2 x 7.6 cm at the most competitive price. These high-density integrated modules are smaller than a credit card and available in several variants.

All parts are at least industrial temperature range of -40°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

Key Features

  • SoC / FPGA
    • Device: AMD Zynq™ UltraScale+™ XCZU9EG-2FFVC900I
    • Speedgrade: -2
    • Temperature range: Industrial
    • Package: FFVC900
    • Grafikprozessor-Unit (GPU)
  • RAM / Storage
    • 4 GByte DDR4 SDRAM
    • 2 x 64 MByte SPI Boot Flash (dual parallel)
    • 2 Kbit serial EEPROM with EUI-48 Node Identity
  • On Board
    • Oscillator
  • Interface
    • 4 x 160 pin B2B connectors (ST5)
      • 204 PL IO
        • HP: 156
        • HD: 48
      • 65 PS MIO

      • 4 PS GTR
      • 16 PL GTH
      • I2C, JTAG, CONFIG
    • 2 Transceiver clocks
    • PLL Clock Generator
    • LP, FP, PL separately controlled power domains
  • Power
    • 3.3 V power supply via B2B Connector needed
  • Dimension
    • 5.2 x 7.6 cm

Other assembly options for cost or performance optimization plus high volume prices available on request.

Development Support

There is a base board available for this module.

Latest documentation, design support files and reference designs with source files are available for download free of charge.

Scope of Delivery

  • 1 x TE0808-05-9GI21-A Trenz Electronic MPSoC module with AMD/Xilinx Zynq™ UltraScale+™ ZU9EG

Additional Information

All modules produced by Trenz Electronic are developed and manufactured in Germany.

Related links to "UltraSOM+ MPSoC Module with AMD Zynq™ UltraScale+™ ZU9EG-2I, 4 GByte DDR4"
Downloads
Digilent
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Trenz_Electronic - Documents and Design files for Trenz Electronic Products
inrevium
reference